A recent report from Taiwan claims that Samsung’s supply chain partners and suppliers are preparing to develop vapor chamber cooling solutions for Samsung’s lineup of smartphones from 2022. Specifically, the vapor chamber cooling solution could be deployed in the Galaxy S22 scheduled for unveiling in 2022.

As smartphones become thinner and lightweight, with lots of internal components and features that ramp up the temperature of the devices while in operation, the need for robust cooling solutions cannot be glossed over. While throttling the smartphone processor is bound to reduce overall temperature, the flipside implies that the device will not operate optimally, performance-wise. Since device overheating is a serious operational challenge for smartphone manufacturers, it is always a priority to evolve solutions to the challenge that will provide smartphone peak performance while also extending battery life.

The vapor chamber cooling solution in smartphones has been deployed previously in some Samsung products like the Galaxy S20 and Galaxy Note 20. It seems to be a better cooling solution than the traditional method prevalent in most smartphones. The vacuum chamber approach entails placing a flat vacuum-sealed metal canister dissipating chamber within the smartphone that efficiently transforms the generated heat through a vaporization mechanism. The vapor chamber cooling solution effectively lowers the device temperature faster than a heat sink or even the graphite thermal pad used in some models.

With a more efficient cooling mechanism, you are guaranteed an optimal performance of the smartphone’s chipset even under situations that could ramp up the heat generation like gaming and other processor-intensive applications. Battery life is also optimized with a better cooling mechanism.

There has been no formal indication from Samsung about its plans to reintroduce the vapor chamber cooling solution to its 2022 lineup. So at best, this remains speculation for now.

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Samsung has officially confirmed today that it has completed the qualification of 8nm FinFET LPP (Low Power Plus) process and it is now ready for production. The company has also stated that the new technology consumes 10 percent less energy and uses 10 percent less space.

The 8nm LPP process by Samsung is designed for topnotch SoCs for smartphones, networks, servers, and cryptocurrency.  It will exist as the company’s most advanced process node before the arrival of its 7nm EUV (Extreme Ultra Violet) lithography technology that is expected to go official in 2018.

Samsung Electronics Vice President of Foundry Marketing, Ryan Lee has said that the company was able to finish the qualification process of 8nm LPP three months ahead of its schedule and it has begun its production. The 8nm LPP process technology is an upgrade over Samsung’s 10nm FinFET process that has been used to build Snapdragon 835 and Exynos 8895 chipsets. The 8nmm Snapdragon chipsets are expected to power flagship phones that will be arriving in 2018. Samsung will be reportedly shifting to 6nm and 5nm chipset manufacturing process in 2019.

Read More: Snapdragon 855 Rumors: Qualcomm Already Working on 7nm Chipset that is Codenamed as Hana V1.0

Taiwan Semiconductor Manufacturing Company (TSMC) is the market leader and Samsung’s major rival when it comes to manufacturing of chipsets. The Taiwanese firm is also gunning towards the development of 7nm technology, but Samsung’s 7nm EUV lithography technology is reportedly superior when it comes to yield rate and pricing.

The Apple A9 chipset was manufactured by TSMC and Samsung. However, the Cupertino company chose TSMC as the sole supplier for Apple A10 Fusion and the new Apple A11 Bionic chipsets. Qualcomm too is expected to strike a deal with TSMC in 2018.

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