MediaTek’s new Dimensity 6300 to power next wave of affordable 5G smartphones

Rajesh Regmi — Sat, 20 Apr 2024 04:59:42 +0000

MediaTek is wading into the crowded mid-range market with the Dimensity 6300, a new chipset aimed at powering the next wave of affordable 5G smartphones.

The chip is manufactured on a 6nm process and offers a modest upgrade over its predecessor, the Dimensity 6100+. MediaTek says a 10% bump in CPU performance thanks to two faster Cortex-A76 cores clocked at 2.4GHz. The remaining six cores are Cortex-A55 clocked at 2GHz. Graphics processing is handled by a Mali-G57 MC2 GPU, a familiar choice in this tier.

There’s also an integrated 5G modem compliant with the 3GPP Release 16 standard. More noteworthy might be MediaTek’s claims of improved power efficiency with their UltraSave 3.0+ technology. The company suggests users can expect a 13% to 30% improvement over competitors in sub-6GHz 5G connections.

Moreover, the Dimensity 6300 supports Full HD+ displays with a 120Hz refresh rate. Camera capabilities are mid-range as well, with support for up to 108MP sensors and dual 16MP configurations.

Connectivity options include Bluetooth 5.2 and dual-band Wi-Fi 5 (a/b/g/n/ac), but storage remains limited to UFS 2.2 and RAM is capped at LPDDR4x.

The first smartphone confirmed to utilize the Dimensity 6300 is the Realme C65 5G, expected to launch later this month. With MediaTek leading the charge, we can expect more manufacturers to release similar devices, aiming to offer affordable 5G connectivity.

Although not revolutionary, the Dimensity 6300 is a step forward in making 5G accessible to a broader audience.

Dimensity 6300 Archives - Gizmochina

MediaTek’s new Dimensity 6300 to power next wave of affordable 5G smartphones