MediaTek has been launching new 5G chipsets for smartphones under its Dimensity lineup at regular intervals. Now, the company has announced a new chipset for 5G smartphones — MediaTek Dimensity 1000C in the United States.

This newly launched chipset will be powering the LG Velvet smartphone in the U.S. on T-Mobile’s nationwide 5G network. The company says that the chipset delivers advanced AI capabilities, enhanced display features, fast connectivity, and improved multimedia capabilities for a premium user experience.

The Dimensity 1000C is manufactured using a 7nm process node and features four Arm-Cortex-A77 CPU cores and four power-efficient Arm Cortex-A55 cores operating up to 2GHz, with a large, low-latency communal cache that improves performance and power-efficiency even further.

EDITOR’S PICK: Tencent is working to ensure continued availability of its apps and games in India

The company adds that it has ensured avid gamers have powerful graphics at their fingertips. There’s also the MediaTek AI processing unit (APU 3.0) that combines three different types of AI processors for AI-camera, AI-assistant, and in-app and OS-enhancements for superior experiences.

It also comes with support for AV1 HDR on Netflix and AV1 video streaming on YouTube. MediaTek says that it is working with Twitch to bring AV1 video streaming to mobile. Along with Dual Display and Dual Voice Wake Up support, it also has advanced camera support.

With this launch, Dimensity 1000C has become the third variant in the series which already has Dimensity 1000 and 1000+ SoCs. Apart from Dimensity 1000, MediaTek also has Dimensity 800 and Dimensity 700 series 5G chipsets.

UP NEXT: TCL announces NXTPAPER display technology for paper-like color display at IFA 2020

The post MediaTek Dimensity 1000C 5G chipset announced in the United States appeared first on Gizmochina.

MediaTek has launched a few chipsets under its Dimensty lineup of 5G SoCs. Today, the company has announced yet another chipset which is aimed towards mid-range smartphones — MediaTek Dimensity 720.

The chipset is slotted just below the Dimensity 800 and the flagship chipset in the lineup Dimensity 1000 and 1000+. It seems that MediaTek doesn’t want to leave any stones unturned and launch a chipset for every possible price range, similar to Qualcomm.

The MediaTek Dimensity 720 is manufactured using TSMC‘s 7nm process. It comes with an integrated 5G modem that supports 2CC carrier aggregation, VoNR, 5G/4G Dual SIM dual standby, and sub-6GHz 5G.

It also has MediaTek 5G UltraSave technology which uses both network and content awareness intelligence to manage the modem’s operating mode in real-time to further extend the battery life.

The chipset packs two ARM Cortex-A76 big cores operating at 2GHz in the octa-core CPU, which the company claims to improve the responsiveness of applications for fluid user experience. It also packs an ARM Mali G57 GPU, up to 12GB fast LPDDR4X memory and UFS 2.2 storage for fast read/write speeds.

EDITOR’S PICK: Samsung announces plans for 6G technology; launch expected by the end of this Decade

This new Dimensity 720 SoC has support for 90Hz high frame-rate displays along with enhanced video streaming capabilities like MiraVision HDR10+ with support for Dynamic Range Remapping.

As for the camera configuration, it supports up to 64-megapixel single sensor or a dual-camera setup consisting of a 20-megapixel and 16-megapixel sensors. It packs a range of AI-related features that are powered by MediaTek’s integrated APU.

To minimize the power consumption of always-on voice assistants, the company has included a feature called Voice Wakeup (VoW). It also supports dual-mic noise suppression so that voice assistant can hear the audio more clearly.

With the launch of Dimensity 800-series and Dimensity 1000-series, the company was focused on gaming-related features as well, which doesn’t seem to be the case for this Dimensity 720. The focus of this new chipset seems to be global sub-6GHz 5G support.

The company has confirmed that the MediaTek Dimensity 720 chipset will be powering the mid-range smartphones in regions like North America, Europe, and Asia. However, the company has not provided any timeline for the launch of devices powered by this SoC.

UP NEXT: Alleged Huawei Enjoy 20’s full specifications leaked on TENAA; Could be the cheapest 5G phone from Huawei

The post MediaTek launches Dimensity 720 5G chipset for mid-range smartphones appeared first on Gizmochina.

Ever since the US-China trade war began, there have been several major developments in technology, especially those related to smartphones. The ban on Huawei by the United States and the constant lobbying with other countries to do the same, led to several Chinese companies, including Huawei, to become self-reliant.

Now, it seems that China has started a process using which it could become the leader in 5G chipmaking. The Suzhou Institute of Nano-tech and Nano-Bionics under the Chinese Academy of Sciences (Sinano), and the National Center for Nanoscience and Technology, have made important discoveries related to ultra-high precision laser lithography.

For those who are unaware, lithography machines play quite a crucial role in the production of chips as they etch patterns on wafers for placing transistors. One of the biggest breakthroughs has been EUV that creates extremely thin markings.

However, the discovery is still at the theoretical state and it could take years as well as plenty of money to make this a reality. Compared to others, China is still behind when it comes to manufacturing chipsets, which is often outsourced to the likes of TSMC.

EDITOR’S PICK: World’s First 120W fast charging unveiled by iQOO; First 120W iQOO phone could be coming in August

Nonetheless, the discovery of a new process laser lithography by China is a major step forward for the country. ASML, which is the global leader in lithography and holds a monopoly in the market, was recently blocked by the Dutch government from selling its machines to the Chinese customers, after pressure from the United States.

China’s largest foundry — SMIC — still produces chipsets on a 14nm node process while most of the latest chipsets are being manufactured on 5nm node, including the upcoming Apple A14 and Huawei’s next-gen Kirin SoC.

But if the development regarding chip manufacturing in China keeps going at a rapid pace, combined with proper investments, SMIC and similar companies in China could soon start using the latest technology for making chips. This will present an advantage to China and the smartphone makers in the country such as Huawei. In fact, SMIC is reportedly planning to raise $2.8 billion in Shanghai’s Star Market for its growth.

UP NEXT: Vivo X50 series flagship smartphones confirmed to launch in India on July 16

(Source)

The post China discovers new laser lithography technology that could help become the leading 5G chipmaker appeared first on Gizmochina.

As the world is seeing growth in 5G infrastructure deployment, smartphone manufacturers seems to have made 5G connectivity a standard feature on most of the new mid-range and premium smartphones.

While the market for 5G chipset for mobiles is mostly dominated by Qualcomm, MediaTek, Huawei, and Samsung, another company from China has joined the list of suppliers for 5G chipsets for the mid-range devices — UNISOC.

As per the reports, China-based chipset maker UNISOC is taking a leap into the mid-range 5G chipset market after the company provided the T7510 SoC for HiSense F50 5G smartphone in China.

EDITOR’S PICK: 5G chips capture 2% market share in 2019, Qualcomm and HiSilicon are major contributors: Report

The UNISOC T7520 is touted to be one of the world’s first chips to be made using TSMC’s 6 nm process technology using extreme ultraviolet lithography (EUVL). It packs four high-performance Arm Cortex-A76 cores, four energy-efficient Arm Cortex-A55 cores, and Arm Mali-G57 GPU.

It also comes with a new NPU that is said to offer 50 percent higher TOPS-per-Watt rate than the company’s previous-generation NPU. It features a four-core ISP that supports up to 100MP sensors and multi-camera processing capability. It also supports 5G NR TDD+FDD carrier aggregation, and is designed to offer peak uplink speed of 3.25 Gbps.

The pricing for the 5G chipsets are currently on the higher side and thus the pricing of 5G smartphones are also not as aggressive as what we’ve seen some of the companies offer on their phones. However, with more competition in the chipset market, we expect the pricing to go down soon.

Qualcomm and MediaTek are the leading suppliers for the 5G SoC in the market for mid-range devices. Huawei has also recently launched its mid-range chipset Kirin 820 with 5G support but it’ll most likely be limited to Huawei and Honor phones. Samsung doesn’t have a good presence in the Chinese market but the company has started supplying its Exynos chipset to other brands, like Vivo.

UP NEXT: Xiaomi will reportedly launch an ultra-cheap 999 Yuan (~$141) 5G smartphone by the end of this year

(Via)

The post UNISOC is making gains in the Chinese 5G market with its T7510 chipset appeared first on Gizmochina.

According to a new report from a renowned analyst, MediaTek stands to lose out on profits and its 5G chip orders. The reason for this is its primary competitor, Qualcomm, slashing the Snapdragon 765 prices.

Ming Chi Kuo’s report suggests Qualcomm is rethinking its pricing for the mid range 5G chipset after the demand for high end 5G smartphones fell short on expectations. Furthermore, the aggressive pricing policy will aso extend to its low-end offerings in the second half of 2020. Hence, MediaTek faces stiff competition in every category about 3 to 6 months earlier than predicted for its Dimensity lineup of 5G chipsets.

As it stands right now, MediaTek’s pricing strategy isn’t as lucrative as Qualcomm’s which could see a gross profit margin of 5G processors being lower than 30 to even 35 percent. The report from Ming Chi Kuo also indicates that after high end 5G smartphone demand turned out to be lower than expected; Qualcomm reduced the price of its Snapdragon 765 5G chipset by about 30 percent to about $40. This is a more affordable alternative to MediaTek’s Dimensity 1000L SoC that costs about $60 to $70 (manufacturing cost being around $45 to $50).

Editor’s Pick: Xiaomi launches Smartmi Air Conditioner A for 2299 Yuan ($333), beats current energy efficiency standards

The figures clearly state that Qualcomm’s new pricing strategy undercuts the MediaTek’s entire market of offering 5G processors at affordable rates. Currently, MediaTek had received orders for about 20 to 25 million chips from various smartphone OEMs like Oppo, Vivo, and Xiaomi. These orders were supposed to start shipping by February 2020; Thus, the new pricing might disrupt the large scale order MediaTek had received which is predicted to shift towards Qualcomm.

The Snapdragon 865 with X55 5G modem has not had its price of $120 to $130 changed. Since it outperforms MediaTek’s Dimensity 1000 SoC. Notably, Dimesity 1000L technically outperforms the Snapdragon 765, although only noticeable during heavy gaming. Lastly, the report also details that the greatest threat is faced by Dimensity 800 SoC. This low end 5G chipset was expected to be released in May 2020 for $40 to $45 (manufacturing cost being around $30 to $35).

Thus, the report states that the competition has arrived 3 to 6 months earlier. It is also expected that Qualcomm will follow the aggressive pricing strategy to avoid a further decline in overall profits.

UP NEXT: How to get Google Stadia on any Android Phone with Xtadia Xposed Module?(Root)

(Via)

The post Qualcomm slashing Snapdragon 765 prices will affect MediaTek 5G chips orders: Ming Chi Kuo appeared first on Gizmochina.

Qualcomm has recently officially unveiled its flagship chipset, the Snapdragon 865 SoC, alongside its mid-range Snapdragon 765G/ 765 processor which are manufactured using TSMC 7nm and Samsung’s 8nm processes. But questions arise as to why Qualcomm used two different processes and why the SD865 chip didn’t feature an integrated 5G modem, unlike the SD765G. And with the availability of EUV methods, why did the chipmaking company not utilize the new technology?

Keith Kressin, Senior Vice President of Product Management at Qualcomm, answered these questions in an interview. He stated that for each distinct chip many factors are taken into account. It includes technical parameters and commercial considerations such as power consumption, package size, wafer availability, speed of production and supply chain diversity.

From a technical standpoint, the performance between the processes produces similar power consumption and performance results; and with the shipments planned for the Snapdragon 865 and 765 being very large, commercial considerations were taken to ensure adequacy and diversity of supply. In other words, both Samsung and TSMC processes were used due to commercial constraints but, rest assured, deliver similar performance.

Editor’s Pick: Redmi K30 Pro powered by SD865 SoC to reportedly launch in March 2020

Kressin also went on to address why Snapdragon 865 doesn’t utilize the second-generation 7nm EUV (Extreme Ultraviolet Lithography) technology. He stated that even if the new processing method is more efficient with production times, it does not have any real material impact on the end-user experience. For consumers, the most important aspect will always be power consumption and performance which will still be delivered regardless of production time. Furthermore, there is still some time before Qualcomm shifts to the new method to save time on production and processing.

Lastly, unlike the Snapdragon 765, the flagship SD865 is bundled with the X55 5G Modem while the former has an integrated X52 5G Modem. Although an integrated modem saves on battery life and space, the X55 modem on the SD865 improves on space consumption and power limitations without sacrificing power. In simpler terms, Qualcomm did not integrate a 5G modem in the SoC so it could provide the newer and faster X55 platform (which also does not suffer from issues related to non-integrated modems.)

UP NEXT: Redmibook live images reveal thin and lightweight design

(Source)

The post Executive explains why Snapdragon 865 skips integrated 5G modem and 7nm EUV manufacturing process appeared first on Gizmochina.

According to a new report, MediaTek might be supplying Samsung with 5G chipsets for its low-end range of smartphones in the near future. The former has already formed partnerships with various other brands like Oppo, Vivo, and Xiaomi and may now also supply the South Korean tech giant for its affordable range of smartphones.

MediaTek has just recently launched its Dimensity 1000 which is a high-end 5G SoC. It will be seen in various smartphones from the aforementioned brands in 2020. Alongside this, the company has also announced two mid-range 5G SoC with designated model numbers MT6885 and MT6873 which may soon be found in Samsung’s low-end handsets as well. Notably, MediaTek chipsets are also expected to be featured in Huawei’s affordable lineup of smartphones in 2020.

Reportedly, Samsung is currently in contact with MediaTek for the introduction of mainstream and affordable 5G smartphone chips in the Samsung Galaxy A series and other low-end models. With two of the most popular smartphone brands partnering up with MediaTek, the shipments of the company’s new 5G SoC are expected to reach record-breaking levels.

Editor’s Pick: Samsung’s Galaxy S11 & Fold 2020 to feature 108MP camera with 5x Optical Zoom: Report

Furthermore, Samsung has closed its ODM (Original Design Manufacturer) factory in Mainland China and is seeking to outsource low to medium segment devices to others. This provides an opportunity for companies like MediaTek that can receive large sums of orders for Samsung’s affordable range of smartphones.

MediaTek is one of the leading companies for 5G networking in terms of mobile chipsets. Its latest modems also support most of the current global telecommunication operator’s specifications as well. This makes it a key player in the global markets for 5G bandwidths. Additionally, MediaTek is also developing a more advanced millimeter ware (mmWave) frequency band, which will be faster than current 5G solutions and is expected to arrive by 2021.

UP NEXT: Buy Ecomobl-M24X and Ecomobl-M20A Electric Off-Road Skateboards at Lowered Prices from Gearbest [Coupons]

(Via)

The post MediaTek may supply Samsung with 5G chips for low-end smartphones appeared first on Gizmochina.

The next phase of smartphone sales growth seems to be dependent on the new communications technology — 5G. Every major smartphone maker has either launched a 5G smartphone or is soon going to do so.

And it seems that the competition is not only about launching a 5G smartphone but also having an in-house chipset. If the teaser coming from Lenovo is anything to go by, then it seems that the company will soon launch a new 5G chipset.

Lenovo’s executive has taken to Weibo to tease the arrival of its upcoming 5G processor. Along with sharing the image, the post lists out the existing 5G mobile chipsets and adds “5G SoC released next week is full of flowers, but the real trump card is still on the way.”

This is surprising given that there were no leaks and reports hinting about this development. The teaser about Lenovo 5G chipset launching soon comes at a time when Oppo is also working on its own mobile chipset. It remains to be seen if the chipset from Lenovo is aimed at mid-range segment or the high-end one.

With the launch of their own chipsets, Lenovo and soon Oppo will join the list of brands having their own mobile processor, which currently includes Samsung, Huawei, Apple, and Xiaomi. Currently, almost every smartphone manufacturer is dependent on either Qualcomm or MediaTek for the chipset.

EDITOR’S PICK: OnePlus 7T had a fancy Metallic Gold color option which was Never Released (Image)

The teaser image shared by the company just reads “5G” and has the brand’s logo attached. Nothing much is revealed or known at this point in time about this upcoming chipset. But going by the teaser, it seems that the mobile processor could get launched next week.

It seems that the company will take the stage to announce the chipset while the launch of a smartphone powered by the same could happen next year. The announcement seems to have been timed perfectly. Qualcomm will be announcing its next-generation flagship Snapdragon chipset in the first week of December while MediaTek has just announced its own 5G chipset, entering the high-end segment.

Or maybe we’re reading too much between the lines and the company is just hinting at a new 5G smartphone which will be powered by the Qualcomm Snapdragon 865 SoC launching next week. This is more likely given that Lenovo was the first to launch SD855-powered smartphone — Lenovo Z5 Pro GT.

UP NEXT: MediaTek Dimensity 1000 5G marks its comeback into the high-end Chip market

The post Lenovo teases arrival of a new 5G product in the coming weeks appeared first on Gizmochina.

MediaTek has bet big on 5G and slowly but steadily we are seeing the fruits of its investment in the new generation network technology. Today, MediaTek has announced the Dimensity 1000 5G, its brand new high-end smartphone chipset that will take on the likes of Snapdragon 855 and Kirin 990 5G. In case you are wondering, this is the same MediaTek MT6885Z 5G chipset revealed a few months back. AnTuTu confirms Dimensity 1000 is the MT6889. Today, the Taiwanese chipmaker has revealed its official name and specifications.

MediaTek has made it clear that they mean business with the Dimensity 1000 5G chipset. The processor features four high-end Cortex-A77 based BIG cores clocked at 2.6GHz and four Cortex-A55 power-efficient cores clocked at 2.0GHz. Interestingly, this is a dual cluster arrangement instead of the tri-cluster arrangements that we’ve been seeing on high-end processors like Kirin 990, Snapdragon 855 and even Exynos 990. The new MediaTek chip comes with the new Mali-G77 MP9 GPU, which is the same one found on the Exynos 990 with a couple of cores less.

5G is one of the biggest highlights of the MediaTek Dimensity 1000 chipset. It comes with an integrated Helio M70 5G modem that saves space and is efficient at the same time. It is the world’s fastest throughput SoC with 4.7Gbps downlink and 2.5Gbps uplink speeds and supports both standalone and non-standalone networks (Sa/NSA). It also comes with multi-mode support so it supports all networks from 5G to 2G. Note that the Dimensity 1000 5G is a sub-6GHz chip and does not support the mmWave 5G networks that are used on a wide scale in countries like the U.S.

The new MediaTek 5G chip is also the world’s first SoC to support dual 5G SIMs. So you can use two 5G SIM cards in a phone powered by this processor. Existing 5G chipsets only support 5G in one SIM card slot.

Editor’s Pick: MediaTek announces a partnership with Intel to bring 5G to laptops

MediaTek Dimensity 1000 5G is also AI heavy, all thanks to its 5-core APU. This includes two heavy cores, three medium cores, and one light core. MediaTek claims that this design improves the efficiency of AI-related tasks. For example, simple tasks like facial recognition might use just the light core while power-hungry AI apps such as the camera can use the heavy cores. In terms of performance figures, the new chip boasts of 4.5 TOPS (trillion operations per second).

MediaTek’s new 5G chip comes with a capable 5-core ISP as well. It supports single cameras up to 80MP and dual camera setups featuring a 32MP and 16MP sensors. Another big highlight of this new chip is its support for HDR video. In fact, the Dimensity 1000 5G is the world’s first SoC to support multi-frame HDR video. It is also the first chip to support Google AV1 format up to 4K resolution at 60fps. The chip supports QHD+ displays with a 90Hz refresh rate and FHD+ displays with up to 120Hz refresh rate. The Dimensity 1000 5G supports Wi-Fi 6, BL 5.1, and Voice over New Radio (VoNR).

The first smartphones with Dimensity 1000 5G chipset will launch in Q1 2020 in markets like China & other Asian countries. US & EU will get the new chip powered devices in the second half of 2020.

UP NEXT: MediaTek 5G chip prices have risen by 20% but companies are willing to pay the premium

The post MediaTek Dimensity 1000 5G marks its comeback into the high-end Chip market appeared first on Gizmochina.

We’ve already reported that Taiwan-based MediaTek is currently working on 5G mobile chipset which will be made available next year. Now, MediaTek CEO Cai Lixing has recently revealed in an interview that smartphones powered by the company’s 5G SoC will get launched in the first quarter of next year.

This means that we’ll get the MediaTek 5G-powered smartphones somewhere between January 2020 to March 2020. Cai Lixing has also revealed that the company will be launching a mid-range and low-end 5G chipset to meet market demands.

We recently reported that MediaTek already has a 5G processor with a 5G modem built-in. The 7nm SoC supports multi-mode 5G and features the Helio M70 modem. The semiconductor manufacturer says the unnamed processor has Arm’s Cortex A77 CPU cores and Mali-G77 GPU cores. These are Arm’s latest and most powerful CPU and GPU cores which were announced back in May.

The chipset also has an in-house developed AI processing unit called the APU 3.0. A couple of months ago, it was reported that MediaTek’s 5G chipset will begin shipping to manufacturers this quarter. The report also revealed that manufacturers such as OPPO and Vivo have 5G phones planned for release.

EDITOR’S PICK: Vivo is reportedly planning to launch five 5G devices in 2020, focuses on mid-range market

The MediaTek Helio M70 modem is a multimode chipset with support for 2G/3G/4G/5G-enabled connectivity. It supports 5G radio (NR), along with the standalone (SA) and non-standalone (NSA) network architectures, the sub-6GHz frequency band, high power user equipment (HPUE), and other key 5G technologies.

MediaTek is a a member of the “5G Device Forerunner Initiative” and hopes that its 5G solutions will be powering industry partners to drive forward the development of 5G devices. For the development of 5G technology, the company collaborated with industry leaders including China Mobile, Huawei, Nokia, NTT DOCOMO, and others.

As per the reports, the company is expected to announce its first 5G mobile processor during its upcoming event MediaTek Summit on 26th November. It is also rumored that Redmi is working on a 5G smartphone powered by MediaTek’s chipset which isn’t surprising given that the Xiaomi sub-brand opted for Helio G90T chipset for its Redmi Note 8 Pro.

UP NEXT: MediaTek aims to ship 60 million 5G chips next year, targets Chinese OEMs

The post Smartphones powered by MediaTek 5G SoC will launch in Q1 2020 appeared first on Gizmochina.