Coolpad and LeEco recently announced the Cool1 Dual smartphone aimed at the mid-range segment. Now, it looks like the collaboration is back with a new Cool device, as it recently passed through the network certification website TENAA.

From the design of this new smartphone, it looks like a variant of the Le Pro 3 that was announced by LeEco a while back. The back texture seems to be a bit different and the writing near the bottom now features Cool’s logo as well as ‘LeEco Inside’ tagline. Rest of the design is exactly the same as the Le Pro 3. The website reveals that there will be different color options like gold, white, silver, blue, black etc.

As for the specs, the new Cool smartphone will feature a 5.5-inch 1080p display with Snapdragon 821 (2.35GHz) inside and 4GB / 6GB RAM options. There will be three storage variants, namely 32GB, 64GB, and 128GB. Further, like the Le Pro 3, this new phone also features a large 4000mAh battery.

For camera, the phone will have a 16MP sensor at the back and an 8MP sensor up front. As for the software, it is running on Android 6.0.1.

There are no further details available about this device, but given that it has passed through TENAA, we can expect more info in the coming days. It will be interesting to see how different this Coolpad + LeEco flagship will turn out to be as compared to the Le Pro 3.

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Coolpad and LeEco just announced the brand new Cool1 flagship. The phone comes with dual cameras at the back, joining the likes of Redmi Pro, Huawei P9, V8 and Honor 8 flagships. The Cool1 specs are quite powerful featuring Snapdragon 652 octa-core chip inside, which is one of the best mid-ranger chipsets in the market today. There are three memory variants of the phone, one with 3GB RAM and 32GB storage, another with 4GB RAM and 32GB storage and the top-end version with 4GB RAM and 64GB storage. The pricing is also pretty aggressive, with the standard model starting at 1099 Yuan ($167), mid-range variant at 1499 Yuan ($226) and the top-end model at 1699 Yuan ($256).

Here are the full Cool1 specs listed down below.

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The past few days have been busy for LeEco and Coolpad alike as these two companies, for the first time, were all set to release a smartphone in collaboration, called the Cool1 Dual. Now, this particular flagship device has just become official, revealing its powerful specs and cheap pricing. Looks like the consumers are going to benefit to a great extent with this new collaboration.

The Cool1 Dual flagship is made out of magnesium alloy and undergoes anodic oxidization, CNC edge processing, CCD precision machining and a number of other processes to ensure that you end up with a premium metal body. Looks wise, the phone seems to be inspired from the previous LeEco offerings in the market. At the bottom, you get dual speakers as well as USB Type-C port along with a microphone opening. The back features a dual camera setup, a first for LeEco as well as Coolpad, along with a fingerprint ID sensor. The dimensions are as follows: 152 x 74.8 x 8.2mm and the phone weighs 173 grams.

Before we take a look at the highlight of the LeEco Cool1, i.e. the dual camera module at the back, let’s see the other specs of the device. The Cool1 flagship comes with a capable Snapdragon 652 octa-core chip clocked at 1.8GHz with three memory variants: 3GB + 32GB, 4GB + 32GB and 4GB + 64GB. There will be a 5.5-inch 1080p display on board.

Like the rival Redmi Pro, LeEco and Coolpad have played it smart by incorporating a very large 4060mAh battery on board. This large battery can reportedly also be used for reverse charging via the USB Type-C port. Other features of the Cool1 include universal remote function, fingerprint sensor located at the back, dual SIM dual standby with entire network support, 4G+ and EUI OS. Unfortunately, there’s no NFC.

Now coming to the important part, the cameras. The Cool1 Dual will come with a dual camera module at the back. However, the company claims that the module used inside its new device is using second generation dual camera technology, i.e. Dual Camera 2.0. The first generation dual camera tech used one regular camera sensor along with a depth of field sensor as a secondary camera, like in the case of the HTC M8 and the Redmi Pro. However, in the new generation dual camera 2.0, the Cool1 comes with one black and white camera sensor and a color sensor, whose information are clubbed together to take better-looking photos. This means that Huawei phones like the P9 and V8 are using dual camera 2.0 technology.

The company further adds that using the dual camera 2.0 technology on the Cool1, the phone can enhance the overall image clarity by 20%, reduce noise by 8% and increase brightness by 20%. So, this should mean that the phone will take better low light images as compared to a traditional single camera module. Other features of the module include 6P lens, a number of filter support and stand alone black and white mode.

On the front, the phone comes with a regular 8MP shooter.

Now, coming to the pricing of the three variants, the 3GB RAM + 32GB ROM model starts at 1099 Yuan ($167), the 4GB RAM + 32GB ROM model will retail at 1499 Yuan ($226) and the 4GB RAM + 64GB ROM version will retail at 1699 Yuan ($256). There’s also a Huachen special edition model with only 2000 units available.

The phone will be up for reservations starting today at 6PM and will go on sale at JD.com, Lemall and Coolpad’s online store on August 24 at 10AM.

Meanwhile, check out the entire Cool1 specs from here.

Another dual camera phone for the cheap and this might be a bit better than the Redmi Pro as well. What do you think? Looks like we will have to look at both these devices in detail very soon!

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In the first half of 2016, flagships specifications basically center around the Snapdragon 820 chip, 4GB or 6GB of RAM, and 128GB internal storage in the hardware aspect, apart from the display types which vary. The recent trends indicate all that is gradually changing during this second half of the year.

Flagships during the second half seem to shift towards the inclusion of dual cameras at the rear, Qualcomm’s latest Snapdragon 821 chipset, a minimum of 6GB RAM and the inclusion of a curved display on the design of the flagship. This setup looks like the flagship standard on board and quite a sizable numbers of manufacturers are reportedly cooking up similar products focused on this configuration, as gathered from leaks and insider information.

A recent post on popular Android forum, XDA-developers leaked what is purported to be a freehand sketch of LeEco’s next flagship design exposing a dual camera design at the back as well as the frontal design which reveals a curved edge design.

The alleged design drafts showed the dual camera positions in different symmetrical positions at the back with dual flash also part of the design as leaked. The positioning (symmetry) of the dual cameras seems to suit both left handed and right hands users. One of the sketches even shows the dual cameras lying side by side in a diagonal position. Already, LeEco has adopted the dual camera design on its collaborative smartphone with Coolpad, the Cool1 which was also seen in a leak and on TENAA recently.

Read More: LeEco Coolpad joint phone revealed as Cool1, Features Dual Cameras

Apart from the dual cameras, a sketch of what is said to be a curved edge design also finds its way into the device, according to the leaked drawings. It should be noted though that these are just sketches from an unverified source, and the final design of LeEco’s next flagship may look nothing similar. Also, we cannot confirm the authenticity of the sketches that they are actually those of any of LeEco’s smartphone still in the pipeline.

(source)

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Recently, Chinese manufacturers, LeEco and Coolpad revealed a new collaborative smartphone launch. This came after  LeEco’s acquisition of controlling stakes in Coolpad.

The smartphone was seen in a leaked photo last week being held by a lady, exposing the rear view of the phone. We were able to grab from the leaked photo that the device will come with dual main cameras as well as a fingerprint sensor at the rear. The device was equally spotted on TENAA not too long ago, listed as C106 and shedding light on some of the specs. The rumored specs of LeEco-Coolpad smartphone had also made the rounds on the internet before but no name has been ascribed to the proposed device.

However, LeEco-CoolPad has today officially announced their first product and it is called the Cool1. This was revealed via their official handle on Chinese microblogging site Weibo. Earlier rumors posit that the  Cool1 will feature a 5.5-inch display with 2K resolution, powered by a Snapdragon 820 chipset, with 4GB RAM and 64GB ROM. So, it’s going to be a high-end device.

As stated earlier, there is a dual camera setup at the rear and fingerprint sensor. The phone is also said to feature a cool 3500mAh battery. Quite spectacularly, the Cool1 will run on dual operating systems as both LeEco’s EUI and Coolpad’s CoolUI all Android 6.0 Marshmallow-based, will feature on the device. So users have the option of switching between these two OSes.

Read More: First LeEco & Coolpad Collaboration Smartphone Leaked With Dual Cameras

The Cool1 will officially be released on  August 10, according to reports but no news yet about the price it would carry.

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