DDR5 memory prices remain high, and relief doesn’t appear to be coming anytime soon. With demand from AI servers and data centers soaking up supply, some analysts believe tight conditions could last well into 2027. For everyday PC builders, that’s pushing upgrades further out of reach.

Instead of waiting, a small group of hardware enthusiasts is trying something unusual: building DDR5 memory modules by hand.

The idea isn’t entirely new. Modders have long experimented with GPU VRAM upgrades by soldering higher-capacity chips onto existing boards. Now, that same mindset is being applied to system memory. The process involves sourcing blank DDR5 PCBs, buying individual memory ICs, and assembling the module manually.

According to Pro Hi-Tech, the parts are easier to find than many would expect. Chinese manufacturers reportedly sell pre-designed DDR5 PCBs, reducing the complexity for experienced builders. The remaining challenge is precision soldering and validation.

A DIY 16GB DDR5 module is estimated to cost around 12,000 rubles, or roughly $150. In comparison, branded retail options such as A-Tech’s 16GB DDR5 5600 MHz module sell for about $190. The gap could widen if component prices fall or if parts are sourced in bulk.

This approach is clearly not for everyone. It requires steady soldering skills, access to testing tools, and a willingness to risk instability or failed modules. There’s also no warranty safety net if something goes wrong.

Even so, the trend reflects growing frustration among PC builders. As DDR5 remains expensive and supply stays tight, DIY memory projects highlight how far some enthusiasts are willing to go to keep their systems moving forward.

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DDR5 memory prices have climbed sharply in recent months, raising concerns among PC builders and gamers. While many expect the situation to drag on for years, a senior figure from Sapphire believes the spike may not last as long as feared.

Speaking on The Hardware Unboxed Podcast, Sapphire PR manager Edward Crisler addressed the current DRAM situation and urged buyers not to panic. According to Crisler, some of the recent price increases appear to be driven by uncertainty rather than actual supply shortages.

Crisler said DDR5 prices are currently “unreasonable” and could discourage people from building or upgrading PCs altogether. He warned that sustained high memory costs don’t just affect RAM sales but can also hurt demand for other components, including motherboards, cases, and graphics cards.

Despite that, he struck a more optimistic tone on timing. Crisler suggested that prices could begin to stabilize in six to eight months, arguing that vendors are reacting defensively to market conditions. He compared the situation to past pricing reactions around US tariffs, where companies raised prices in anticipation of disruption, even when supply wasn’t immediately affected.

That outlook runs counter to many industry forecasts. Several analysts expect elevated memory prices to continue well beyond 2026, largely due to limited production expansion from major suppliers such as Samsung and SK Hynix, which are prioritizing higher-margin AI and data center demand.

Even if prices remain high, Crisler believes PC enthusiasts will adapt, as they have during previous shortages. He pointed to past periods where builders held onto older hardware longer or adjusted system specs rather than paying inflated prices.

For now, his advice is simple: avoid panic buying. Whether prices ease in months or stay elevated longer, the DDR5 market remains volatile, and buyers may be better off waiting for clearer signals before making major purchases.

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If you walk into certain computer shops in the US right now, the RAM aisle looks… unfinished. No price cards, no promos — just empty slots where labels should be. Staff are telling customers to ask for the latest pricing because whatever number they printed yesterday probably isn’t accurate anymore.

RAM prices are increasing so fast, some retailers have basically stopped trying to keep up.

The big twist behind all of this is AI. Demand for high-bandwidth memory (HBM) — the kind used in powerful AI servers — has exploded over the past year. Manufacturers like Samsung, Micron, and SK Hynix earn far more from those chips than from regular DDR5 modules, so factories have shifted their attention. That leaves everyday PC memory in shorter supply… and suddenly much more expensive.

You can see the spike clearly in recent pricing data. Idealo’s tracking shows a popular Crucial Pro DDR5-6400 CL40 64GB kit has almost doubled in price since early October. And the swings aren’t happening gradually — some wholesalers were even adjusting rates several times per day. Retailers buying last-minute stock to avoid empty shelves are getting burned when prices rise again before they can even mark the items.

The whole situation has started to feel less like hardware shopping and more like a crypto chart. On Reddit, frustrated builders are sharing screenshots of RAM that jumped by $20, then $50, then nearly double within just a few days. Upgrades that used to be an easy “grab the 32GB kit and go” are now something people are putting off entirely.

Because of that, many stores are ditching printed tags and replacing them with small notes telling shoppers to check with staff. If you want RAM, you get quoted whatever the price happens to be at that moment — almost like asking for the day’s rate on gold.

No one seems to have a clear answer on when things will settle down. As long as HBM is the money-maker fueling the AI boom, regular consumer memory is likely going to remain pricey and unpredictable. So for PC builders trying to stretch a budget, the old strategy of “wait a few weeks and the price will drop” just doesn’t apply anymore — at least not right now.

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If you’ve been planning a RAM upgrade, you might want to brace yourself. Samsung is reportedly pushing DDR5 contract prices way up—some increases hitting around 60%—and while these are enterprise numbers for now, they almost always spill over into the consumer market sooner or later.

Reuters reports that Samsung has bumped the price of 32GB DDR5 modules to about $239, which is nearly 50% higher than last month. Other capacities, including 16GB and 128GB sticks, are apparently seeing similar jumps. These aren’t retail tags you’ll see on Amazon yet, but they’re still important because they give a pretty clear idea of where the broader market is heading.

The main culprit behind all this is reportedly the AI wave. Big tech companies are scrambling to expand data centers, and those setups chew through enormous amounts of specialized HBM memory to feed modern AI accelerators. With demand exploding on the enterprise side for HBM chips, Samsung and other DRAM makers are funneling more of their production capacity toward those higher-margin orders. That leaves less room for consumer-grade chips. The result is a shortage of standard memory chips (and price hikes) for consumer hardware. And it’s not only DDR5 DRAM—smartphone prices are also tipped to rise in the near future due to this shortage.

With Samsung already rumored to increase the prices, it wouldn’t be surprising if Micron and SK Hynix roll out similar hikes. And because memory contracts often span years, the impact tends to spread slowly but steadily into the consumer space. Even DDR4 could end up riding the same wave simply because manufacturers will charge what the market allows.

For PC builders and gamers, this is yet another headache. GPUs have been volatile, inflation hasn’t exactly gone away, and now RAM—one of the simpler, relatively cheaper upgrades—may start costing noticeably more.

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Gamers and PC enthusiasts looking to push their systems to the limit will be excited about the new co-branded memory from ADATA and Gigabyte: the Obsidian and White Obsidian DDR5. These memory modules boast a custom-designed PCB built for high performance overclocking. The design allows for higher voltages, improved signal transmission, and the ability to manually adjust voltage for even more control.

The supported motherboard list is quite extensive

For those using a compatible GIGABYTE Z790 or B760 AORUS ELITE series motherboard, a one-click overclocking option is available exclusively for Obsidian and White Obsidian memory. This simplifies the process, allowing users to achieve improved memory performance through the AORUS x XPG EZ-OC GIGABYTE Ultra Mode within the BIOS settings.

The supported motherboard list is extensive, including various Z790 and B760 AORUS models, ensuring wide compatibility.

Beyond overclocking prowess, Obsidian and White Obsidian memory also caters to aesthetics. With support for Intel XMP 3.0 and AMD EXPO dual-platform certification, users can enjoy one-click overclocking with pre-set profiles. Additionally, the memory pairs with Gigabyte Smart Concierge (GCC) for customizable RGB lighting effects. This allows for synchronization with other Gigabyte components like the motherboard and graphics card, creating a cohesive and visually stunning lighting setup for your entire PC.

Obsidian and White Obsidian DDR5 memory comes in various capacities and speeds, with prices starting at 449 yuan for a single 16GB 6000MHz module. The price scales with capacity and speed, reaching 1379 yuan for a 48GB 6400MHz kit.

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Samsung has recently announced that it has started mass production of its 16-gigabit (Gb) DDR5 DRAM, utilizing the industry’s pioneering 12-nanometer (nm)-class process technology. This achievement comes after the initial announcement made in December of the previous year.

Boosting AI Applications: The Potential of Samsung’s Newest DRAM

The production process incorporates advanced multi-layer extreme ultraviolet (EUV) lithography, establishing the highest die density in the industry. Consequently, this technology yields a 20% increase in wafer productivity.

Furthermore, this DDR5 DRAM exhibits a considerable reduction in power consumption of up to 23% when compared to previous generations. Samsung asserts that this makes their solution highly suitable for global IT companies aiming to enhance their eco-friendly operations.

The utilization of a new high-κ material contributes to increased cell capacitance. Enhanced capacitance results in a significant electric potential difference in data signals, facilitating more accurate differentiation between them.

The DDR5 DRAM claims to deliver speeds of 7.2 gigabits per second (Gbps). To put this into perspective, it can process two 30-gigabyte (GB) ultra-high-definition movies in just one second. This exceptional speed positions the technology to support an expanding array of applications, including data centers, artificial intelligence, and next-generation computing.

Samsung completed the evaluation of its 16-gigabit DDR5 DRAM for compatibility with AMD in December of last year and continues to collaborate with global IT companies to drive innovation in the next-generation DRAM market.

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Samsung Electronics, SK Hynix, and Micron, the three leading memory chip makers in the world, are reportedly pushing for the popularization of DDR5 memory to help boost the semiconductor market. Industry experts are hopeful that increasing the output and promotion of DDR5 memory will stimulate replacement demand, curbing the downward trend of the semiconductor market.

DDR5 DRAM Performs Twice as Better as DDR4 DRAM

DDR5 DRAM is the latest memory specification introduced by JEDEC, boasting a performance double that of its predecessor, DDR4 DRAM. However, DDR4 DRAM currently dominates the memory market, and experts believe that promoting DDR5 memory is necessary to stimulate demand for newer specifications.

According to market research company OMDIA, DDR5 DRAM is set to take over the memory market by 2024, surpassing DDR4 DRAM. The company predicts that DDR5 DRAM will account for 12% of the DRAM market in 2023, up from just 3% in 2022, and is expected to grow to 27% by 2024, while DDR4 DRAM is expected to fall to 23%.

The popularization of DDR5 memory could have significant implications for the semiconductor market. The semiconductor market has been hit hard by a global shortage of chips, which has impacted various industries, including automobiles, smartphones, and gaming consoles. The promotion of DDR5 memory could help boost the market, as more consumers replace their devices with newer, DDR5-equipped models.

DDR5 memory offers several advantages over its predecessor, DDR4 memory. DDR5 memory has double the data rate, higher memory density, and lower power consumption. These improvements make DDR5 memory ideal for high-performance applications such as gaming, artificial intelligence, and data centers.

The popularization of DDR5 memory is a significant development for the semiconductor market. China saw a 17 percent decline in semiconductor output in 2023 so far. It is expected to help stimulate replacement demand and boost the market, particularly as more consumers upgrade to DDR5-equipped devices. With its higher performance and energy efficiency, DDR5 memory is poised to take over the memory market in the coming years, surpassing DDR4 memory in terms of popularity and usage.

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(Via)

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Samsung Electronics, the South Korean technology giant, reported a staggering 95% drop in operating profit for Q1 2023 compared to the same period last year. The company has attributed this significant decline to the reduced demand for memory chips. While Samsung has not disclosed the exact extent to which it will reduce its memory module production, industry analysts predict a cut of around 25%.

Semiconductor Analyst Minbok Wi from Daishin Securities estimates that Samsung could reduce memory chip production by 20% to 25% in the first half of 2023, compared to the same period in 2022. KB Securities, on the other hand, forecasts that Samsung will reduce NAND flash chip production by 15% and DRAM chip production by over 20%, starting in Q3 2023. Min Seong Hwang, an Analyst at Samsung Securities, believes that if inventory levels do not decrease as expected, the company may need to further reduce production.

Samsung to reduce the production of low-Cost DRAM modules, focus on DDR5

Samsung has stated that it has a sufficient inventory of memory chips to meet mid to long-term demand and is planning to reduce the production of legacy products. Although the company has not specified which memory chips will see a decrease in production, The Korea Herald reports that Samsung will focus on cutting the production of low-cost DRAM modules such as DDR3 and DDR4 due to their dwindling demand. Instead, the company will concentrate its efforts on advanced memory chips like DDR5, which are rapidly gaining popularity.

Recent market trends have not been favorable for Samsung, with the average contract price of an 8GB DDR4 RAM module falling by 19.9% last month, following an 18.1% drop in January. Although prices stabilized in February and March, they have begun to fall once again, despite Samsung’s announcement of a production cut. Market research firm TrendForce predicts a further 15% to 20% drop in prices during Q2 2023 as suppliers grapple with high inventory levels.

While the current outlook for Samsung and the chip industry appears bleak, some analysts remain optimistic, suggesting that a turnaround could be on the horizon in 2024. As the market continues to shift and advanced memory chips like DDR5 gain traction, Samsung’s decision to focus on next-generation technologies could position the company well for a recovery in the coming years.

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Micron Technology is a US-based multinational semiconductor company that has operations in Japan and Taiwan for its chipmaking business. And as both Nikkei Asia and ITHome report, the tech giant will start mass-producing advanced DRAM memory chips at its Japanese Hiroshima plant in Q4 this year.

ITHome reports that on a press media visit to Micron’s A3 chip manufacturing factory, Micron‘s Taiwanese division director, Lu Donghui announced that the A3 factory will be introducing extreme ultraviolet (EUV) lithography equipment in the second half of the year, to prepare early for the mass production of 1-gamma DRAM that is due to launch in 2024.

And as for 1-Beta DRAM Mass Production, it is reported that 1-Beta DRAM will be initially manufactured in Japan, and then the production will switch over to the Taiwanese plant later. For context, the current 1-Alpha DRAM is manufactured in the Taiwanese plant.

And the report by ITHome seems to be valid, as another news outlet, Nikkei Asia has reached out to Chief Business Officer at Micron, Sumit Sadana, regarding the news of 1-Beta DRAM production.

Nikkei Asia quotes Sadana that the company will start mass-producing advanced DRAM memory chips at its Hiroshima plant by the end of the year, which falls in Q4 2022. 

The company is coordinating with the Japanese government and business partners, such as equipment makers, to start producing them in Japan as well, Sadana said in an interview. He did not reveal the size of the investment in the Hiroshima plant but said manufacturing such chips generally requires new equipment and clean rooms.

Micron is expected to determine the scale of its investment based on government subsidies and other factors.

DRAM is used for temporary data storage in a wide variety of electronics, including smartphones and servers. And for Micron’s naming scheme, the company had already mass-produced its 1X, 1Y, 1Z and 1-alpha DRAM. The 1Xnm process is equivalent to 16-19nm, 1Ynm is equivalent to 14-16nm, and the 1Znm process is equivalent to 12-14nm. According to industry sources, the latest 1-alpha, 1-beta and 1-gamma may be equivalent to 14-12nm, 12-10nm and 10nm respectively

Micron has announced in 2021 plans to invest $150 billion in memory manufacturing and research and development worldwide over the next decade. With the company laying out plans for 1-beta production, industry watchers are looking to see where it will manufacture the next-generation 1-gamma DRAM, which is targeted for mass production in 2024.

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(Via 1, Via 2)

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In October 2020, SK Hynix, the second-largest memory chipmaker after Samsung, became the world’s first to release DDR5 DRAM (Double Data Rate dynamic random access memory) chips. The South Korean company continues to maintain its lead in the DDR5 DRAM technology as it announced earlier today that it’s now sampling the world’s first 24Gb (gigabit) DDR5 RAM chips with customers.

According to Yahoo Finance, the announcement came yesterday (December 14th) by SK Hynix, who stated that they have shipped samples of 24 Gigabit (GB) DDR5 DRAM with the industry’s largest density for a single DRAM chip. Previously, memory modules have typically maxed out at 16Gb of capacity per chip.

The rapid development of this higher capacity chip can be credited to SK hynix’s new 1anm manufacturing process, which uses extreme ultraviolet (EUV) lithography. In addition to the increased density, this new process offers an increase in production efficiency and speed by up to 33%. SK hynix expects the product to reduce carbon emissions as well, which is meaningful in the context of ESG management.

The chips also gain some benefits from the new process, including a 25% reduced power consumption for the same capacity, effectively reducing the overall system power draw while potentially offering some extra wiggle room for overclocking.

The initial offerings of the new 24GB capacity chips are set to be 48GB and 96GB modules for supply to cloud data centers. It is also expected to power high-performance servers, artificial intelligence (AI), and machine learning. Additionally, this increase in DDR5 DRAM capacity comes at a crucial time when the world is witnessing the dawn of the Metaverse.

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SK Hynix, the second largest memory chipmaker after Samsung, has just announced earlier today (6th October 2020) that it is the world’s first to release DDR5 DRAM (Double Data Rate dynamic random access memory) chips.

The new DDR5 DRAM chips boast performance upgrades up to 1.8 times faster than the previous DDR4 generation of memory. The South Korean company said that it has completed various tests and has even provided partner companies with its samples for verification. One such partner includes Intel. DDR5 is the next generation of DRAM standard, which will have a broad application ranging from big data, artificial intelligence, machine learning technologies, and more.

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According to SK Hynix, the new DDR5 DRAM supports a transfer rate of 4,800 to 5,600 Mbps, which is 1.8 times faster than the 3,200 Mbps offered by DDR4. Notably, the fastest transfer rate of 5,600 Mbps allows users to transmit about nine FHD movies with a size of 5GB each in just one second. Despite the higher transfer rates, the new DRAM chips are also more energy efficient with operating voltages being lowered from 1.2 volts to 1.1 volts, allowing for 20 percent less power consumption.

The new DDR5 chips are also loaded with error correcting code (ECC) that is capable of correcting DRAM cell’s 1-bit-level errors by itself. Furthermore, the new technology also has increased the reliability of the DDR5 application system by 20 times and allowed a reduction in power consumption and operating costs of data centers. For those unaware, the company had first announced its 16 gigabit DDR5 DRAM back in 2018.

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The current generation of DRAM, DDR4, also known as “double data rate fourth generation” has been around for quite long. The module started to make its way to computers way back in 2014. However, it is only now after four year’s that we’re seeing the very first glimpse of the next generation, i.e. DDR5. SK Hynix, a prominent DRAM manufacturer, has managed to call first dibs on the world’s first 16GB DDR5 memory chip. The chips are also the first DDR5 modules to be compliant with the JEDEC memory standard.

Speaking more about specifications, the new modules are prepared using Hynix’ 10nm fabrication. DDR5 is expected to give much faster transfer speeds, and evidently, the Hynix DDR5 chip can go up to 5200Mbps transfer speeds which is roughly 60 percent faster than DDR4’s 3200Mbps. Furthermore, it will do this consuming 30 percent less power than the previous version. SK Hynix has left out some details including the die size used for the new modules.

The company intends to shore up its DDR5 range with other capacity versions like the 8GB and 32GB. However, the important thing to note is that SK Hynix has only demoed the first chipset. Actual commercial production isn’t expected to start until 2020. It took quite a lot of time before DDR4 RAM modules actually started going mainstream after they were finalized and this is likely to be the case with DDR5 as well.

Apart from SK Hynix, Cadence and Micron have also been working on DDR5 RAM and expecting productions to begin by 2019.

(Via)

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