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ZTE showcases new infrastructure to meet complex computing demands for ChatGPT-like models: MWC

Sean — Fri, 30 Jun 2023 15:21:11 +0000

ZTE Corporation recently held a showcase during the MWC event in Shanghai. During this conference, the company showcased cutting-edge technology and computing infrastructure that will back the growing computing demands for complex machine learning-based models like ChatGPT.

ZTE unveils new intelligent computing infrastructure at MWC

The Chinese telecommunications giant announced a new type of intelligent computing infrastructure at the 10th MWC event in Shanghai. This system was built specifically to meet the growing demands for complex computing models. These are typically large-scale models and also aim at generative AI-based businesses as well. With the explosive roll out of ChatGPT, there has been a massive digital transformation and advancement in AI technology.

ZTE’s infrastructure will seek to meet the requirements for these complex deep learning models that deal with massive data volumes and consume vast resources. Due to the vast growth of AI-based businesses, there has been a surge in demand for capable servers and the even storage market, which require high standards of stability, reliability, and performance. For this, ZTE has unveiled a new series of server solutions that support GPUs and liquid cooling.

Meaning, it supports large-scale applications despite running on exceptionally low power consumption. One of these new servers includes the R6500G5 GPU series that can house up to 20 GPUs. The company even plans to release a new R6900G5 GPU training server as well by the end of this year. Alongside these, ZTE will even offer options in the field of storage and networking to basically become an integrated solution provider of intelligent computing infrastructure.

Qualcomm Snapdragon 8cx Gen 3 announced for next-gen Windows on ARM devices

Jeet — Thu, 02 Dec 2021 02:37:29 +0000

Qualcomm has been announcing several new products at its annual Snapdragon Tech Summit and after unveiling the Snapdragon 8 Gen 1 chip for smartphones and Snapdragon G3x Gen 1 for gaming devices, the company has now taken the wraps off the Qualcomm Snapdragon 8cx Gen 3 computing platform.

As the name implies, the Snapdragon 8cx Gen 3 is a successor of the 8cx Gen 2 model that was launched last year. It is built using the 5nm process, a first for a chip made for Windows devices. The company has also promised an 85 percent improvement in CPU performance and 60 percent faster GPU performance.

For connectivity, the chipset offers support for Qualcomm’s Snapdragon X55, X62, and the X65 5G modems. To recap, the Snapdragon X65 offers peak download speeds of up to 10Gbps, Snapdragon X55 delivers up to 7.5Gbps speeds while the Snapdragon X62 offers up to 4.4Gbps speed.

It packs Qualcomm’s Spectra ISP, which promises better autofocus, auto-white balance, and auto-exposure for videoconferencing. It supports a single camera up to 24MP, along with up to 4 concurrent cameras, and also has support for 4K HDR video capture at 30fps, slow motion 720p video at 480fps.

The chip now supports UFS 3.1 storage which offers faster read and write speeds. There’s also Qualcomm Voice Suite, which has Qualcomm Noise and Echo Cancellation technology to cancel out unwanted background sounds.

The company is claiming that the chip supports “multi-day battery life” but it has not provided any more details related to this. Devices powered by Qualcomm Snapdragon 8cx Gen 3 are expected to launch in the first half of 2022.

Qualcomm is also working on its next-generation chips for Windows PC that are expected to be powering devices from 2023. Those chips are designed by Nuvia, a company that was acquired by Qualcomm for $1.4 billion earlier this year. The next-generation Nuvia designed chips launching in 2023 are aimed to compete against Apple’s M-series chips.

China’s Changxin set to produce first locally designed DRAM chip

Airyl Jaszly — Thu, 13 Jun 2019 09:27:48 +0000

Changxin Memory Technologies, previously known as Innotron Memory, and previously to that known as either Hefei Chang Xin or Heifei Rui-li IC Manufacturing, is said to be targeting 10k wpm DRAM production by the end of the year. Changxin will compete against chips giants Micron Technology and Samsung Electronics in a $1 billion per year market.

The Chinese company is taking steps to minimize its use of US technology thereby propels them to redesign its dynamic random access memory (DRAM) chips. The company is taking measures to avoid infringing patents and potentially falling victim to the U.S. pressures on China’s rising tech industry.

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While Changxin is determined in reducing their reliance on US technology, much of its production still reply on U.S. equipment and tool suppliers. By redesign its DRAM chips, the company is hoping that they will be safe against potential U.S. allegations of intellectual property theft.

While the output will still be small compared with the 1.3 million DRAM wafers a month currently produced globally, the start of production would still mark a major breakthrough for China as the country currently has no homemade DRAM chips, said Sean Yang, an analyst at market research company CINNO.

However, much like the world’s leading semiconductor manufacturers, Changxin still needs to use U.S. equipment from companies like Applied Materials, Lam Research, KLA-Tencor, materials from Dow Chemical and electronic design automation tool providers from Cadence and Synopsys. For more news, stay around on Gizmochina.com.

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