At the ongoing Mobile World Congress, Qualcomm has announced its latest next-generation modem for smartphones –Qualcomm Snapdragon X70 5G. It comes with increased uplink and downlink speed as well as new features.

While not yet confirmed by the company, it is likely that Qualcomm will use this new model for the upcoming Snapdragon 8 Gen 2 chipset that is expected to go official this year.

The company says that the Snapdragon X70 can offer up to 10Gbps downlink speed and a peak 3.5Gbps upload speed, ensuring maximum performance. Do note that the real-world performance won’t be what the company is saying.

A major highlight for this new modem is that it uses artificial intelligence (AI) technology which improves the mmWave and sub-6GHz bands. It has an AI-based channel-state feedback and optimization algorithm to increase the average downlink and uplink speeds.

It uses AI-based mmWave beam management to increase the coverage and then uses an AI-based network selection algorithm. This latest baseband chip is also the first to support every commercial 5G band from 500MHz to 41GHz.

The Qualcomm Snapdragon X70 has support for global 5G multi-SIM and Dual-SIM Dual Active. The company claims that it is up to 60 percent more power-efficient, thanks to Qualcomm 5G PowerSave Gen 3 technology.

Qualcomm’s QET7100 Wideband Envelope Tracking and AI-based adaptive antenna tuning will also help in power conservation along with optimizing performance and latency. The company has revealed that the Snapdragon X70 modem is expected to launch in 5G devices by the end of this year.

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Soon after Qualcomm announced its latest flagship mobile chipset — Snapdragon 855 — with support for 5G connectivity, its rival MediaTek has now officially announced the MediaTek Helio M70 5G baseband chipset in China, which was first announced in Taiwan earlier this year.

The MediaTek Helio M70 is a multimode chipset with support for 2G/3G/4G/5G-enabled connectivity. It supports 5G radio (NR), along with the standalone (SA) and non-standalone (NSA) network architectures, the sub-6GHz frequency band, high power user equipment (HPUE), and other key 5G technologies.

The company says that the chipset is designed in compliance with the 3GPP Rel-15 new specifications with 5 Gbps data rate, leading the industry to support carrier aggregation. TL Lee, General Manager of MediaTek Wireless Communications Division, said:

MediaTek is committed to promoting the adoption of the latest technologies. With the commercialization of the first 5G baseband chipset, Helio M70, consumers will be able to enjoy the exciting 5G experience from a mature and complete solution. In the future, 5G and AI application areas will continue to grow, enhancing the connected experience for users in areas such as mobile phones or smart living.

The chipset aims to deliver an improved experience for customers and end users. For this, the MediaTek Helio M70 baseband chipset supports LTE and 5G dual connectivity (EN-DC) and ensures that the mobile devices are backward compatible with 4G/3G/2G in the absence of 5G networks.

According to MediaTek, the Helio M70 is able to design a 5G terminal device with a slim design advantage, helping manufacturers to design smaller, lower power mobile devices. MediaTek has announced that the Helio M70 baseband chipset is now available and is expected to ship in devices in the second half of 2019.

Read More: MediaTek Helio P90 flagship chipset with “groundbreaking AI” is reportedly launching on December 13th

Being a member of the “5G Device Forerunner Initiative”, MediaTek’s 5G solutions will be powering industry partners to drive forward the development of 5G devices. For the development of 5G technology, the company collaborated with industry leaders including China Mobile, Huawei, Nokia, NTT DOCOMO, and others to establish a 5G industry ecosystem.

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