MediaTek has announced two new processors today in Taiwan. The Dimensity 920 and Dimensity 810 chipsets are both 6nm octa-core processors with better performance and efficiency than their predecessors.

Dr. JC Hsu, the Corporate VP and GM of MediaTek’s Wireless Communications Business Unit, said that the new chipsets are designed to “provide device makers and smartphone users with the latest innovations at more accessible price points for the mainstream market.” The chipsets bring a boost in performance, display intelligence, and image brilliance.

Dimensity 920

The Dimensity 920 is a 6nm chip with four Cortex-A78 cores clocked at 2.5GHz and four Cortex-A55 Cores clocked at 2.0GHz. The GPU is the Mali-G68 which MediaTek claims has all of the technologies of the bigger G78 but is optimized for power-efficiency, thus extending battery life even further for gamers. According to the press release, the Dimensity 920 offers up to 9% faster gaming performance over the Dimensity 900.

The chipset can be paired with LPDDR5 and LPDDR4X memory and UFS 3.1 and UFS 2.2 storage. The Dimenity 900 also has Smart Adaptive Display support which allows it automatically adjust the refresh rate according to the game or UI action detected. The spec sheet also mentions it has a 4K video capture hardware engine and it can support up to four concurrent cameras and up to 108MP sensors.

For connectivity, the Dimensity 920 has Wi-Fi 6, Bluetooth 5.2, and 5G Call and Data Concurrency 3.0 that allows for 5G gaming on SIM 1 while receiving a call on SIM 2.

Dimensity 810

The 6nm Dimensity 810 sits below the 7nm Dimensity 820. It also has 8 cores made up of four Cortex-A76 cores clocked at 2.4GHz and four Cortex-A55 cores clocked at 2.0GHz. MediaTek claims that it brings a 20% increase in performance compared to the previous generation. The GPU is the Mali-G57 MC2.

The chipset supports 120Hz FHD+ displays, LPDDR4x RAM, UFS 2.2 (2-lane) storage, and up to 64MP cameras. The chipset also has high-end AI-camera features such as AI-Bokeh and AI-Color in collaboration with Arcsoft.

There is only Wi-Fi 5 and Bluetooth is version 5.1 and the peak download speed is 2.77Gbps for the modem,

The Dimensity 810 will appear in an OPPO phone soon according to a leak from last week. There is also a new Realme V-series phone coming soon that has been reported to be powered by the chipset.

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Qualcomm, MediaTek, and Unisoc have already placed orders with TSMC for their upcoming 5G mobile application processors. The orders are for the Taiwan Semiconductor Manufacturing Company’s 6nm process.

According to a paywalled report from DigiTimes, the various known chip makers have placed orders with the world’s largest contract chip manufacturer for its 6nm process. The report arrives from industry sources close to the matter. Unfortunately, finer details regarding these orders are currently unknown at the moment. Although, we had previously reported on TSMC securing orders from Qualcomm for its new chips that are set to launch in the second half of this year.

These orders were apparently for TSMC’s 5nm and 6nm processes, as per a tipster, and were for the American mobile chip maker’s mid to high range mobile processors. Furthermore, the news also arrives amid the semiconductor shortage that has affected various industries across the globe. This includes the automobile, consumer electronics, and even the smartphone industry as well.

In other words, the orders for 6nm process from Qualcomm, MediaTek, and Unisoc also implies that the fab makers are trying to make the most of the situation at hand with different options that are available at the moment. As of right now, TSMC is packed with orders for its advanced 5nm process, so it would make sense that firms would also place orders with other advanced process as well. Unfortunately, we have no way of confirming this news right now, so stay tuned for more as we will be providing updates when any notable information is available regarding this matter.

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Earlier today (13th May 2021), MediaTek officially announced the new Dimensity 900 5G chipset. The new mobile processor was the latest entry into the Dimensity lineup of 5G SoC and is built on a high-performance 6nm process node.

As per an official announcement, the new Dimensity 900 5G SoC arrives with support for Wi-Fi 6 standard, along with a 120Hz high refresh rate on FHD+ panels. Furthermore, the processor can also support 108-megapixel primary camera as well. According to Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit, “Dimensity 900 brings a suite of connectivity, display, and 4K HDR visual enhancements to high-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios.”

He further added that “The chipset’s support for 5G and Wi-Fi 6 ensures users get the most of out their devices with super-fast and reliable connectivity.” The Dimensity 900 chipset is also integrated with a 5G New Radio (NR) sub 6GHz modem with carrier aggregation and support for bandwidth up to 120MHz. The chip is an octa-core CPU, which consists of two ARM Cortex A78 processors that have a clock speed of up to 2.4GHz along with six ARM Cortex A55 cores that can reach up to 2GHz.

The MediaTek Dimensity 900 also supports LPDDR5 memory and UFS 3.1 storage as well and arrives with an integrated Arm Mali G68 MC4 graphics processing unit (GPU) and an independent AI processing unit (APU). Notably, the new AI processing unit in the chip is touted to be extremely power efficient and can support a wide variety of AI applications and 4K HDR as well.

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A new tip from a known Weibo leakster, a Chinese microblogging website, has revealed that TSMC has secured orders for the production of 5nm and 6nm chips from Qualcomm.

According to @数码闲聊站, the world’s largest contract chip maker, TSMC already has its 5nm and 6nm processes at maximum capacity, but Qualcomm has still managed to secure its orders with the firm. The tipster also added that new platforms made in these advanced processes will be launched within the second half of this year. These chips are expected to be a part of the American mobile chip maker’s mid to high segment processors for smartphones.

Notably, Qualcomm’s financial report also saw the company register earnings that were lower than what was previously estimated, which was due to Samsung‘s issues with production capacity. Thus, it would make sense that the firm would consider moving to TSMC over Samsung for its new orders. The news also arrives as TSMC is preparing to move to its latest 3nm processes.

The 3nm process would be the firm’s most advanced line and would be the first chip maker to make the shift to this process. Reportedly, trial production of this process is already progressing steadily, with risk production beginning sometime in March, while commercial production to follow soon. So stay tuned for more, as we will be providing updates when additional information is available regarding the matter.

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MediaTek is expected to announce a new chipset later this month, and while official details are scant, leaks have given us an early insight as to what to expect. Now, a fresh leak has provided more info such as the name of the chipset which is said to be called Dimensity 1200, among other details.

The upcoming processor is a 6nm chipset, a first for the manufacturer. The shift to a smaller node size should definitely bring an increase in performance and efficiency, and that it does according to Digital Chat Station.

The Chinese leaker revealed via a Weibo post that he has seen the specification sheet and from what he saw, it is a more powerful chipset than the Snapdragon 865. The increased performance is said to be (partly) due to having a higher frequency. This should mean that the chipset is clocked higher than the Snapdragon 865 whose clock speed is 2.84GHz.

EDITOR’S PICK: MediaTek becomes TSMC’s third-largest customer after a boom in mobile chip sales

The Dimensity 1000+ is clocked at 2.6GHz, and a leak already revealed that the Dimensity 1200 will have its prime A78 core clocked at 3.0GHz It will also have three A78 cores clocked at 2.6GHz, and four Cortex-A55 cores clocked at 2.0GHz.

Other details mentioned by the leaker reveal that CPU performance is not the only upgrade MediaTek’s new chipset has got. He also mentioned a better 5G modem and an improved Image Signal Processor (ISP) which should help phones capture better photos than the previous generation chipset.

We expect the Dimensity 1200 to appear in phones from Vivo, OPPO, realme, and iQOO after it is announced. We may even see the chipset power phones from Honor and Huawei.

UP NEXT: After Qualcomm, Honor is now close to getting chipsets from MediaTek

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MediaTek, one of the most popular mobile chipmaker, has confirmed that it is hosting a launch event on 20th January where a new chipset under its Dimensity lineup will be announced. The company has set the theme of “Sensation” for the event where it will unveil new products with superior technology and upgraded experiences.

This seems to be in line with the previous leak from ‘Digital Chat Station’ that MediTek is likely to launch a new chipset, MT689x in mid-January, which will be the company’s first chipset to be manufactured using a 6nm process.

As per the reports, there are two new Dimensity chipsets coming, manufactured using 5nm or 6nm process. One of them is MT6893 which uses ARM Cortex-A78 core and the main core has the highest frequency of 3.0GHz.

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It could come with Mali G77 GPU for graphics processing. Reports also indicate that the upcoming MediaTek chipset will have the same design configuration as the Samsung Exynos 1080, which powers the newly launched Vivo X60 lineup.

For those who are unaware, the MediaTek Dimensity series of smartphone processors come with support for 5G communication technology. So far, the company has launched a few models in this lineup, ranging from budget to premium mid-range offerings.

Thanks to the booming sales, MediaTek became the third-largest customer of chip manufacturer TSMC. Recently, the company was also named as the leading vendor for smartphone chipsets in Q3 2020, dethroning Qualcomm.

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MediaTek is now the third largest customer of the world’s largest contract chipmaker, TSMC (Taiwan Semiconductor Manufacturing Company). The news arrives as the company sees a surge in demand for its mobile chipsets.

According to a ChinaTimes report, MediaTek has jumped to the third spot after seeing an increase in orders from major smartphone manufacturers like Oppo, Vivo, and Xiaomi. These orders mainly comprised of its latest 5G enabled processors that have seen a growth in popularity in the industry. Furthermore, it is expected that the shipments of MediaTek chips will reach around 80 to 90 million units within the first half of this year.

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This figure is around the same as the total annual shipment for 2020, marking a rise of 1.6 to 1.8 times in terms of annual shipments. At the moment, the company’s flagship 6nm 5G chipset, the Dimensity 1200 series, has reportedly begun, as per the report. Similarly, TSMC’s 7nm and 6nm processes are also projected to output 111,000 wafers in the first quarter of 2021. During this time, Apple would fully shift to the 5nm process for its Mac based and iPhone processors. The Cupertino based giant is also expected to use TSMC’s 5nm process for its upcoming graphics processing units as well in the future.

MediaTek is currently benefitting from the rise in popularity of 5G networking that has penetrated various industries. This includes the smartphone market, the PC industry, and even the wireless networking and the Internet of Things (IoT) field. Additionally, with Honor becoming independent from its former parent company Huawei, the chipmaker is also assessing on supplying the company with its 5G chips.

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At the MediaTek summit today, the manufacturer teased a new premium 5G processor that is expected to launch soon. The yet-to-be-named chipset will go against other flagship chipsets when it launches.

MediaTek also revealed key details about the chipset. For starters, it will be a 6nm processor that will be built by TSMC. It will also feature Arm Cortex-A78 cores clocked at 3.0GHz.

This chipset is most likely one of two reported to be coming soon by the Chinese leaker, Digital Chat Station. A little more than a week ago, he had revealed that the Taiwan-based company is developing 5nm and 6nm chipsets with cortex-A78 cores.

In a Weibo post today, the leaker also revealed that the 6nm processor has the model number MT689X and features the same CPU frequency and architecture as the Exynos 1080 which is scheduled to be announced at an event in China later this week.

MediaTek will announce the chipset before the end of the year and we may be lucky to see it appear on a phone this year too, most likely one from a Chinese company.

Alongside the Dimensity 700, MediaTek also announced two new processors designed for Chromebooks. There is the MT8192 which is a 7nm processor for mainstream devices and the 6nm MT8195 that is designed for premium models. Below are the specs for the processors:

MT8192

• 7nm
• 4x Cortex-A76 + 4x Cortex-A55
• APU 2.0 with up to 2.4 TOPS performance
• Mali-G57 five-core GPU
• LPDDR4X
• UFS 2.1 storage
• Support for WQHD displays with 60Hz refresh rates or FHD+ displays with up to 120Hz refresh rates
• Supports up to two displays simultaneously
• 4K HDR video decoding
• Support for PCI-Express Gen 3 and USB 3.2 Gen 1

MT8195

• 6nm TSMC
• 4x Cortex-A78 + 4x Cortex-A55
• APU 3.0 with up to 4 TOPs performance
• Mali-G57 five-core GPU
• Quad-channel 2133MHz LPDDR4X
• Supports up to three displays
• Dolby Vision 7.1 support
• Dedicated Audio Digital Signal Processor (DSP)
• AV1 hardware video accelerator
• 4K HDR video decoding
• Support for PCI-Express Gen 3 and USB 3.2 Gen 1

The MT8192 will appear in Chromebooks in the first quarter of 2021 while the MT9195 which will power premium Chromebooks, smart displays, and tablets will arrive later.

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MediaTek has had a pretty impressive year in the mobile and TV market. A new report says it plans to launch a new processor for affordable Chromebooks that will be similar to Apple’s upcoming Arm-based processors for MacBooks.

The news was reported first by the Taiwanese blog, TechNews. The senior VP and GM of MediaTek’s Smart Device Business Group revealed the info at the Taiwan Educational Digital Transformation conference organized by Acer, Google, MediaTek, and Quanta yesterday.

The company executive had reveled in a joint interview that MediaTek plans to launch a 6nm Arm chipset that will power Chromebooks next year. The Chromebook market has witnessed significant growth especially this year due to the pandemic that has forced several students to attend school remotely.

However, more manufacturers have prioritized making premium models that feature more powerful specs and command a higher price tag. MediaTek says it will announce a 6nm chipset called the MT8195 that will have powerful AI features, have Wi-Fi 6 and 5G connectivity. The processor will be manufactured by TSMC and will be similar to Apple’s Arm-based processors that will power its Arm MacBooks.

Apart from the aforementioned features of the processor, it will be cheaper to produce which should reduce the overall cost of the Chromebooks they will power.

UP NEXT: AnTuTu Benchmark August 2020: MediaTek and HiSilicon powered devices lead in the mid-range segment

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At a press conference held today, UNISOC announced its second-gen 5G chipset. The Tiger T7520 is its latest 5G SoC for mobile devices following the launch of the Tiger T7510 last year. This is also the first 6nm processor in the world.

The T7520 is built on a 6nm EUV process and we are pretty sure it is manufactured by TSMC. The processor has 8 cores ( 4x Cortex-A76 cores + 4x Cortex-A55 cores) but the clockspeed is unknown. There is a Mali G57 GPU onboard too. The switch to a 6nm node means the processor has an 18% improvement in the density of transistors and reduces power consumption by 8%.

The Tiger T7520 has a built-in 5G modem and UNISOC says that gives it the upper hand when it comes to power consumption compared to other processors paired with a separate 5G modem.

The processor uses an in-house modem that UNISOC claims is the world’s first 5G modem to support coverage enhancement. It supports NSA and SA networks as well as 2G, 3G, and 4G. It can reach uplink speeds of up to 3.25Gbps on SA networks. The chip also supports dual-SIM dual-5G and VoNR high-resolution audio and video calls.

There is a new generation NPU inside that brings improvement in performance and energy efficiency. The press release says the NPU in the Tiger T7520 increases power efficiency by more than 50% compared to the previous generation.

The processor supports displays with refresh rates up to 120Hz, 4K resolutions, and HDR10+. It features UNISOC’s 6th generation Vivimagic solution, a second-generation Full Dynamic Range technology, a dedicated AI accelerator, and a 4-core ISP with support for resolutions up to 100MP.

UNISOC is yet to disclose which manufacturers have signed up for the processor and when we should expect it to appear in devices.

UP NEXT: Hisense F50 5G phone launches with UNISOC T7510 chipset

(Source)

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Taiwan Semiconductor Manufacturing Company (TSMC), the largest contract chipset manufacturer, has revealed in its earnings conference call that the company is expecting that most of its 7nm “N7” process customers/clients will shift to 6nm “N6” process.

It further adds that the upcoming 6nm “N6” node uses the same design rules as the N7 node, which makes it a lot easier for customers to transition to the newer and denser node. If this prediction of the company comes true, then N6 could be on the path towards becoming another widely-utilized, long-serving process node for the company.

Announced last month, the new 6nm process provides a significant enhancement of its industry-leading 7nm technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with migration from N7-based designs.

The technology will leverage the capabilities of extreme ultraviolet (EUV) lithography gained from the N7+ technology. TSMC had recently unveiled its N7+ process which involves the incorporation of EUV on TSMC’s 7nm. The process will be used on Hisilicon Kirin 985 and is said to have entered risk production.

As per the company, the new 6nm process delivers 18% higher logic density over the 7nm process. The engineering resources needed to push this new process out to customers are also very limited, thus it will be a cost-effective upgrade. The benefits range from improvement in AI, consumer applications, networking, 5G infrastructure, GPU, and high-performance computing.

Read More: TSMC has reportedly started working on a new 5nm infrastructure for the Apple A14 chipset

TSMC’s partners have adopted both N7 and N7+ processes and the company is expecting the two technologies to contribute over 25 percent of its wafer revenue in 2019. Meanwhile, TSMC projects that most of its customers who use N7 today will migrate to N6 and then to N5 skipping the N7+.

(Via)

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