MediaTek will unveil the Dimensity 9600 chip built with 2nm process later this year. This chip is designed to power the upcoming flagship phones, such as Vivo X300 series and Oppo Find X10 lineup. A new development reveals that the brand is also working on a new chip called the Dimensity 8600. Here’s a look at the first details about that have surfaced today.

Dimensity 8600 to be built with 3nm process

According to a new leak shared by tipster Digital Chat Station, MediaTek’s upcoming Dimensity 8600 chipset is expected to deliver a major generational upgrade for the company’s upper mid-range smartphone lineup. The tipster claims the chip will be built on a 3nm process and feature significant improvements in both architecture and manufacturing technology, marking one of the biggest upgrades yet for MediaTek’s mid-range performance-focused chips.

To recall, the Dimensity 8500, which debuted first in China in January this year, is a 4nm chip. It powers the likes of Redmi Turbo 5, Poco X8 Pro, Honor Power 2, iQOO Z11 (Chinese), Motorola Edge 70 Pro, and Oppo K15 Pro.

Coming back to the leak, it further suggests that smartphone brands such as Oppo, Vivo, Xiaomi, Honor, and their sub-brands are already evaluating new devices powered by the Dimensity 8600. Some of these upcoming phones are also tipped to feature massive batteries exceeding the 10,000mAh mark. The new devices are expected to be launched around the end of this year.

One of the upcoming devices appears to be the Honor Power 3. It remains to be seen whether the Redmi Turbo 6 and Poco X9 Pro and successors of the above-mentioned phones will feature the D8500 chip.

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The post Dimensity 8600 with 3nm process in works, flagship-level upgrades expected appeared first on Gizmochina.