The ongoing artificial intelligence revolution highlights the critical importance of processing power. Luckily, quantum computers, significantly more advanced than traditional ones, emerge as crucial in this context.

For those who don’t know, quantum computers are a type of computation based on the principles of quantum mechanics, unlike classical computers. While classical computers process data using bits (0 or 1), quantum computers use quantum bits (qubits).

Although this solves the processing power issue, running such a system brings along different challenges like heat. However, scientists have solved this problem with a cooling system that’s colder than space. Here are the details…

Researchers Develop Ultra-Cold Cooling System

Researchers at the Swiss Federal Institute of Technology, who have been researching new methods to cool quantum computers for some time, have finally developed a cooling system that creates an environment cooler than the depths of space itself for these systems.

In their experiment, they successfully cooled a quantum computer processor to -273°C. This temperature is even colder than the average temperature of space, which is around -270°C. So why are researchers trying to cool the system so much?

As you know, quantum computers unlike current computers, need to be constantly cooled. However, you can’t just attach a computer cooler and start it up. The components that perform quantum calculations, called “qubits,” must be kept as close to zero degrees as possible to avoid being affected by heat.

Therefore, significant effort has been made to operate quantum computers as accurately and smoothly as possible. The interesting part is that this groundbreaking cooling system is made using off-the-shelf computer parts.

This means it didn’t cost millions of dollars to develop. This also suggests there’s not a significant barrier to its applicability in consumer electronics. As you know, while modern hardware is quite powerful, heat often limits it from reaching its full potential.

Who knows, perhaps this system might appear in gaming consoles, PCs, and laptop models in the near future. This could mean even my 1 kg MateBook X Pro could handle playing GTA VI.

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The upcoming Ryzen 9 9900X processor has just been spotted in the Geekbench database, showcasing some impressive performance gains. This 12-core, 24-thread CPU based on the Zen 5 architecture achieved a single-core score of 3401 and a multi-core score of 19756 in Geekbench 6.2.1. Compared to the official results for the previous generation Ryzen 7900X (single-core 2925, multi-core 17849), the 9900X boasts a significant performance jump of 16.3% in single-core and 10.7% in multi-core performance.

The CPU reached a maximum frequency of 5664 MHz during the test

The benchmark was conducted on a system equipped with the ASUS ROG CROSSHAIR X670E GENE motherboard. During the test, the CPU reached a maximum frequency of 5664 MHz and maintained an average frequency of 5654 MHz.

The leaked benchmark results come from a Ryzen 9 9900X processor built on the Zen 5 architecture. This 12-core, 24-thread CPU boasts 64MB of L3 cache, offering a base clock speed of 4.4 GHz and the ability to boost up to 5.6 GHz. The processor maintains a 120W TDP.

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Intel‘s Sapphire Rapids-Refresh processors are picking up steam. These CPUs have been certified by Ubuntu, guaranteeing compatibility with a whole different operating system. The news gets better: Lenovo‘s upcoming ThinkStation P5 workstation is equipped with a Xeon W7-2595X processor, confirming customer shipments of these Sapphire Rapids-Refresh processors have begun.

The CPU boasts 26 cores and 52 threads, with a max turbo frequency of 4.8GHz

The Xeon W7-2595X CPU in the ThinkStation P5 boasts impressive specs: 26 cores, 52 threads, a maximum turbo frequency of 4.8GHz, and a 250W TDP. While this processor reigns supreme as the flagship of the Xeon W-2500 series, even more powerful options with up to 60 cores are on the horizon with the upcoming Xeon W-3500 series.

The ThinkStation P5 comes equipped with an NVIDIA T400 GPU in its base configuration, but users have the option to upgrade to dual RTX A6000 (Ampere) graphics cards for even more power. Future iterations of the ThinkStation P5 are expected to leverage the next-generation ADA series graphics cards.

An official release date for Sapphire Rapids-Refresh processors remains elusive, but SIGGRAPH 2024 (July 28-August 1), a computer graphics conference, is a strong possibility for Intel to officially unveil these new workstation products.

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Flow Computing, a Finnish startup, has introduced a novel chip technology with the potential to boost Central Processing Unit (CPU) performance significantly. Their Parallel Processing Unit (PPU) promises to double a CPU‘s capabilities and, with software adjustments, achieve up to 100x speed improvements – all without increasing power usage or heat generation.

PPU Promises Compatibility and Efficiency

Traditionally, CPUs handle tasks sequentially, one after another. Flow’s PPU acts as a companion chip, optimizing these tasks in real time. This allows the CPU to transition from serial processing to a parallel processing model, significantly streamlining operations. The analogy used by Flow’s CEO, Timo Valtonen, compares this shift to transforming a single-lane road into a multi-lane highway, enabling smoother traffic flow and faster processing speeds.

The PPU achieves this feat by managing tasks at incredibly short nanosecond intervals. By handling numerous processes simultaneously, it bolsters overall throughput without requiring changes to the CPU’s clock speed or underlying architecture.

While the potential benefits are undeniable, Flow acknowledges challenges in adoption. Integration of the PPU necessitates alterations at the chip design stage, potentially disrupting existing manufacturing processes.

Despite these hurdles, Flow has demonstrated the technology’s effectiveness through FPGA-based testing. Additionally, they have secured an initial €4 million in funding from venture capital firms. Currently, the company seeks industry partnerships to further develop and commercialize their solutions.

The success of Flow’s technology hinges on overcoming integration hurdles and demonstrating its effectiveness in real-world applications. If successful, the PPU could represent a major leap forward in CPU performance, impacting various sectors that rely on intensive processing power. From artificial intelligence and scientific computing to edge computing and autonomous systems, the potential applications are vast.

The tech industry will be closely watching Flow’s progress to see if their PPU technology can truly usher in a new era of high-performance, low-power CPUs.

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AMD has announced a range of new Ryzen PRO series commercial processors built on a cutting-edge combination of architectures: Zen 4 for CPUs, RDNA 3 for GPUs, and XDNA for NPUs. The lineup caters to both laptops (Ryzen PRO 8040) and desktops (Ryzen PRO 8000), offering a total of 16 processors.

These Processors are riding on AMD’s 4nm manufacturing process and AMD Pro tech

These processors boast significant improvements in performance, power consumption, and AI capabilities. The 4nm manufacturing process and integration of AMD PRO technology contribute to these advancements. Additionally, they support the latest WiFi 7 standard and Bluetooth 5.4 for enhanced connectivity.

The Ryzen PRO 8040 series for laptops is designed to meet the needs of two distinct markets. The HS series caters to content creators and mobile workstation users, offering powerful processors like the Ryzen 9 PRO 8945HS with 8 cores, 16 threads, and a 4.0-5.2GHz clock speed. These HS series processors are capable of handling demanding tasks but come with a higher power consumption rating ranging from 35W to 54W.

If portability is a priority, the U series offers a more energy-efficient option. Processors like the Ryzen 7 PRO 8840U and Ryzen 5 PRO 8640U boast similar core counts and clock speeds as the HS series but have a lower power consumption rating of 15W to 28W. The unique offering in the U series is the Ryzen 5 PRO 8540U, which lacks an NPU unit.

The desktop-focused Ryzen PRO 8000 series comes in two variants: G and GE. Both G and GE series offer Ryzen 7, 5, and 3 processors. Users prioritizing raw performance can opt for the G series, which offers processors like the Ryzen 7 PRO 8700G with 8 cores, 16 threads, and a clock speed of 4.2-5.1GHz. However, the G series comes with a higher power consumption rating of 45W to 65W.

For those seeking a balance between performance and efficiency, the GE series offers a compelling option. These processors, like the Ryzen 5 PRO 8600GE, maintain a similar core count and clock speed as the G series but with a lower power consumption rating of 35W.

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Google is unveiling a pretty big advancement in data center technology with its custom Arm-based CPUs, the Axion Processors. Axion promises industry-leading performance and energy efficiency. Compared to existing Arm-based offerings, Axion delivers up to 30% better performance. It surpasses comparable x86-based options by a significant margin, offering up to 50% better performance and a remarkable 60% improvement in efficiency.

Google’s Titanium handles networking and security on the Axion CPUs

The foundation of Axion lies in Arm’s Neoverse V2 CPU cores, specifically designed to excel in general-purpose workloads. Google has further enhanced Axion with their custom silicon microcontrollers, codenamed Titanium. Titanium handles platform tasks like networking and security, ensuring that Axion’s processing power is dedicated to core workloads. Additionally, Titanium offloads storage functionalities to Hyperdisk, a new block storage service that allows for dynamic performance scaling.

Beyond raw performance, sustainability is a major focus for Google. Their data centers are already recognized for their efficiency, and Axion promises to push the boundaries even further. This aligns perfectly with Google’s goal of achieving carbon-free operations.

Compatibility remains a major concern when introducing new technologies. Axion is built on the standard Armv9 architecture, ensuring seamless compatibility with existing software and tools. Google actively contributes to the Arm ecosystem through projects like Android and Kubernetes, and they collaborate with partners to optimize software for Arm. This commitment ensures a rich ecosystem for Axion users. Customers can leverage Axion with various Google Cloud services including Compute Engine and Kubernetes Engine. Furthermore, Arm-compatible solutions are readily available on the Google Cloud Marketplace, and migration tools exist to simplify the transition to Arm-based instances.

The potential of Axion has garnered excitement from industry partners like Broadcom, CrowdStrike, Cybereason, Datadog, Elastic, OpenX, Snap, and WP Engine. They all anticipate significant improvements in performance, efficiency, and sustainability with the arrival of Axion.

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Intel is stepping up its game in the tech world with its latest 14th Gen mobile and desktop processor lineup. This includes the new HX-series mobile processors, set to rev up 2024’s gaming laptops. Don’t mix these up with the Core Ultra CPUs for laptops; these new processors are an upgrade from the 13th Gen Raptor Lake mobile versions.

The new mobile CPU has an impressive 24 cores and a max clock speed of 5.8GHz

The star of the show is the Intel Core i9-14900HX, tailored for high-performance gaming laptops. It boasts an impressive 24 cores and can reach speeds up to 5.8GHz. But it’s not just about speed – these chips support up to 192GB of DDR5-5600 memory, along with the latest in connectivity like Wi-Fi 7, Bluetooth 5.4, and Thunderbolt 5.

Intel has also beefed up the Core i7 variant. The new Core i7-14700HX now has 20 cores, four more efficiency cores than its predecessor. This upgrade should enhance the performance of multithreaded applications and games.

In the ring with AMD, Intel’s Core i9-14900HX seems to have an edge in most tests compared to AMD’s Ryzen 9 7945HX, although it doesn’t outperform in every game. It’s important to note, however, that Intel hasn’t compared these new chips with its own 13th Gen models. Our previous look at the 14th Gen desktop chips suggested they were more of a refresh than a revolution, especially when stacked against AMD’s top desktop gaming CPUs.

On the desktop front, Intel is also launching its mainstream 14th Gen CPUs. There are 18 new processors in this lineup, including the flagship Core i9-14900. This one also has 24 cores and is designed to be less power-hungry, operating at 65 watts base power. Like its mobile counterparts, these desktop CPUs support up to DDR5-5600 and 192GB of memory and are compatible with existing Intel 600- and 700-series motherboards.

Follow Gizmochina’s coverage of CES 2024 here.

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Intel has officially launched its latest Intel Core 14th Generation desktop processor family, with the flagship Intel Core i9-14900K leading the pack. This new lineup features six unlocked desktop processors, delivering up to 24 cores, 32 threads, and an impressive frequency of up to 6 GHz straight out of the box.

The i9-14900K has laid claim to the title of the world’s fastest desktop processor, providing gamers with a substantial edge through its 6 GHz speeds from the start. For creators, the Intel Core i7-14700K offers 20 cores and 28 threads, a 25% increase over its predecessor, ensuring significant performance gains in multi-threaded workloads.

Intel introduces the new AI Assist feature in its Extreme Tuning Utility (XTU), offering one-click AI-guided overclocking for select unlocked Intel Core 14th Gen desktop processors. This feature brings simplicity to the overclocking experience, catering to both experts and beginners.

The Intel Core 14th Gen processors leverage Intel’s advanced performance hybrid architecture, prioritizing compute performance for day-to-day workflows. The lineup promises an immersive gaming experience, delivering up to a 23% performance uplift compared to “leading competitor processors”. Enhanced gaming-focused features, including Intel Application Optimization (APO) and Thread Director application thread scheduling, aim to improve application threading. Moreover, these processors support DDR5 XMP speeds well beyond 8,000 megatransfers/second (MT/S).

Intel’s latest desktop processor family comes equipped with integrated support for Wi-Fi 6/6E and Bluetooth 5.3, as well as discrete support for new Wi-Fi 7 and Bluetooth 5.4 wireless technologies. The processors maintain compatibility with both Intel 600 and 700 series chipsets, allowing enthusiasts to easily upgrade existing systems and enjoy the latest-generation gaming and creator performance.

The Intel Core 14th Gen desktop processors are set to hit retail outlets and OEM partner systems starting October 17, 2023.

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Intel is at it again. Not long after the launch of the Core i9-13900KS that stunned with its 6GHz speed, the tech giant has unveiled its 14th-gen desktop CPUs, led by the i9-14900K. The new chip is also capable of hitting the 6GHz mark, thanks to its “Thermal Velocity Boost.” But is this raw power just for show or does it serve a real purpose?

The chip also consumes 253 watts of power, which is a lot

It’s easy to get lured by the flashy 6GHz number, but the i9-14900K’s high speed only lasts for short bursts. These chips may have the upper hand in the Intel vs. AMD performance race, but they’re not for everyone. Intel claims that its 14900K chip is up to 23% faster than AMD’s Ryzen 9 7950X3D when playing games like Starfield in 1080p. It’s worth noting that the comparisons could be skewed, as Intel’s benchmarks involved tasks that work better with its own UHD graphics. This chip guzzles power like it’s going out of style—253 watts, to be exact. That’s not exactly what you’d call efficient.

And speaking of AMD, Intel’s got its rival in the crosshairs. The company claims its flagship chip is up to 23% faster than AMD’s Ryzen 9 7950X3D in gaming benchmarks. But let’s take that with a grain of salt. The tests favored Intel’s own graphics tech, so is it a fair fight? Jury’s still out.

But hey, if the i9-14900K is too rich for your blood at $589, there’s always the more budget-friendly i7-14700K. It’s got a cool 20 cores and tops out at 5.6GHz for a much more palatable $409. Now that’s a deal.

Here’s something intriguing, though. Intel’s throwing in some AI help for the overclocking crowd. Their new XTU AI Assist feature makes it simpler to push your CPU to the edge without frying it. Cool, right? But don’t look for an NPU (neural processing unit) for AI tasks in these new desktop chips; that’s reserved for Intel’s upcoming mobile line-up.

Is Intel’s 14th-gen desktop CPU line-up really the next big thing, or is it just a flashy way to outdo AMD? Bottom line: these chips are powerhouses, no doubt. But unless you’ve got specific, demanding needs (or just love to brag), the i7-14700K might be the more sensible pick. The new CPUs drop on October 17th, but maybe give it a good think before you grab your wallet.

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As the U.S. government tightens its grip on chip exports to China, Intel emerges as a savior for Chinese firms desperate to fuel their growing large language models (LLMs). According to a report from DigiTimes, Intel‘s Gaudi2 processors have gained significant traction in mainland China since their launch this past July.

The new Intel chips are designed for AI algorithms

Traditionally, Chinese tech firms have relied on Nvidia’s A100 and H100 processors to train their advanced algorithms. However, U.S. export restrictions have hampered the supply, opening a black market for smuggled chips. Intel’s Gaudi2 chips, designed to navigate these export curbs, are offering a legitimate alternative.

David Zinsner, Intel’s CFO, highlighted earlier this month that there’s a growing interest in Gaudi chips due to a shortfall in alternative processors. The chips aren’t just a stopgap; they’re shaping up to be a catalyst in China’s pursuit of AI dominance. In August, the Chinese government approved the launch of its first batch of local LLMs. Names like Baidu’s Ernie Bot and SenseTime’s SenseChat were part of this roll-out. Intel’s Gaudi2 chips offer these companies a viable way to train their AI algorithms, given that they cater to the specific technological constraints imposed by U.S. export laws.

Intel, which last year made 27% of its total revenue in China, seems to have strategically positioned its Gaudi2 processors. At its launch, Sandra Rivera, Intel’s executive vice-president, said that these chips aim to “lower the barrier to entry” and help build up China’s AI capabilities.

Given that China accounted for a third of global semiconductor sales last year, according to the Semiconductor Industry Association, Intel’s focus on mainland clients is both timely and strategic. Amid geopolitical tensions and technological limitations, Intel’s Gaudi2 chips are not just filling a gap; they’re also potentially shaping the future of AI in one of the world’s largest markets.

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Exciting news has emerged from Intel, as reports indicate that the tech giant is gearing up to release the highly anticipated Granite Rapids-D peripheral chip in 2024. According to foreign technology media Computer Base, the chip will utilize the cutting-edge Intel Process 3, promising a significant leap in performance and capabilities.

The Granite Rapids-D Chip may be delayed until 2025

Leaked PPT slides of the Granite Rapids-D peripheral chip have provided a sneak peek into what we can expect. These slides reveal that the new chip will serve as the successor to the Xeon D-1700 and D-2700 (Ice Lake-D) models. Leveraging the power of the Intel 3 process, the Granite Rapids-D chip boasts a higher core density compared to its predecessors, promising enhanced processing capabilities and improved efficiency.

While specifics regarding the release date of the new Xeon-D chip (Granite Rapids-D) remain uncertain, reports suggest that Intel plans to launch the Granite Rapids-AP and Granite Rapids-SP server processors by the end of 2024. This leads to speculation that the release of the Granite Rapids-D chip may potentially be delayed until 2025. However, Intel’s commitment to delivering cutting-edge technology ensures that enthusiasts and professionals alike can expect an exceptional product whenever it becomes available.

The Granite Rapids-D chip holds immense promise for a range of applications, from high-performance computing to enterprise-level data centers. With its advanced architecture and increased core density, this chip is poised to revolutionize the computing landscape, delivering faster processing speeds, improved multitasking capabilities, and heightened energy efficiency.

Intel’s continuous innovation and dedication to pushing the boundaries of technology have solidified its position as a leader in the industry. The upcoming Granite Rapids-D chip serves as a testament to Intel’s commitment to delivering groundbreaking solutions that meet the ever-evolving demands of the market.

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I’m sure many of us dream of purchasing any tech product we want at an affordable price. However, economic conditions and the tax rates of the country you’re in, can create obstacles to achieving this dream. Unfortunately, at this point, a black market of smuggled products comes into play. Products illegally brought in from abroad are introduced to the market without being subject to any taxes in your country. While this situation may occasionally benefit consumers, it is not right, and customs authorities take measures to prevent it. One of these measures recently proved effective in China, as reported a man caught with 48 CPUs hidden in his shoes. Here are the details…

Man Caught with 48 CPUs Hidden in His Shoes

The market for unboxed CPUs continues to grow, these products are often more affordable than their boxed counterparts. However, their origins may be less legitimate. According to the latest reports, a man was recently caught attempting to smuggle 48 CPUs into China by hiding them in his shoes.

According to a report released by the authorities on the matter, a man wearing a black and white short-sleeved shirt entered a dedicated passenger inspection site. Customs officers at the scene noticed that his white canvas shoes seemed unusually large. Upon closer examination, they found the CPUs wrapped in paper tape inside the shoes, totaling 48 units.

This incident serves as a reminder of the conditions under which smuggled goods are brought into the country. Unfortunately, consumers often choose these products due to their lower prices. However, the potential damage to these sensitive technologies during such transport methods is often not taken into account.

Even when transported in factory-sealed boxes, these products can be damaged. It is also worth noting that finding someone to hold accountable in case these “seller-guaranteed” products malfunction in the future is often not possible.

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Intel has announced in its first quarter 2023 financial report meeting that it is accelerating the mass production of its 14th generation Meteor Lake Core processor. The processor is scheduled to be launched in the second half of this year and will be produced using the Intel 4 process node. Its transistor density and performance per watt are comparable to TSMC‘s N5 and N4 series nodes.

The Meteor Lake CPU Tile will have a Hybrid Core Design

The Meteor Lake processor is expected to feature a new small chip architecture, mainly composed of three tiles: IO Tile, SOC Tile, and Compute Tile. The Compute Tile includes CPU Tile and GFX Tile. The CPU Tile will use a new hybrid core design to provide higher performance with lower power consumption, and the GPU is also built with a new architecture.

This new architecture will allow the processor to achieve high performance while consuming less power. It is a significant improvement from previous generations, which often struggled with high power consumption and heating issues. The new design will make the Meteor Lake processor more efficient, reliable, and versatile, making it an excellent choice for demanding tasks such as gaming, content creation, and machine learning.

Furthermore, Intel has also announced that it is advancing the Intel 3, Intel 20A, and Intel 18A process nodes, which are expected to offer even more significant improvements in performance and efficiency.

It’s worth noting that the top-of-the-line Meteor Lake processor is expected to adopt a 6P+16E configuration, with only two series of Core i3 and Core i5, and no Core i7 and Core i9. This is a strategic move from Intel to optimize the processor’s performance for specific tasks while keeping the price competitive.

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The competition in the CPU market continues at full speed. Intel, which has been struggling due to complacency from being at the top for a while and falling behind its rival AMD, is working to widen the gap with the red team. According to the latest information, Intel’s 14th Generation Meteor Lake processors may soon enter the desktop market, as an LGA1851 Meteor Lake-S interposer was recently discovered. Here are the details…

Intel Meteor Lake-S CPU Tool Surfaces for Desktop PC

Intel’s 14th Generation Meteor Lake processors might make their way into the desktop market. While Intel‘s commitment to a socket isn’t as steadfast as AMD’s, the appearance of these leaks may imply that the company is preparing Meteor Lake-S desktop chips. However, without access to technical specifications or documentation, the exact purpose and features of the Meteor Lake-S processors remain speculative.

The leaked information indicates a potential increase in contacts compared to the current LGA1700 socket. This could lead to improved performance and compatibility with future hardware. Another leak suggests that the 14th Generation moniker is designated for the upcoming Meteor Lake processors, but it remains unclear whether these processors are intended for mobile, desktop, or both.

An unverified Intel roadmap casts doubt on the possibility of Meteor Lake coming to desktops in the near future, as it suggests that Intel is preparing a Raptor Lake Refresh (RPL-R) for a Q3 release. This could indicate that the rumored RPL-R will be the last to utilize Intel’s LGA1700 socket. With recent developments in Meteor Lake, including Linux patches and the confirmation of an L4 cache, it’s plausible that if a desktop variant is planned, it may not arrive until 2024.

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The competition in the processor market has never been higher. With the increase in performance of mobile processors and the success Apple has achieved with its M-series Mac models, traditional manufacturers like Intel and AMD are compelled to adapt. Intel, recognizing this situation, is taking early steps to adjust. By optimizing its fabs for ARM chip production, the company is opening new opportunities in the global supply chain. Here are the details…

Intel Optimizes Fabs for ARM Chip Production, Opening New Possibilities for Global Supply Chain

Intel and ARM announced an agreement that will optimize Intel’s 18A fabrication process for use with ARM designs and intellectual property. While the deal doesn’t involve “Intel Foundry Services” division producing chipsets for ARM, it will significantly simplify the process for ARM licensees, such as Qualcomm and MediaTek, to commission Intel for future chip production.

Initially, the partnership will concentrate on optimizing Intel’s 18A process for mobile system-on-a-chip (SoC) designs. However, both companies anticipate that the collaboration could expand to encompass silicon designed for the automotive industry, Internet of Things (IoT) devices, and data centers. Additionally, Intel will extend its support to ARM licensees beyond wafer production, offering services related to packaging, software, and chiplets.

This comprehensive support highlights Intel’s vision to become a one-stop solution for ARM-based chip manufacturing. Intel has also emphasized the geopolitical implications of the agreement. By optimizing its fabs for ARM chip production, the company aims to create a more balanced global supply chain for foundry customers working on mobile SoC designs with ARM-based CPU cores. As of July last year, Taiwan Semiconductor Manufacturing Company (TSMC) was responsible for manufacturing nearly 70% of all critical chipsets used in modern smartphones, as reported by Counterpoint Research.

The recent military exercises by China, involving the encirclement of Taiwan, have raised concerns over potential conflicts on the island and the stability of the semiconductor supply chain. By collaborating with ARM, Intel is positioning itself as a viable alternative to TSMC, offering a more geographically diverse and secure chip production option for ARM licensees. This partnership is expected to have far-reaching effects on the global chipmaking landscape, potentially alleviating supply chain bottlenecks and fostering a more competitive market.

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(via)

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The European Union is taking significant steps to strengthen its semiconductor industry, aiming to reduce reliance on US and Asian suppliers amid global supply chain disruptions. With the EU Chips Act, a 43 billion euro (US$47 billion) plan, the bloc intends to double its share of global chip output to 20% within a decade. As the EU countries and lawmakers prepare to meet on April 18 to finalize funding details, the approval of the Chips Act seems imminent. Here are the details…

EU aims to reduce reliance on US and Asian chips with €43bn Chips Act

The EU’s bold 43 billion euro (US$47 billion) plan, known as the EU Chips Act, is on track to gain approval from EU countries and lawmakers on April 18. The Act aims to strengthen the European semiconductor industry and reduce dependence on US and Asian chips, following global supply chain issues that hit European businesses across various sectors.

The legislation’s main objective is to double the EU’s share of global chip output to 20% within a decade. The announcement followed the US introducing its own Chips for America Act to compete with China’s technology sector. EU countries and lawmakers will meet at the European Parliament’s session in Strasbourg on April 18, where they are expected to agree on funding details for the Act.

Originally, the European Commission suggested funding only for advanced chip plants. However, EU governments and lawmakers have now expanded the scope to include the entire value chain, such as older chips and research and design facilities. One key driver for this expansion is Belgium-based IMEC, a leading innovation hub in nanoelectronics and digital technologies, with over 600 major industry players. Lawmakers see IMEC as a crucial reason for investing more in EU research and development.

The decision to support the entire value chain also eases concerns from smaller EU countries about being left out. For instance, Intel was attracted by the Chips Act and chose Germany for its new mega chip manufacturing complex. Similarly, Franco-Italian company STMicroelectronics has partnered with GlobalFoundries to build a 6.7 billion euro chip factory in France, backed by the French government.

As the EU Chips Act moves closer to approval, the European Union takes a significant step towards boosting its semiconductor industry and reducing reliance on external suppliers. The initiative’s success will be crucial in securing the EU’s position in the global technology landscape and addressing the ongoing semiconductor supply chain crisis.

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Intel plans to release its first energy-efficient data center chip, Sierra Forest, in early 2024. The company has faced a challenging period marked by product delays but still holds over 70% market share in the PC and server processing chips sector, down from 90% in 2017. Here are the details…

Intel Gears Up to Launch Power-Efficient Sierra Forest Chip in 2024

Sandra Rivera, head of Intel’s Data Center and AI Group, admitted the company’s recent struggles but affirmed that Intel is now on track, hitting key engineering milestones. The fourth-generation Xeon processor, Sapphire Rapids, faced delays, allowing AMD to narrow the gap. Rivera confirmed that the fifth-generation Xeon processor, Emerald Rapids, will be delivered by 2023’s end. The next-generation Granite Rapids processor is set for a 2024 release, followed by Sierra Forest. Clearwater Forest, another energy-efficient chip, is planned for a 2025 launch.

Intel is also developing the Intel Developer Cloud, featuring 256 Xeon chips and 512 Gaudi chips for AI applications. AI startups Hugging Face and Stable Diffusion are already using Intel chips. With a robust lineup of upcoming products, Intel aims to strengthen its data center market presence and focus on power efficiency and innovation. The company’s commitment to improving its product portfolio and meeting crucial engineering milestones highlights a renewed emphasis on addressing data center customers’ needs and maintaining a competitive edge in the rapidly evolving tech landscape.

Intel’s upcoming releases, including the power-efficient Sierra Forest and Clearwater Forest chips, demonstrate the company’s dedication to creating innovative, eco-friendly solutions for data centers. By offering energy-efficient options, Intel can cater to the growing demand for sustainable technology and attract environmentally conscious clients.

The Intel Developer Cloud, which offers AI developers access to powerful Xeon and Gaudi chips, exemplifies Intel’s commitment to advancing artificial intelligence. By collaborating with AI startups like Hugging Face and Stable Diffusion, Intel is supporting the growth of the AI industry and ensuring its products remain relevant in this dynamic sector.

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While the Snapdragon 8 Gen 2 is the latest and greatest chipset from Qualcomm, new rumors are already surfacing regarding the Snapdragon 8 Gen 3. A new report has revealed the CPU arrangement of this upcoming flagship chipset. So here are all the details.

Initial reports had claimed that the chipmaking giant will launch the Snapdragon 8 Gen 3 with the same CPU layout as the Snapdragon 8 Gen 2 SoC, which is the 1+4+3 arrangement. However, a new report has claimed that the company is bumping up the number of performance core and sacrificing an efficiency core with a new 1+5+2 configuration. Based on recent reports, the Snapdragon 8 Gen 3 is expected to feature one Cortex X4 core that will have a clock speed of 3.2GHz.

However, older reports had claimed that it could even hit as high as 3.75GHz. On the other hand, the five Cortex A720 cores will clock at 3.0GHz and the two Cortex A520 cores have a 2.0GHz frequency. Apart from the CPU arrangement and clock speeds, the leak also added that the Snapdragon 8 Gen 3 SoC will also arrived with support for UFS 4.1 internal storage, LPDDR5 memory with 7,500 MT/s, Adreno 750 GPU, and a Qualcomm X75 5G modem.

As per the latest leak, the Snapdragon 8 Gen 3 SoC will be manufactured on TSMC’s N4P process node. This means that three generation of Qualcomm flagship chips are still on slightly tweaked version of the same TSMC N5 node. Although, the company might could completely move the Snapdragon 8 Gen 3 SoC to a 3nm process from either Samsung or TSMC, or continue to use the N4P process.

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The post Qualcomm Snapdragon 8 Gen 3 Specs Leak Reveals 1+5+2 CPU Layout with UFS 4.1 Storage Support appeared first on Gizmochina.

Recent reports have suggested that Samsung has established a new team dedicated to the development of custom CPU cores for its in-house processors. However, Samsung has now confirmed that these reports are untrue, stating that it already has multiple internal teams responsible for CPU development and optimization, and has had them for a long time. Here are the details…

Samsung Optimizes In-House Processors without Establishing New CPU Development Team

The reports initially suggested that Samsung had hired a senior developer from AMD to lead the effort of developing custom CPU cores for its in-house processors, with the first chipset featuring custom cores expected to arrive in 2027. Samsung is reportedly developing specialized processors for its Galaxy devices after ditching its in-house Exynos processors due to poor performance.

While Samsung has confirmed that it is not establishing a new team for CPU development, it is constantly recruiting global talents from relevant fields to optimize its in-house processors. The idea behind developing custom CPU cores is to optimize the chipset for its devices from the development stage, allowing for deeper hardware-software integration, similar to Apple’s iPhones.

Samsung has previously developed custom CPU cores for its Exynos processors between 2016 and 2020. However, those chipsets underperformed against competing solutions from Qualcomm that used stock ARM cores. As a result, Samsung eventually decided to use Qualcomm’s Snapdragon processors in its flagship devices.

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(via)

The post Samsung Denies Rumors of Major Changes to Flagship Chipsets appeared first on Gizmochina.

Intel had recently launched its 13th generation Core processors and today, the company has announced a new top-end model in the lineup, dubbed Intel Core i9-13900KS.

It is touted to be the fastest desktop processor to date, with a clock speed of 6.0GHz without overclocking. It is now available for purchase for the price of $699.

The Intel Core i9-13900KS is based on the 13900K chip, which peaked at 5.8GHz turbo frequency. The newly released 13900KS reaches 6GHz without overclocking using Intel’s Thermal Velocity Boost technology. It does it by using more electricity, using 250 watts at the max turbo power instead of the regular 150 watts, and peaks at 320W in a new Extreme Power Delivery Profile.

Apart from the power consumption and turbo frequencies, the Intel Core i9-13900KS is almost similar to the 13900K. The base frequency for the performance core has been increased to 3.2GHz from 3GHz. It comes with 24 cores, which include eight performance cores and 16 efficiency cores.

There are 32 threads, 36MB of Intel Smart Cache, and 20 PCIe lanes, including 16 PCIe 5 and four PCIe 4 lanes. As for compatibility, the Z790 and Z690 motherboards will support this new 13900KS chip with a BIOS update.

The launch of this Intel Core i9-13900KS flagship desktop chipset comes just weeks before AMD is all set to launch the Ryzen 7000 X3D CPUs. AMD has claimed that its flagship Ryzen 9 7950X3D chip will be the ultimate processor for gamers and creators, promising up to 25 percent better performance.

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The post Intel Core i9-13900KS Launched As The World’s First 6GHz 320W CPU; Priced At $699 appeared first on Gizmochina.

At Computex Taipei 2022, AMD had revealed that the company will be launching its entry-level Ryzen and Athlon 7000 series mobile processors, codenamed “Mendocino”, that are aimed towards the Chromebooks and affordable Windows devices crowd.

And according to several reports online (via ITHome and wccftech), we have gathered several leaks and rumours that we know about AMD’s “Mendocino” processors so far.

AMD’s upcoming “Mendocino” 7000 series mobile entry-level APU family will be consisting of 3 members – the AMD Ryzen 3 7420U, AMD Athlon Gold 7220U and the AMD Athlon Silver 7020U.

Not much is known about the Athlon 7000 series mobile APUs, but recently ITHome reported that the news organisation had gathered info that the highest-end among the “Mendocino” processors – the Ryzen 3 7420U, will be sporting a quad-core CPU setup with 8 threads. All 4 CPU cores will be built on AMD’s older Zen 2 architecture, which turns 3 years old in 2022.

GPU-wise, The integrated graphics of the Ryzen 3 7420U APU will be featuring 1 WGP (2 CUs) of RDNA2 Graphics.

However, compared to its predecessor – the Ryzen 3 5400U, the upcoming Ryzen 3 7420U APU seems rather underwhelming. For comparison, the Ryzen 3 5400U also has a 4 core 8 thread CPU, but the cores are built on newer Zen 3 architecture. Meanwhile, the GPU on the Ryzen 5400U is a 6 CUs Vega Integrated Graphics.

As revealed earlier in leaks online, the AMD “Mendocino” APUs will be supporting dual-channel x32 LPDDR5 RAM, which can go up to 32GB, and the APUs will support VP9 and AV1 video encoding as well.

In Computex, AMD announced that “Mendocino” APUs will be launched in Q4 2022 and arrive in markets by the end of the year. The company expects “Mendocino” APUs to be available in mainstream notebooks priced from US$ 399 to US$699. 

In addition to the improved APU design, “Mendocino” is also manufactured on TSMC’s 6nm process, which translates to better power efficiency. AMD had announced that it believes that with Mendocino, Windows laptops can deliver more than 10 hours of battery life. On stage at Computex 2022, AMD revealed that Lenovo’s upcoming 2022 IdeaPad 1 series of entry-level laptops will be among the first to feature the APU.

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(Via 1, Via 2)

The post AMD Ryzen 3 7420U Leak: RDNA2 Graphics in an Entry Level APU appeared first on Gizmochina.

MediaTek’s processor family has 3 brand new additions today – the Dimensity 1050, Dimensity 930, and Helio G99 SoC. We’ve covered the Dimensity 1050 SoC launch here earlier but do not dismiss the Dimensity 930 and Helio G99 processors as well because MediaTek is promising exceptional power efficiency from both chipsets because the company has chosen to manufacture both SoCs on TSMC’s N6 (6nm class) chip fabrication process. 

MediaTek Dimensity 930 5G

The MediaTek Dimensity 930 SoC is the successor to last year’s Dimensity 920 SoC which was found on devices such as the Redmi Note 11 Pro+ and Realme 9 Pro+. The basics of the Dimensity 930 seem to be essentially the same as last year’s offering as the Dimensity 920 features an octa-core setup with 2x ARM Cortex-A78 performance cores that can be clocked up to 2.2GHz, and 6x Arm Cortex-A55 clocked up to 2GHz. 

But what is surprisingly different here is that the Dimensity 920 last year had the same exact setup but with the Cortex-A78 cores clocked in higher at 2.5GHz. So in short, the Dimensity 930 features downclocked performance over its predecessor which could lead to better battery performance in the newer devices sporting this chipset.

But the most eye-opening highlight here is that Dimensity 930 finally supports high-end UFS 3.1 storage and fast LPDDR5 memory, a feature once only reserved for the flagship market has now come to the mid-rangers!

Connectivity-wise, the MediaTek Dimensity 930 supports True Dual 5G SIM (5G SA + 5G SA) giving users consistent 5G speeds, and the opportunity for VoNR to provide the best quality voice and video call experience from both dual SIM connections. Unfortunately, the Dimensity 930 SoC is still stuck on the older WiFi 5 standard and Bluetooth 5.2 standards, which is a shame considering Qualcomm’s Snapdragon 680 already supports Wi-Fi 6.

MediaTek Helio G99 LTE

The MediaTek Helio G99 is the company’s latest SoC built for affordable 4G gaming smartphones. MediaTek has finally switched over from TSMC’s 12nm node foundry over to the newer 6nm node process for the Helio G99 SoC. In turn, the new Helio G99 SoC is able to deliver 30 per cent better power efficiency and battery life for gaming compared to the older 12nm Helio G96 processor.

The fundamental core setup for the Helio G99 has also changed as well. The Helio G99 SoC is now a new octa-core processor that features 2x ARM Cortex-A76 performance cores that can run up to 2.2GHz and 6x ARM Cortex-A55 efficiency cores that run up to 2.0GHz. If this sounds familiar, it is because the octa-setup is the same found on the higher end Dimensity 930!

Connectivity-wise, the Helio G99 unfortunately does not support 5G, instead it features an essential dual 4G SIM support that provides a seamless experience with fast data services from both connections, while VoLTE and ViLTE services provide excellent call and live video experiences with faster call setup and noticeably better quality than standard calling.

The Helio G99 comes with an ARM Mali-G57 MC2 GPU with support for LPDDR4X Memory and UFS 2.2 storage. The SoC also features WiFi 5, Bluetooth 5.2 and support for FHD+ 120Hz displays. 

MediaTek has collaborated with its Android smartphone partners to bring the Dimensity 930 SoC to market as soon as Q2 2022, and the Helio G99 SoC to market as soon as Q3 2022.

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(Source 1, Source 2)

The post MediaTek Dimensity 930, Helio G99 Launch: TSMC 6nm Brings Exceptional Power Efficiency appeared first on Gizmochina.

Google Pixel Watch was unveiled alongside the Pixel 6a during the I/O 2022 event as the company’s first smartwatch. The launch of the highly anticipated watch is due in October. However, the specifications of the watch have already started getting leaked. Last week, it was rumored that the smartwatch will be powered by an outdated Exynos 9110 processor and a new report today confirms that the Pixel Watch is actually powered by an Exynos 9110 SoC, but with some help from a second chip.

9to5Googe, citing sources, has confirmed that the 2018 Exynos 9110 chipset will indeed power Google’s first smartwatch, but it will be accompanied by a co-processor meant to relieve the 9110 of some of the load. It is possible that this additional chipset could come with Tensor branding, however, it’s unclear if Google intends to extend its branding to wearables.

Google seems to have taken inspiration from Qualcomm’s Snapdragon Wear 4100+ SoC which has a main CPU accompanied by a secondary “ultra-low” power co-processor that supports up to 64K colors and powers the always-on display. This takes the load off the main CPU and also helps the watch achieve better battery life.

The publication also reports that Pixel Watch would have 32GB of storage. That’s more storage than any other Wear OS device available on the market. It will be interesting to see how it will be utilized. Moreover, the Pixel watch is also said to surpass every smartwatch in terms of RAM. For reference, Galaxy Watch 4 has 1.5GB of RAM, and Google’s wearable is going to carry slightly more RAM than that.

As seen above, the sensors on the wearable’s back appear to be identical to the sensor array used in the Fitbit Luxe and Fitbit Charge 5. The technology in question can monitor heart rate, SpO2 (blood oxygen), and ECG, and since Google owns Fitbit, recycling sensors like this seems only logical.

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The post Pixel Watch’s Exynos 9110 processor might be joined by Co-Processor and additional RAM appeared first on Gizmochina.

With the recent launches of the Realme GT Neo 3 and Redmi K50 series, it seems that MediaTek is gunning for the top spot among the flagship Android SoC market with its Dimensity 8100, Dimensity 9000 processors.

However, it seems that MediaTek still has one more flagship Dimensity SoC up its sleeve for 2022 Android devices. MediaTek has officially announced its latest addition to the Dimensity flagship family — the MediaTek Dimensity 1300. 

The MediaTek Dimensity 1300 is the official successor to last year’s flagship MediaTek Dimensity 1200 chip as the Dimensity 1300 builds upon the successes that the Dimensity 1200 has achieved last year while providing some minor tweaks and improvements. The MediaTek Dimensity 1300 slots in at a higher price bracket than its Dimensity 800 and 900 series counterparts, and a lower price bracket than its higher-end siblings, the Dimensity 8100 and Dimensity 9000. 

The Dimensity 1300 features an octa-core setup, with 4 Cortex-A78 cores (1 Ultra A78 Core, running up to 3GHz, and 3 A78 Super Cores, up to 2.6GHz) and 4 Cortex-A55 efficiency cores, scaling up to 2GHz. The Dimensity 1300 runs on TSMC’s 6nm process and has support for 64-bit applications. Powering the graphics onboard is the ARM Mali-G77 MC9 CPU which is just as powerful as last year’s Dimensity 1200 GPU.

Moving onto the upgrades, the Dimensity 1300 has an improved ISP over last year as it now supports up to 200MP sensors, and hardware-accelerated AV1 decoding for faster 4K streaming. But that’s not all, the ISP also provide improvements to low-light shots as its artificial intelligence utilises real-time 3-exposure fusion for the best shot. 

Other technical specifications of the MediaTek Dimensity 1300 are also what you expect from a flagship Android SoC: Support for 16GB of 4266Mbps LPDDR4x RAM, UFS 3.1 Support, Support for 2520 x 1080 168Hz displays, and support for 5G on Dual SIMs.

The MediaTek Dimensity 1300 chipset is expected to debut in markets soon in the upcoming OnePlus Nord 2T and Redmi Note 12 series slated to launch in Q2 2022. For more news on the latest Chinese devices, stay tuned to Gizmochina for your daily source of Chinese tech news.

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(Source, Via)

The post MediaTek Dimensity 1300 Official Release: 6nm TSMC, Support for 200MP Sensor and More appeared first on Gizmochina.

AMD has confirmed that the company will be unveiling its next-generation Zen 4 CPUs at the upcoming Consumer Electronics Show (CES) 2022. The company’s CTO Mark Papermaster has said that some details will be mentioned at CES but more details will be shared at a later date.

This means that AMD won’t be launching the next-generation Zen 4 CPUs at the CES 2022 but will be revealing some of the key features. The Zen 4 was originally announced by the company in October last year at the Ryzen 5000 event.

In an interview with Forbes, Mark Papermaster said: “We’re excited to be revealing some additional details on our new product launches that will deliver phenomenal experiences, and as we’ve said, later in the year as it progresses we’ll share more detail on Zen 4, with some mentioned at CES and more announcements on it over the course of 2022.”

The company has scheduled its CES presentation on 4th January 2022 at 10:00 AM EST where Lisa Su, AMD’s CEO, is expected to talk about Ryzen 6000-series processors, Radeon graphics, and Ryzen 3D V-Cache technologies.

AMD has already confirmed that the next-generation Zen 4 chips will be manufactured using the 5nm process. The company is most likely relying on its existing partner TSMC for the manufacturing of chips.

If the reports are to be believed, then the chips will come with about a 40 percent improvement in performance. It is expected to support an AM5 socket that uses a Land Grid Array (LGA) design, breaking with AMD’s long history of Pin Grid Array (PGA) sockets.

After sharing some key details at CES 2022 in a couple of weeks, AMD is expected to actually launch the new chips sometime after July.

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The post AMD to share details about next-generation Zen 4 CPUs at CES 2022 appeared first on Gizmochina.

Google’s journey into making its own chipsets started a few years ago when it announced the Pixel 2 smartphone. The 2017 flagship had a custom-made image processor called the Pixel Visual Core, an 8-core image processing unit. The chip was then replaced with the Pixel Neural Core in the Pixel 4 series. For the upcoming Pixel 6 series, Google will ship the two phones with its own custom-built System on a Chip (SoC) called Tensor. A new report has revealed this is the first of more chips to come.

It has been reported that Google plans to announce its own CPUs which will power Chromebooks and Chrome OS-powered tablets. The news comes from Nikkei Asia and they cite three sources with knowledge of the matter. These CPUs are expected to begin rolling out in 2023 though Google has declined to comment on the matter.

Google’s processors will be based on the Arm architecture just like that of other chip companies such as MediaTek and Qualcomm. The advantage of using its own chip includes being able to more easily customize features for the devices they power.

A chief analyst at Isaiah Research, Eric Tsang, who spoke to Nikkei Asia, said that while the use of one’s own chip will result in better software and hardware integration, the business of making your own chip requires a lot of investment and long-term commitments. Peter Hanbury, a partner at Bain & Co., a consulting firm, also shares similar sentiments. He cited the cost associated with developing a chipset which is about $500 million for a 5nm processor and $50 million for a 28nm processor. Mr. Tsang also stated that new players will have to compete with older and more established players for production capacities. Delays in production can result in products arriving later than planned.

The publication also reports that Google has asked its suppliers to prepare 50% more production capacity for the Pixel 6 series compared to that of 2019. It is said that it shipped a total of 7 million Pixel phones in 2019 but that figure fell to 3.7 million last year. Sales have picked up this year, so Google is optimistic sales of the Pixel 6 series should be better.

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The post More Google chips are coming, this time for Chromebooks and tablets appeared first on Gizmochina.

Earlier today (13th July 2021), Master Lu released its rankings for PC hardware. In this list, CPUs were listed for both desktops and notebooks with AMD dominating the list in performance, while Intel still leads in terms of sales.

For those unaware, Master Lu is a popular Chinese benchmarking platform, which also ranks smartphones as well. Now, its latest CPU benchmarking results for various processors reveal that Team Red has dominated the list in terms of performance. This holds especially true in the desktop CPU rankings, where it holds absolute dominance. While it does lose to a Team Blue chip for the top spot in notebook rankings, the rest of the top 5 CPUs are from AMD.

In the PC list, the Ryzen Threadripper 3990X with 64 cores sat on the throne scoring 1718608 points. The second spot went to the Ryzen Threadripper 3970X with 32 cores came in second with 1271635 points, while the Ryzen 9 5950X with 16 cores came in third with 1052712 points. Another 24 core Threadripper CPU arrived fourth and the only Intel processor in the top 5 was the i9-10980XE with a score of 915913 points. On the notebook list, the Intel Core i7-11800H had a comfortable lead with 667148 points, while the runner up Ryzen 9 5900HX only scores 584684 points. Although, the rest of the top 5 spots are only comprised of AMD processors.

This listing highlights the leaps AMD has made in processing power in its chips in recent years, which has enabled it to surpass Intel on various fronts and even regain footing in market share. Although, Intel still leads the market in terms of sales, accounting for around 70 percent of all desktop processor sales across the globe. While AMD’s market share in the notebook segment is better than its desktop counterpart, Intel still holds over 60 percent market share.

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The post AMD dominates the Master Lu PC CPU rankings, while Intel leads in sales appeared first on Gizmochina.

Earlier this month we heard about MediaTek possibly launching a new SoC for gaming phones called the Helio G90 to combat the recent announcement of the Snapdragon 855+. It’s an interesting prospect since the Snapdragon 855+ is a strictly high-end chip, so the budget gaming market is not only wide open, but also ripe for the taking.

Well, apparently MediaTek had the exact same idea, and are acting pretty quickly. The company is set to release their brand new line of Helio G-series SoCs on July 30. The manufacturer plans to introduce the G90 SoC at an event in Shanghai, and then follow-up from there with more models in the future. It’s a pretty smart move, though we question how well a budget oriented gaming smartphone would work.

On top of that, we’re also not entirely sure what the Helio G90 will actually be like when it launches when it comes to specs. We’ve got a leaked poster for the SoC but it doesn’t reveal much other than the fact that it is targeted at mobile gaming. Going off the name, it wouldn’t be stretch to say that it’ll be based on the Helio P90, but that’s just a simple assumption.

Perhaps more interesting will be seeing how the company deals with making gaming SoCs to begin with. MediaTek SoCs have never been well known for their gaming performance, and their GPUs are often weaker than the competition, though not by too much. Whether they’ll step up and give us something great or just settle for a more conventional package remains to be seen. We’re hoping it leans more towards the former.

UP NEXT: MediaTek to announce Helio G90 chipset designed for mobile gaming

(Source)

The post MediaTek’s Helio G90 gaming SoC gets July 30th launch date appeared first on Gizmochina.

Reports have surfaced that MediaTek and manufacturing foundry, GlobalFoundries, will be working on the production of a new 22nm CPU with FD-SOI process. Traditionally, Taiwan Semiconductor Manufacturing Company (TSMC) has been the primary foundry partner producing Mediatek’s CPUs, making a new collaboration with GlobalFoundries unprecedented.

Currently, there are three leading 22nm processes: FinFET, CMOS, and FD-SOI. The benefits of the 22nm process include its low production costs and low power consumption whilst providing an alternative with similar performance to TSMC’s 16nm FinFET, according to GlobalFoundries. On the other hand, TSMC claims that its 22nm will be easier to adapt from 28nm whilst a 22nm FD-SOI would require changes in core architecture to avoid infringement on intellectual property cores. Regardless of the claims from both sides, MediaTek’s new relationship with GlobalFoundries offers a competitive alternative to other current 22nm processes such as TSMC’s 22nm planar technology.

RELATED: Mediatek’s Helio P23 Chip Targeted At OPPO, Vivo & Gionee Smartphones: Analyst

In the current smartphone market, 14/16nm (Snapdragon 821/Helio P20) and 28nm (Helio P15) CPUs are found in most flagships, whilst the 10nm will become the new more popular CPU process in the coming year, which has been seen in most recently released smartphones such as the Xiaomi Mi 6.

Although MediaTek has begun expanding to alternate foundries, we will not be expecting the company to be cutting ties with TSMC anytime soon, with its 10nm Helio X30 and 16nm Helio P25 expected in devices this year.

The 22nm process is expected to provide a new set of mid to entry level devices, however, a date has not been confirmed.

What are your thoughts on MediaTek’s new partnership with GlobalFoundries?

(Source 1, 2)

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Weibo user @ice universe has benchmarked the top 6 processors against each other and the results are pretty interesting. He has also listed out the strong points of each processor.

The result shows Huawei’s Kirin 960 winning scoring highest in memory latency, memory bandwidth, and Dijkstra algorithm value. The Helio X25  CPU  is no slouch either as it wins in some areas too. Qualcomm’s Snapdragon 821 chip also ranks in HDR and Face Detection.

READ MORE:  Xiaomi Meri Rumored to feature In-House Processor

Samsung’s Exynos 8890 is best at encryption and lossless data compression (LZMA). The older snapdragon CPU however fails to win any category which is not surprising as the Snapdragon 821 is supposed to be better than it in all ways. But it does score a little higher than the SD821 in encryption.

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Huawei has officially unvelied its latest super processor – Kirin 960 which brings with itself some strategic upgrades both in CPU and GPU. The Huawei Kirin 960 SoC comes with a modest upgrade in its CPU from Kirin 950 but on the GPU end, the new chipset sees a huge upgrade.

According to a source at the unveiling, Huawei Kirin 960 comes equipped with the recently unveiled high-performance ARM Cortex-A73 CPU core. The processor still uses the lower ARM Cortex-A53 core and in all the octa-core Kirin 960 SoC is composed of four Cortex-A73 cores and four Cortex-A53 cores.

More damning claim from the conference is the one concerning the Kirin 960 Versus Snapdragon 821 processor.  When subjected to Geekbench 4.0 test, the Kirin 960 is said to have scored 2000 points on the single-threaded scores and up to 6300 points on the multi-threaded score.

In addition to the CPU upgrade, the Huawei Kirin 960 chipset gets a big boost in its graphics unit, featuring the Mali-G71 MP8 GPU which were subjected to test on GFXBench Manhattan and T-Rex. The Kirin 960’s GPU performance comes out higher than that of Snapdragon 820 SoC and even twice as much power as Kirin 950. Apple A10 chip is still ahead, though.

According to Huawei, the Mali-G71 GPU is based on a truly new architecture which comes with a new level of high-end mobile graphics technology with superior energy efficiency. In addition, the Kirin 960 also supports the latest UFS 2.1 flash memory, LPDDR4 memory and on the network end, it supports LTE Cat.12 and LTE Cat. 13. A new baseband that supports CDMA is also at play.

Read More: Honor 6X With Dual Cameras & Kirin 655 Official, Starts At Just $149

The Huawei Mate 9 would get the opportunity of being the first device to feature the Kirin 960 and until that happens we’ll only hold our peace concerning these stunning claims.

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As the table below shows, because their newest chips have faster speed, the rate at which Qualcomm develops their processors has changed as well. They would usually modify the framework provided by ARM to get the best results. This is what they have always done from the 8260 to the Snapdragon 800, and the end results have been impressive.

Things changed when MTK released the MTK6589. Qualcomm caused noise with their release of the 8225Q. They, then, continued to walk to the dark side.

There has not been any changes made for the 410 series other than upgrading the CPU to the A53 (A7 enhanced). Qualcomm just limited its memory frequency. The difference in the performance of the 410 series with that of the 610 series is great. The A53 framework was only a little offset by the decrease in main frequency.

The 6xx series will be the worst and most disgusting product in this era of bad taste marketing.

The difference in the 610 and 410 lies in memory support. One supports 533 while the other supports 800. Then? It’s off to the grave, but the name will change.

The writer predicts that the 615 and 610 will score higher in their benchmark tests than the 600, but it probably won’t be as practical and useful as the 600. After all, the 600 is on the same level as the quad-core A9.

So, why should A53 cores be used? ARM gives us the answer below.

The Cortex-A53 is designed 40% smaller than the A9. So where could such a small chip go?

According to ARM, the reason for the A53’s small size is because Qualcomm reduced the cache size and data structure size. At the same time, they also improved its efficiency.

The octa-core 6xx series is not only much better than the 400 but half its price as well.

If they don’t have Apple’s fate, then they’ll have Apple’s problems. This is the Fleurs Du Mal for Chinese low-end machines.

But Qualcomm shows us what they have accomplished.

Qualcomm knows the problems they face. The high-end 810’s memory supports DDR4 1600 and 25.6Gbps bandwidth. The 808 also supports DDR3 933 which has a bandwidth of 14.9Gbps.

Qualcomm also provided their two CPU chips with ISPs to solve their camera-related problems. The 808 uses a dual-core 12bit ISP while the 810 uses a dual-core 14bit ISP, which at most, can take photos up to 55mP.

Even though Qualcomm’s next generation CPUs look perfect, power consumption is its biggest obstacle. According to the amd circuit diagram, the TDP of 8 a57 cores is 30w, and for four cores, 15w. This kind of TMB may become off the charts. As for power consumption, as the Lineup presentation shows, the 810/808 will use 20nm craftsmanship which can consume less energy. But it’s been reported that Apple has already reserved of TSMC’s 20nm process in 2014.

By the end of the year, we will see quad-core and octa-core cellphones that use the 6xx series, but they probably won’t be as good as the first generation which is definitely very sad.

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