After keeping the news under wraps for quite long, Qualcomm is finally going to unveil the most awaited Snapdragon 820 SoC today. There have been wide speculations over the thermal performance of 820, owing to the poor performance shown by its predecessors especially Snapdragon 810.
Yesterday, Qualcomm’s marketing head announced on Twitter that the new Snapdragon 820 chip will perform efficiently and will satisfy the thermal requirements of the device manufacturers.
As far as Snapdragon 820 is concerned, it is believed to feature a dual cluster Quad core processor with custom CPU cores. It will come with Adreno 530 GPU for offering best in class graphic performance and will support dual channel LPDDR4 RAM. The Snapdragon 820 chip will come with a dedicated low power sensor hub for ‘always on’ use and will support CAT 10 LTE connectivity.
Earlier it was officially confirmed by Qualcomm that Snapdragon 820 is manufactured using the 14 nm FinFET non-planar node technology, which led to quick guesses that this chip is going to be built by Samsung. For Qualcomm, there’s a lot riding on this new chipset as it’s earlier SoC Snapdragon 810 was marred by overheating issues.
True processing capabilities and thermal performance of this new chipset can be tested once the device incorporating the new chip comes out.