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Meizu Pro 6 Teaser Hints No Heating Issues With Helio x25

by Suhaib 921 views1

Meizu, the popular device maker from China, is going to hold a press conference in Beijing on Wednesday, April 13 to announce the launch of its much-anticipated flagship smartphone Meizu Pro 6. Meizu has previously released two teasers promoting the efficient fast charging technology and camera on this upcoming smartphone.

pro 6

Meizu Pro 6 is purported to feature a compact 5.2 inch Full HD display. It will be powered by 64-bit Helio X25 deca-core chipset. There will be different memory versions of this smartphone including 3GB RAM with 32GB native storage and 4GB RAM with 64GB native storage.

Continuing the hype, Meizu has released another teaser for this smartphone which states that Pro 6 will come with fastest CPU clocking speeds or CPU time. Technically higher clocking speeds lead to heating issues which can spoil all the fun. The latest teaser says “Companies promote their fast CPU speeds but they do not tell you about its heating issues.”

In the past, there were heating issues with Snapdragon 810 chipset but it is mentioned that with Helio X25, there are no such issues. So it will be worth watching what Meizu has done to counter the heating effects of the CPU cores clocking higher speeds.

 

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  • Upgrade

    X25 upgrade is pretty similar to Kirin 955. X25 is 20nm, yet Kirin 955 is 16nm.

    Helio X30, if it really goes 10nm.. it will become much better in every aspect.