Samsung is now restarting the development of its 1.4nm process technology (codenamed SF 1.4), The Bell reported. However, the mass production target has been pushed back to 2029, originally planned for 2027.

TSMC and Intel are currently leading the development of 1.4nm-class foundry technologies. While both are designated as 1.4nm products, each process technology is fundamentally different from the other. TSMC’s 1.4nm node is called A14, and Intel refers to its 1.4nm-class node as Intel 14A.

Samsung is looking to narrow the gap with its rivals as it has reportedly asked its equipment suppliers, including Applied Materials and Lam Research, to begin early development on the equipment for the SF 1.4 process. Both are key equipment partners, with their tools used across the company’s foundry and memory processes. The first set of tools will be delivered to NRD-K, which is Samsung’s cutting-edge R&D center for semiconductors.

Samsung’s 1.4nm tech was originally planned to enter mass production next year, but the company later adjusted it to 2029 to strengthen its 2nm processes, such as SF2 and SF2P. Not only did the company achieve high yields in its 2nm process, but it also secured orders for Tesla’s next-generation AI chips. Having achieved that, Samsung is now moving forward with the preparations for its 1.4 process.

ASML has delivered its next-generation High NA Extreme Ultraviolet (EUV) to Samsung’s NRD-K. It will reportedly be used on select layers starting with the 1.4nm process. Samsung has also requested orders for equipment to develop its next-generation V12 NAND, which is expected to enter full-scale mass production around 2030.

Samsung’s rivals, Intel and TSMC, are ahead in the 1.4nm race. Intel plans to begin mass production of 1.4nm chips in 2027, while TSMC is eyeing full-scale production in 2028. That puts Samsung a year or two behind its rivals, but the South Korean giant has an advantage over TSMC since the latter isn’t using high-NA EUV tools just yet.

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