If you thought Qualcomm’s Snapdragon 8 Elite Gen 5 flex in the flagship charts this month was impressive, wait till you see what happened in the mid-range segment. 

AnTuTu also shared its October 2025 list of the top 10 Android mid-range phones recently, and MediaTek has officially locked down the entire leaderboard. Every single phone in the ranking is powered by a Dimensity chip. Yes, all ten.

Leading the pack is Realme’s Neo7 SE, running the Dimensity 8400-Ultra, with a beefy average score of 1,931,641. Following right behind are the iQOO Z10 Turbo and Vivo Y300 GT, both using the standard Dimensity 8400 chip, scoring 1,915,499 and 1,909,184, respectively. 

It’s all Dimensity from top to bottom

Fourth place goes to the Redmi Turbo 4, again rocking a Dimensity 8400-Ultra at 1,868,587 points. After that, the list starts mixing in slightly different Dimensity flavors. 

Oppo’s Reno 14 series grabs fifth and sixth place with the Dimensity 8350 and Dimensity 8450. Rounding out the top 10 are phones like the Motorola Edge 60 Pro and OPPO K13 Turbo 5G, all sticking with Team MediaTek.

Every device in the top 10 crosses 1.28 million points, which tells how strong the upper-midrange category has become. To say the least, these scores are similar to the flagship phones of 2022 / 2023. 

It’s absolutely surprising that not even a single Snapdragon-powered phone has made it to the top 10 list. Qualcomm’s direct rival to the Dimensity 8400 is the Snapdragon 8s Gen 4 / Snapdragon 7 Gen 4. However, MediaTek’s adoption is clearly much higher in the mid-range segment, and it’s clearly winning there.

It’s also worth noting how AnTuTu calculates its rankings. Instead of reporting one best benchmark attempt, the score is the average score for that model across the month.

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MediaTek has officially unveiled the Dimensity 8400, the successor to last year’s Dimensity 8300. Designed for the premium mid-range smartphone market, this new chipset offers significant performance gains and improved energy efficiency. It aims to deliver a flagship-level experience at a more affordable price.

Xiaomi has revealed that the Redmi Turbo 4 will be the first smartphone of 2025 to feature the Dimensity 8400-Ultra. The launch date is set to be announced on January 1st.

MediaTek Dimensity 8400 Specifications

Coming to the Dimensity 8400, the chipset with an all-big-core design is built upon the latest Arm Cortex-A725 cores and boasts a remarkable 3.25GHz clock speed, delivering a 10% increase in single-core performance while simultaneously reducing power consumption by a substantial 35%. This achievement is attributed to a significant enhancement in the chip’s cache system.

On the graphics front, the integrated Arm Mali-G720 GPU delivers a 24% boost in peak performance and a 42% reduction in power consumption, ensuring an exceptional gaming experience. The introduction of the innovative StarSpeed Engine dynamically optimizes resource allocation in real-time, adapting to the demands of each game to deliver smooth and sustained gameplay at 60 fps while keeping the device cool.

The chipset also features the powerful MediaTek NPU 880, enhancing AI performance for tasks like language model processing and image generation. Powered by the Dimensity AI engine, it supports complex on-device models, enabling faster and higher-quality content creation, including features like large language models and Stable Diffusion 1.5.

For imaging, the chipset integrates the MediaTek Imagiq 1080 ISP image processor and a dedicated QPD zoom hardware engine. This powerful combination enables all-domain depth focusing, resulting in more precise and rapid photography.

The Dimensity 8400 is poised to significantly impact the mid-range smartphone market, offering a compelling blend of performance, power efficiency, and advanced features. With the Redmi Turbo 4 leading the charge, we can expect to see a wave of exciting new devices powered by this powerful new chipset in the coming months.

Talking about the Redmi Turbo 4, it is expected to feature a 6.67-inch LTPS OLED panel with a 1.5K resolution, 120Hz refresh rate, and an in-screen fingerprint sensor. It may offer up to 12GB RAM, 512GB storage, a 6,550mAh battery with 90W fast charging, and HyperOS 2.0-based Android 15. The device is rumored to have a plastic frame, glass back, and is likely to launch in China by early January 2025. The device will be rebranded as the Poco F7 for the global market.

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Earlier this week, a report suggested that MediaTek’s upcoming Dimensity 8400 SoC might adopt an all-big-core design similar to the more powerful Dimensity 9400. Now, it seems that rumor might be accurate if a fresh tip from tech insider Digital Chat Station (DCS) is to be believed.

Today, DCS shared details on the CPU architecture of the upcoming SoC, and we are looking at a core structure loaded with ARM’s high-performance cores.

MediaTek Dimensity 8400 CPU/GPU Details

The Dimensity 8400 is said to feature an octa-core CPU with a 1+3+4 design, built on TSMC’s 4nm process. At the heart of it is ARM’s Cortex-A725 core, clocked at over 3GHz.

Interestingly, it’s not just one Cortex-A725 at play; MediaTek will reportedly include three more, each clocked close to 3GHz but slightly lower than the main prime core. 

For lighter tasks, MediaTek is reportedly using three ARM Cortex-A720 cores, which are “premium efficiency” cores—a notable upgrade from the Cortex-A510 cores in the Dimensity 8300. These A720 cores should operate efficiently around the 2.0GHz range to manage everyday processes with ease. Note that even Dimensity 9400 takes these cores in use.

The graphics department might see some familiarity. The Dimensity 8400 reportedly uses the same GPU IP – the Arm Immortalis-G925 – as its bigger brother, the Dimensity 9400. 

Whether it’ll have the same number of cores remains a mystery for now. DCS also mentions that the chipset’s performance is still under optimization, so final clock speeds and performance figures might change.

It’s still unclear which phone will be the first to feature the Dimensity 8400. However, speculation leans toward either a model from the upcoming Redmi K80 series or Oppo’s Reno 13 lineup. More details about these devices, along with the final specs of the Dimensity 8400, are likely to surface in the coming weeks. We will keep you updated on that.

(Source)

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Less than a month after the Dimensity 9400 launch, we already have a couple of flagship devices featuring this processor. More are expected to launch later this year and in 2025. While the Dimensity 9400 is MediaTek’s flagship offering, we also expect a sub-premium Dimensity 8400 SoC from MediaTek by the end of the year.

A well-known tipster on Weibo, Digital Chat Station, now has revealed the first details about the processor’s core structure.  

MediaTek Dimensity 8400 Specifications

According to DCS, the Dimensity 8400 will use TSMC’s 4nm manufacturing process, the same as its predecessor. However, the real highlight of the SoC could be its “full-core” or all-big-core architecture.

MediaTek embraced the all-big core design for its SoCs, starting with the Dimensity 9300. The Dimensity 9400 continues this trend, and Qualcomm has also announced its latest flagship SoC, the Snapdragon 8 Elite, with an all-big-core design.

If the new leak from DCS is accurate, MediaTek may introduce a similar architecture for the Dimensity 8400. The prime core in this SoC appears to be the new ARM Cortex-A725.

With this new architecture, the tipster claims the SoC will achieve an AnTuTu benchmark score between 1.7 and 1.8 million. For reference, the tipster notes that the Snapdragon 8 Gen 2 scores around 1.6 million, while the Snapdragon 8 Gen 3 scores about 2 million. This means the Dimensity 8400 will outperform the 8 Gen 2 and get closer to the performance levels of the 8 Gen 3.

While MediaTek has not announced a launch date for the Dimensity 8400, the SoC recently appeared in Xiaomi’s HyperOS codebase. This suggests that either a Xiaomi, Redmi, or Poco device featuring the chip is in development. The chipset carries the model number “MT6899.”

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MediaTek’s new processor Dimensity 8400 has been leaked. This processor is a new SoC, the successor to the Dimensity 8300. People are very curious about what Dimensity 8400 has to offer. The Gizmochina team spotted the Dimensity 8400 in Xiaomi’s HyperOS software. This means that we will see a Xiaomi, Redmi, or POCO model with Dimensity 8400 to be unveiled in the near future. Also, the testing of new processors by companies like Xiaomi aims to ensure a smooth user experience.

MediaTek Dimensity 8400 appears suddenly in Xiaomi HyperOS

The sudden appearance of the MediaTek Dimensity 8400 in HyperOS took everyone by surprise. This is an indication that a Xiaomi, Redmi, or POCO model with Dimensity 8400 is being actively tested. What does Dimensity 8400 have to offer? Unfortunately, the specifications of the processor are unknown, but there should be a significant increase in performance and power efficiency compared to Dimensity 8300. Dimensity 8400 has been spotted in HyperOS with the model number “MT6899”. The previous Dimensity 8300 had the model number “MT6897”.

This photo shows the model number of the processors. We have listed the model numbers in a way that you can understand them:

• Dimensity 8200 – MT6896
• Dimensity 8300 – MT6897
• Dimensity 8400 – MT6899
• Dimensity 9300 – MT6989
• Dimensity 9400 – MT6991

Dimensity processors are very fast, and consume less power. With the Dimensity 8400 spotted, we will see many new high-performance smartphones. This is a good development. It’s also worth noting. MediaTek may have accidentally added the Dimensity 8400 to its website. Because, we also spotted the MT6899 model number on the official MediaTek website.

Look carefully at the model numbers on the MediaTek official website, the processors are listed as MT6896, MT6897 and MT6899. We have already prepared a list above and mentioned that these processors are Dimensity 8200, Dimensity 8300, and Dimensity 8400 respectively. So when will Dimensity 8400 be introduced? Unfortunately, we don’t know that. We can only confirm that the processor is being actively tested. We will come to you with new information.

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MediaTek‘s upcoming flagship SoC, the Dimensity 9400, has been a hot topic in the rumor mills for months now. However, it might not be the only high-end chip the company is developing. Leaker Digital Chat Station in a recent Weibo post revealed that MediaTek is also working on the Dimensity 8400, a sub-flagship SoC with impressive performance.

The leak reveals that the Dimensity 8400 scores between 1.7 million and 1.8 million on the AnTuTu benchmark. This score puts it on par with, or even ahead of, the recently announced Qualcomm Snapdragon 8s Gen 3, which manages around 1.7 million points in the same test.

But raw power isn’t the only story. The tipster mentions that the most affordable smartphone with the Dimensity 8400 could cost as low as 1,500 yuan (roughly $200). If true, the devices with this SoC will not only offer better performance than their Qualcomm counterparts but will also be cheaper.

Additionally, Chinese tech outlet IT Home reports that in April, Digital Chat Station revealed that Redmi is working on smartphones with various processors, including the Dimensity 9300+, Dimensity 8400, Snapdragon 8 Gen 3, and the upcoming Snapdragon 8 Gen 4.

Interestingly, three of these Redmi models are rumored to share design features, such as a metal frame, glass body, 1.5K or 2K displays, 100W fast charging, and large batteries. 

While it’s not confirmed which Redmi phone will use the Dimensity 8400, it might be part of the upcoming K80 series, though this is just speculation on our part.

Keep in mind that these details are still based on rumors, so the official benchmark scores and pricing for the Dimensity 8400 phone could differ from what’s mentioned above. But if the leaks are accurate, the Dimensity 8400 might offer flagship-level performance at a mid-range price, making the smartphone market even more competitive. 

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