Dimensity 7000 Archives - Gizmochina

MediaTek Dimensity 8000 to launch soon, Key Specs revealed: Report

Sean — Thu, 16 Dec 2021 09:16:46 +0000

While the MediaTek Dimensity 9000 is set to power a wave of new top end 2022 smartphones, the company is also planning on launching new Dimensity 7000 chip for mid range models as well. However, a new report has suggested that it might be called Dimensity 8000 and could be launching soon.

A known Weibo tipster believes that the Taiwanese chipmaker is reportedly planning on launching the Dimensity 8000 chip soon. This mid range chipset is apparently built on TSMC’s 5nm process and comprises of four Cortex A78 cores that clock in at 2.75GHz and four Cortex A55 cores that have a 2.0GHz clock speeds. For graphics, the chipset arrives with the Mali G510 MC6 GPU.

The tipster further added that the Dimensity 8000 chip will support FHD+ displays with up to 168Hz refresh rate or QHD+ displays with 120Hz refresh rate. Other features include support for LPDDR5 RAM, UFS 3.1 storage and possibly even up to 75W fast charging as well. Notably, the tipster further added that the Dimensity 8000 chip will be featured in certain Redmi and Realme smartphones. From these specs, it appears that the Dimensity 8000 could be a cut down version of the higher end Dimensity 9000 SoC.

Interestingly, the chipmaker has also opened its flagship Dimensity store on popular e-retailing website JD.com. In this store, the Dimensity store will be divided into different sections including 9000 series, 1000 series, 900 series, 800 series, and 700 series chipsets. Within these sections, users are shown smartphones from different brands that feature any of these SoCs. This includes models from Xiaomi, OPPO, Vivo, and others that are displayed. At the moment, the first batch of smartphones with Dimensity 9000 chip is expected to launch in the first quarter of next year.

Dimensity 7000’s new details leaked, may surpass Snapdragon 870 in performance

Anvinraj Valiyathara — Tue, 30 Nov 2021 03:50:40 +0000

MediaTek is expected to soon announce the Dimensity 7000 chipset. It is said to be a toned-down version of the Dimensity 9000 SoC that was announced recently. Reliable tipster Digital Chat Station had recently shared the specs of the CPU and GPU information on the Dimensity 7000. Now, he has shared some new details of the SoC.

It is speculated that the upcoming Dimensity 7000 will be a 5nm chipset. The octa-core chip is expected to arrive with four Cortex-A78 CPU cores working at 2.75GHz and four Cortex-A55 CPU cores ticking at 2.0GHz. For graphics, it may arrive with Mali-G510 MC6 GPU. A recent report had suggested that the Dimensity 7000 powered phones may support up to 75W fast charging.

The Dimensity 7000 is said to be MediaTek’s next best chip after the Dimensity 9000. Today, the tipster claimed that D7000 can handle Full HD+ resolution with up to 168Hz refresh rate or Quad HD+ resolution with up to 120Hz resolution. The SoC is also expected to carry support for LPDDR5 RAM and UFS 3.1 storage.

As far as performance is concerned, the tipster claimed that the Dimensity 7000’s benchmarking score on GFX ES 3.0 is similar to the Snapdragon 870. He added that the AnTuTu score of the Dimensity 7000 is even better. There is no word on the launch date of the SoC. While the Dimensity 9000 has been already announced, MediaTek will be holding a dedicated unveiling event for it on Dec. 16 in China. Probably, the company may unleash the Dimensity 7000 SoC through the same event.

Redmi K50 series likely to arrive with MIUI 13, Dimensity 7000, Dimensity 9000

Anvinraj Valiyathara — Tue, 30 Nov 2021 03:28:28 +0000

Earlier this month, a Chinese tipster claimed that the Redmi K50 series will come with four different chipsets such as Snapdragon 870, Snapdragon 8 Gen 1, Dimensity 7000, and Dimensity 9000. Now, reliable tipster, Digital Chat Station has also tipped on the SoCs that will power some of the Redmi K50 phones.

According to the tipster, the Redmi K50 models will come preinstalled with the latest MIUI 13. Past reports have claimed that even the Xiaomi 12 and Xiaomi 12X that are expected to launch in December will arrive with MIUI 13 preinstalled. However, it is unclear whether these devices will get MIUI 13 based on Android 12 or Android 11.

The tipster has reiterated that the Redmi K50 models will feature the Dimensity 7000 and Dimensity 9000 chipsets. He added that the performance of these chipsets is not as fast as that of the Snapdragon 870 and Snapdragon 8 Gen 1 SoCs.

Redmi K40 Gaming

MediaTek had recently announced the Dimensity 9000 as the world’s first SoC built with TSMC’s 4nm processing technology. The Dimensity 7000 is yet to go official.

It is speculated that Xiaomi devices codenamed Matisse (L10 shortened model number) and Rubens (L11A shortened model number) may debut in the Chinese market as the Redmi K50 series gaming smartphones. It is believed that the Matisse model will be powered by the Dimensity 9000 SoC. This phone is speculated to carry POCO branding in other markets. This device is speculated to feature specs like a 120Hz or 144Hz OLED screen, an in-display fingerprint scanner, a 64-megapixel + 13-mgeapixel + 8-megapixel + 2-megapixel quad-camera unit. It is speculated that there is another variant of this phone with a 108-megapixel primary camera. This phone may launch in the Chinese market as the Redmi K50 Gaming or K50 Gaming Pro and it may arrive as the POCO F4 GT in other markets.

On the other hand, the Xiaomi Rubens debuted as the Redmi K50 Gaming Standard Edition. It is likely to feature the Dimensity 7000 and a triple camera unit led by a 64-megapixel camera.

Dimensity 7000 key specifications tipped, likely to rival Snapdragon 870

Anvinraj Valiyathara — Mon, 29 Nov 2021 05:05:12 +0000

MediaTek has recently announced the Dimensity 9000 chipset, and it will be holding a dedicated event for it on Dec. 16 in China. The Taiwanese company is expected to reveal some more information on the D9000 chip on the said date. Recent reports have revealed that the company is also working on another chip called the Dimensity 7000. Today, reliable tipster Digital Chat Station shared the key details of the SoC.

The Dimensity 9000 is the world’s first 4nm chip. Recent reports have revealed that the upcoming Dimensity 7000 will be built with TSMC’s 5nm processing technology. New information reveals that the octa-core chip will include four Cortex-A78 cores working at 2.75GHz and four Cortex-A55 cores clocking at 2.0GHz.

The Dimensity 7000 will include Mali-G510 MC6 graphics. It is speculated that the SoC will rival Qualcomm’s Snapdragon 870 mobile platform. Recently, the same tipster had recently claimed that the Dimensity 7000 will come with support for 75W fast charging.

The above-mentioned rumored specs indicates that the Dimensity 7000 will be placed between the Dimensity 1200 SoC and the Dimensity 9000 chip. A recent Weibo post by Redmi General Manager Lu Weibing suggested that Redmi could be one of the first brands to launch a Dimensity 7000 SoC powered phone.

The testing phase of the Dimensity 7000 has reportedly started. Hence, it is speculated that the SoC may go official in December 2021 or January 2022. The first phones powered by the D7000 may break cover by Q1 2022.

Redmi GM teases a Dimensity 7000 smartphone

Sudarshan Ravichandran — Thu, 25 Nov 2021 09:37:02 +0000

MediaTek is expected to announce a lower variant of its newly unveiled Dimensity 9000 SoC. This upcoming chipset is said to go official as Dimensity 7000. Ahead of that, the General Manager of the Redmi brand teases this silicon.

Redmi Note 10 Pro 5G

A couple of days back, Redmi GM Lu Weibing teased the yet-to-be-announced Dimensity 7000 chip on Weibo by questioning what kind of processor it is. This clearly suggests that there will be Redmi smartphones powered by this SoC as the executive is known for vague teasers.

Although the Xiaomi group exec doesn’t hint at the device, we can speculate it to be the recently spotted Xiaomi Rubens (L11A), which is expected to house the unreleased MediaTek silicon. Currently, there’s only a Chinese variant of this phone with model number 22041211AC.

As of now, we only know that the handset will feature a triple camera array on the rear. This setup will include a 64MP Samsung ISOCELL GW3 primary sensor.

As far as the marketing name is concerned, it is rumored to go official as Redmi K50 Gaming Standard Edition. While the Xiaomi Matisse (L10) with a MediaTek Dimensity 9000 is said to release as Redmi K50 Gaming Pro.

We look forward to learning more about Xiaomi Rubens before its launch via certifications, leaks, and teasers in the coming days.