MediaTek has announced two new processors today in Taiwan. The Dimensity 920 and Dimensity 810 chipsets are both 6nm octa-core processors with better performance and efficiency than their predecessors.

Dr. JC Hsu, the Corporate VP and GM of MediaTek’s Wireless Communications Business Unit, said that the new chipsets are designed to “provide device makers and smartphone users with the latest innovations at more accessible price points for the mainstream market.” The chipsets bring a boost in performance, display intelligence, and image brilliance.

Dimensity 920

The Dimensity 920 is a 6nm chip with four Cortex-A78 cores clocked at 2.5GHz and four Cortex-A55 Cores clocked at 2.0GHz. The GPU is the Mali-G68 which MediaTek claims has all of the technologies of the bigger G78 but is optimized for power-efficiency, thus extending battery life even further for gamers. According to the press release, the Dimensity 920 offers up to 9% faster gaming performance over the Dimensity 900.

The chipset can be paired with LPDDR5 and LPDDR4X memory and UFS 3.1 and UFS 2.2 storage. The Dimenity 900 also has Smart Adaptive Display support which allows it automatically adjust the refresh rate according to the game or UI action detected. The spec sheet also mentions it has a 4K video capture hardware engine and it can support up to four concurrent cameras and up to 108MP sensors.

For connectivity, the Dimensity 920 has Wi-Fi 6, Bluetooth 5.2, and 5G Call and Data Concurrency 3.0 that allows for 5G gaming on SIM 1 while receiving a call on SIM 2.

Dimensity 810

The 6nm Dimensity 810 sits below the 7nm Dimensity 820. It also has 8 cores made up of four Cortex-A76 cores clocked at 2.4GHz and four Cortex-A55 cores clocked at 2.0GHz. MediaTek claims that it brings a 20% increase in performance compared to the previous generation. The GPU is the Mali-G57 MC2.

The chipset supports 120Hz FHD+ displays, LPDDR4x RAM, UFS 2.2 (2-lane) storage, and up to 64MP cameras. The chipset also has high-end AI-camera features such as AI-Bokeh and AI-Color in collaboration with Arcsoft.

There is only Wi-Fi 5 and Bluetooth is version 5.1 and the peak download speed is 2.77Gbps for the modem,

The Dimensity 810 will appear in an OPPO phone soon according to a leak from last week. There is also a new Realme V-series phone coming soon that has been reported to be powered by the chipset.

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MediaTek is yet to announce the name of its first 5G processor which should appear in a number of devices soon. We know the processor will have the Helio M70 modem integrated into it. We also know it will come with Arm’s Cortex-A77 CPU cores and Mali-G77 GPU cores. Now, information has surfaced about another 5G modem from MediaTek but one that is less powerful and of course, cheaper.

The info comes from @Digital Chat Station, the same source that revealed a few days ago that Redmi is developing a phone that will come with MediaTek’s 5G processor. He revealed on Weibo that MediaTek has a second 5G SoC coming that will also feature the Helio M70 modem but will have the Cortex-A76 CPU cores instead of the more powerful A77 cores.

He adds that the processor will be a 7nm chip, supports SA and NSA networks, and will power devices priced around ¥2000 (~$284). A 5G phone priced under $300 should definitely sell like hot cakes. Since it features the same modem as the more powerful processor, you should get the same download speeds too.

There is no mention of when the processor will be announced neither did he reveal which manufacturers will be adopting it for their phones. We believe more information will surface as time goes on.

UP NEXT: 5G iPhone coming in 2020, will feature Qualcomm 5nm X55 modem chip

(Source)

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Huawei has unveiled its most powerful processor at the on-going IFA Berlin tech show.  The Hisilicon Kirin 980 was officially unveiled a short while ago and is the world’s first 7nm chipset.

The Kirin 980 is not only the first 7nm processor in the world, it is also the first chipset with the new Cortex-A76 CPU cores; the first chipset with a dual-NPU; the first with the Mali-G76 GPU, the first with a Cat. 21 LTE modem, and the first chipset to support 2133MHz LPDDR4X. That’s so many firsts!

The Kirin 980 has 8 cores in a tri-cluster arrangement (2+2+4). The four Cortex-A76 cores are separated into two – one set is clocked at 2.6GHz while the other is clocked at 2.2GHz. The former takes on high demanding short-term tasks while the latter handles high-demanding long-term tasks. The power-saving Cortex-A55 cores are clocked at 1.8GHz and handle simple everyday tasks. Huawei says it uses a flex-scheduling system which distributes tasks among the cores.

The GPU is the Mali G76 MP10 and it has a clock speed of 720MHz. Huawei says it brings a 48% increase in terms of performance and a 178% increase in power management. There is also a special boost mode called clock-boosting technology for when more graphics power is needed.

READ MORE: Photos of Huawei P20 Pro’s new color variants leaks, has faux leather versions too

The Kirin 980 also has a new ISP with a 46% increase in performance over last year’s model. It also brings a 23% improvement in recording power efficiency, and a 33% improvement in recording latency. There is also the new dual NPU chipset termed “Dual-Brain Power” that is about 120% faster than the NPU in the Kirin 970.

For the Wi-Fi chipset, Huawei is going with its own in-house chipset – the Hi1103. It supports 802.11ac offering speeds up to 1732Mbps. It also supports 2×2 MIMO.

The Kirin 980 has a total of 6.9 billion transistors and will be mass-produced by Taiwan’s TSMC. It will first appear in the Huawei Mate 20 and Huawei Mate 20 Pro.

The post Kirin 980 is official: World’s first 7nm chipset with two dedicated NPUs appeared first on Gizmochina.

Multiple reports have claimed that the 7nm Kirin 980 SoC will be featuring ARM Cortex A77 CPU cores for performance coupled with Cortex A77 CPU cores for reliability. However, since well-known industry insiders such as Roland Quandt and Ice Universe have claimed that such reports are fake since Cortex A77 has not been announced yet. Today, GizmoChina has received an official confirmation from ARM that the Kirin 980 will be equipped with Cortex A76 and the “Cortex A77 does not exist.” This piece of information debunks all rumors that have claimed the Cortex A77 may get unveiled at IFA 2018 and it will end up inside Kirin 980.

In June, ARM had announced the Cortex A76 CPU as the successor for the Cortex A75. In comparison to its predecessor, the Cortex A76 promises 35 percent improvement in performance and offers 40 percent better power efficiency. And also, it delivers up to 4 times the existing performance in Machine Learning.

The HiSilicon Kirin 970 chipset that was announced in September 2017 now powers more than 10 smartphones by Huawei. The Kirin 970 includes quad-core Cortex A73 CPU and quad-core Cortex A53 CPU. It also features Mali-G72 graphics and an AI NPU unit.

Huawei has recently rolled out a press release that the upcoming Mate 20 series will feature Kirin 980, but it did not confirm anything on its specifications. The press release also discussed that rumors are claiming that the Kirin 980 will be equipped with quad-core Cortex A76 CPU and quad-core Cortex A55 CPU. The SoC is expected to produce maximum clocking speeds of 2.8 GHz. The 7nm Kirin 980 will be soon rivaled by Apple A12 SoC that will be fueling the upcoming iPhones in September and 7nm Snapdragon 855 by Qualcomm that is rumored to go official by December.

The specifications of the Kirin 980 will be revealed at the end of this month through its official unveil event at IFA 2018 in Berlin, Germany. The Kirin 980 will be based on 7nm manufacturing process of TSMC. The SoC is also expected to arrive with an enhanced NPU unit for managing AI tasks. The Kirin 980 powered Mate 20 and Mate 20 Pro will be debuting in October.

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ARM has announced a new CPU core that will power the next generation of processors. The Cortex-A76 was unveiled at an event in San Francisco today.

The A76 brings a significant improvement in performance – up to 35% according to ARM. It will also be 40% more efficient and provide up to 4 times the current performance in Machine Learning.

These increase in performance and efficiency should be transferred to custom chips made by Qualcomm and Apple. Both manufacturers build their own custom cores based on ARM’s CPU architecture. But as we all know, Apple’s own cores are significantly powerful than those of Qualcomm.

ARM also says the new core offers up to 2x improvement in performance for laptops i.e. Windows on ARM notebooks. However, it is important to note that that jump in performance is because the new CPU core is compared to the Cortex-A73 which the Snapdragon 835 is based on and not the more powerful Cortex A-75 of the Snapdragon 845.

READ MORE: Qualcomm To Release Snapdragon 850 Early: Exclusive To Windows 10 on ARM Devices

ARM also announced the Mali-G76 GPU. The new GPU will be combined with the Mali-V76 VPU and last year’s mali-D71 DPU. The mali-G76 brings a 30% improvement in performance, a 30% improvement in energy efficiency, and 2.7x improvement in machine learning.

The new CPU core and GPU core should be seen in processors that will power next year’s devices at the earliest.

(Sources: 1, 2, Via)

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