The Dimensity 9400 is a true flagship chipset from MediaTek, featuring an all-big-core CPU design that aims to deliver high peak and sustained performance. It’s powerful enough to rival Qualcomm’s Snapdragon 8 Elite, even if it trails in a few areas, as noted in our detailed comparison. That makes the Snapdragon 8 Gen 5 an interesting opponent.

Announced in November 2025, the Snapdragon 8 Gen 5 sits just below the Snapdragon 8 Elite and therefore is an exciting matchup against the Dimensity 9400. The big question is: can Qualcomm’s sub-Elite flagship hold its ground against MediaTek’s all-big-core powerhouse?

Let’s begin with the spec sheet:

Dimensity 9400 vs Snapdragon 8 Gen 5: Benchmark score

Note: The benchmark tests were performed on the Vivo X200 Pro (powered by Dimensity 9400) and the OnePlus 15R (powered by Snapdragon 8 Gen 5).

Geekbench score

The single-core scores are pretty close, but Qualcomm holds a slight 4.5% lead. The gap widens in multi-core performance, where the Snapdragon 8 Gen 5 posts a 9% higher score than the Dimensity 9400.

Geekbench scores suggest higher peak performance for the Snapdragon 8 Gen 5. In everyday tasks like browsing the internet, scrolling through your social app feeds, and watching movies, you’d hardly be able to spot a difference.

AnTuTu score

On the AnTuTu benchmark, the Snapdragon 8 Gen 5 scores nearly 3 million, while the Dimensity 9400 reaches 2.7 million. That’s about a 9% higher score for the Snapdragon chip.

The Snapdragon 8 Gen 5 consistently outperforms the Dimensity 9400 across every AnTuTu test, though the difference is not significant. The CPU score is 7% higher, and the GPU score is 5% higher. The memory and UX scores also favor the Snapdragon chip.

The benchmarks favor Snapdragon 8 Gen 5 over the Dimensity 9400 in terms of performance, but they don’t provide insights into the capabilities of connectivity, camera, and other important aspects of the chips. So, let’s dig further to uncover the real-world differences between the two high-end chips.

Dimensity 9400 vs Snapdragon 8 Gen 5: Key differences

Both Dimensity 9400 and Snapdragon 8 Gen 5 are manufactured using TSMC’s 3nm process, but the latter uses the N3P node, which offers slightly better performance and power efficiency over the N3E node used for the Dimensity 9400.

Furthermore, the chips differ greatly in terms of CPU architecture. The Dimensity 9400 has a 1+3+4 layout, featuring one Cortex-X925 prime core, three Cortex-X4 performance cores, and four Cortex-A720 performance cores. In contrast, the Snapdragon 8 Gen 5 features a 2+6 CPU layout with two Oryon prime cores and six Oryon performance cores.

Notably, the Snapdragon 8 Gen 5 features third-generation Oryon cores, the same CPU cores from the top-tier Snapdragon 8 Elite Gen 5 chipset. They offer better performance and power efficiency than those inside the Dimensity 9400. Plus, they run at higher speeds, offering an additional performance boost.

For graphics rendering, the Dimensity 9400 relies on the Mali-G925 Immortalis MP12 GPU, while the Snapdragon chip uses the Adreno 829 GPU with the new Sliced architecture. Both chips offer ray tracing capabilities, along with their own set of gaming features: Snapdragon Elite Gaming on the Snapdragon 8 Gen 5 and MediaTek HyperEngine Gaming Technology on the Dimensity 9400.

The Snapdragon 8 Gen 5 also maintains an edge in imaging capabilities, as it borrows the triple 20-bit ISP from the Snapdragon 8 Elite Gen 5 with strong “always-sensing” camera support. The Dimensity 9400 features an Imagiq 1090 ISP with emphasis on HDR video across the zoom range and AI-assisted zoom features.

Both chipsets offer robust connectivity features, although the Snapdragon chip may have some advantage here, thanks to mature modem and better carrier-integration in some regions. Furthermore, the chip supports mmWave, UWB, and dual-way satellite connectivity, which are not mentioned on the official Dimensity 9400 page.

Dimensity 9400 vs Snapdragon 8 Gen 5: Conclusion

The Snapdragon 8 Gen 5 holds an upper hand in almost every aspect over the Dimensity 9400. It offers better CPU and GPU performance, a more powerful ISP with greater capabilities, and advanced connectivity features.

That said, the Dimensity 9400 is still a capable high-end chipset with strong performance and robust connectivity. Plus, you’ll likely get a device powered by this chip at a lower price than one powered by Snapdragon 8 Gen 5. That makes it a sweet deal for those looking for a high-performance device at an affordable price. For the absolute best of the two, the Snapdragon 8 Gen 5 is clearly the better choice.

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The Dimensity 9500 is the latest and greatest mobile chipset from MediaTek, promising a significant boost to performance and power efficiency across CPU and GPU. The NPU, camera, and connectivity have also received notable upgrades, making it a well-rounded option for high-end devices.

Built on TSMC’s 3nm (N3P) process node, the latest Dimensity chip adopts a third-generation “All Big Core” CPU design featuring ARM’s latest C1-series processors, which promises a significant boost to performance and power efficiency. The new 12-core Mali-G1 Ultra GPU also delivers notable performance gains and enhancements for ray tracing.

The Dimensity 9500 looks excellent on paper, but how big of an upgrade is it over last year’s Dimensity 9400? Let’s look at the benchmark scores to find out.

Dimensity 9500 vs Dimensity 9400: benchmark score

Note: The benchmark scores were obtained from leaked listings of Vivo X300 Pro (Dimensity 9500). For Dimensity 9400, we used the Vivo X200 Pro.

Geekbench score

On the Geekbench 6 platform, the Dimensity 9500 gets 3,177 in single core, which is about 18% higher than the Dimensity 9400. The gap widens further in multi-core, where the Dimensity chip has posted a total score of 9,701, while its predecessor couldn’t cross the 8,000 mark. That’s a solid 25% gain in multi-core score for the newer chip.

AnTuTu score

On the AnTuTu benchmarking platform, the Dimensity 9500’s total score crosses the 4 million mark, which is a big achievement in itself. This is about 57% higher than Dimensity 9400.

The breakdown reveals that the Dimensity 9500’s CPU achieves a significantly higher CPU score (1,043,247 vs 591,239). That’s a solid 76% increase. The GPU gets a 32% higher score (1,510,982 vs 1,144,638). The memory (667,254 vs. 411,334) and the UX (790,449 vs. 394,544) have also gained about 62% and 100% higher scores, respectively.

The latest advancements to the Dimensity 9500 are the driving factors behind this significant gap, but this is also partly due to differences in AnTuTu versions. The AnTuTu score for the Vivo X200 Pro (powered by Dimensity 9400) is from AnTuTu v10, while the X300 Pro (powered by Dimensity 9500) is tested on a newer version, v11. So, we’ll update the score for Dimensity 9400 after benchmarking on the same AnTuTu version for a fair comparison.

Dimensity 9500 vs Dimensity 9400: spec sheet

Key upgrades to Dimensity 9500

The Dimensity 9500 brings comprehensive upgrades across all major components. It’s built on TSMC’s 3nm (N3P) process node, which offers better performance and power efficiency over the N3E node used for Dimensity 9400.

CPU, GPU, and NPU

The latest Dimensity chip adopts MediaTek’s third-generation “All Big Core” CPU design, featuring ARM’s latest C1-series processors. The chipmaker claims a 32% uplift in single core performance and a modest 17% jump in multi-core performance. Remarkably, the Ultra core achieves 55% lower power consumption at peak performance, while there’s a 37% reduction in power consumption at peak CPU usage. The overall chip is 30% more power efficient during multitasking in gaming and social audio applications.

The Dimensity 9500 also brings significant upgrades to graphics capabilities and gaming experience. The new 12-core ARM Mali-G1 Ultra GPU, combined with MediaTek HyperEngine Gaming Technology, offers 33% faster GPU performance and 42% improved power efficiency at peak performance. Furthermore, the Dimensity 9500 claims a 119% boost to raytracing performance.

The chip introduces MRFC 3.0 technology to upgrade 60fps titles to 120fps. In fact, it’s the first mobile chipset to support 120FPS raytraced mobile gaming. Furthermore, the Dimensity 9500 debuts two first-to-market features: support for the Vulkan Raytracing Pipeline and native Unreal Engine 5.5+ integration, further enhancing the gaming experience. The GPU also supports advanced gaming technologies, including MegaLights and Nanite, enabling console-class rendering and lighting effects on mobile devices.

The Dimensity 9500 introduces the ninth-generation MediaTek NPU 990, paired with Generative AI Engine 2.0 doubles the computer power for seamless and immediate AI execution. Furthermore, it offers 100% faster 3 billion parameter LLM output, 128K token long text processing, and 4K ultra-high-definition image generation on-device. On top of this, the peak power consumption has reduced by 56%.

Storage, Camera, and Connectivity

The storage read/write speed has doubled compared to UFS 4.0 in the Dimensity 9400. This also helps in 40% faster loading of AI models. There’s no change to memory, though — still LPDDR5X at 10667 Mbps.

The Dimensity 9500 still supports up to 320MP camera, but it introduces a new Imagiq 1190 ISP with higher bandwidth and lower latency, and brings support for RAW-domain pre-processing for cleaner detail and color fidelity. It introduces a powerful AI denoise technology, which works with up to 200MP camera capture. The video capture capabilities have also improved, with the inclusion of support for 4K/120fps video capture with EIS and 4K/60fps cinematic video capture. In contrast, the Dimensity 9400 only supports 4K/60fps video capture.

The connectivity part has also received several upgrades, including a 10% reduction in power consumption for 5G, a 20% reduction in power consumption for Wi-Fi, and a 50% reduction in latency, thanks to AI-assisted technologies. The AI also helps to achieve 20% higher signal accuracy. The peak connection speed on a 5G network has increased to 7.4Gbps (up from 7Gbps), while the peak Wi-Fi speed remains unchanged at 7.3Gbps.

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The Snapdragon 8 Elite, announced in October 2024, is Qualcomm’s most powerful smartphone chipset that promises huge upgrades over its predecessors. It boasts a powerful CPU with a peak frequency of over 4GHz and an Adreno 830 flagship GPU that does the heavy lifting when it comes to graphics-related tasks.

The Dimensity 9400, on the other hand, was also announced in October 2024. It also features powerful CPU cores with slightly lower peak frequency. However, the flagship-grade Mali-G925 Immortalis MP12 GPU runs at a higher frequency than the Adreno 830.

Both Qualcomm and MediaTek promise massive upgrades to their respective chips, but how do they stack up against each other? Let’s look at the benchmark numbers. Plus, we’ll also look at the key differences in this article for better understanding.

Snapdragon 8 Elite vs Dimensity 9400: Benchmark comparison

Note: The tests were conducted on the iQOO 13 (powered by Snapdragon 8 Elite) and Oppo Find X8 Pro (powered by Dimensity 9400).

AnTuTu comparison

In AnTuTu benchmarks, the Snapdragon 8 Elite edges out the Dimensity 9400 with a slightly higher overall score. While both chipsets perform exceptionally well, the Snapdragon leads in CPU, memory, and UX performance. However, the Dimensity 9400 actually pulls ahead in GPU performance. Overall, the difference is minor, and both chips are powerhouses in the Android flagship space.

Geekbench comparison

In Geekbench tests, the Snapdragon 8 Elite is ahead in both single-core and multi-core performance. Its higher scores suggest snappier responsiveness in everyday tasks and stronger multitasking capabilities than Dimensity 9400. That said, the Dimensity 9400 still delivers excellent performance and remains close behind, making it a strong competitor in the flagship segment.

3DMark Wild Life Extreme Stress Test

The Snapdragon 8 Elite delivers higher peak performance, but its lower stability score suggests it throttles more under sustained load. Meanwhile, the Dimensity 9400 offers slightly lower peak performance but maintains better thermal stability as compared to the Snapdragon chip.

Snapdragon 8 Elite vs Dimensity 9400: key differences that matter!

CPU

Both Snapdragon 8 Elite and Dimensity 9400 are built using TSMC’s 3nm cutting-edge technology, but they greatly differ in terms of core design and architecture. The 8 Elite, for instance, has two Oryon cores running at 4.32GHz and six Oryon cores at 3.53GHz. This is also the first Qualcomm mobile chipset to feature Oryon cores.

On the other hand, the Dimensity 9400 uses a 1+3+4 core design, featuring one Cortex-X925, three Cortex-X4, and four Cortex-A720 cores. Its peak frequency is slightly lower, at 3.63GHz, versus 4.23GHz on the Snapdragon 8 Elite.

GPU

The Snapdragon 8 Elite has a capable Adreno 830 GPU that runs high-end games smoothly at consistently high frame rates. The Dimensity 9400, on the other hand, has a Mali-G925 Immortalis MP12 GPU, which is also great for smartphone gaming.

Although both GPUs offer excellent gaming performance, the Mali-G925 Immortalis MP12 GPU is slightly ahead on the benchmarks. The latter GPU benefits from higher frequency, FLOPS, and number of pipelines.

Connectivity

The Snapdragon 8 Elite has an X80 5G modem with up to 10Gbps peak download speed and up to 3.5Gbps peak upload speed. Through Wi-Fi 7, the chip allows a maximum speed of 3.5Gbps. Qualcomm has equipped the chip with many enhancements for reliable and faster connectivity, such as Qualcomm 5G Ultra-Low Latency Suite, Qualcomm Power RF Efficiency Suite, Qualcomm RF Uplink Optimization, Qualcomm Smart Transmit Gen 5 technology, and Qualcomm 5G PowerSave Gen 5.

The Dimensity 9400 comes with a 5G advanced modem that offers a peak speed of 7Gbps, slightly lower than the other chip. It also supports Wi-Fi 7 with a peak speed of 7.3gbps, higher than the Snapdragon chip.

Snapdragon 8 Elite vs Dimensity 9400: Conclusion

Both the Snapdragon 8 Elite and Dimensity 9400 are top-tier flagship chipsets, and the performance gap between them is narrower than ever. Qualcomm’s Snapdragon 8 Elite excels in CPU performance, multitasking, and overall responsiveness, making it ideal for power users and gamers who demand peak performance. On the other hand, MediaTek’s Dimensity 9400 holds its own with higher GPU benchmarks and better thermal stability during sustained workloads, which is crucial for longer gaming sessions. 

If you want the absolute best, the Snapdragon 8 Elite might be the better choice. But if you’re looking for a more balanced chip with solid GPU power and better-sustained performance under stress, the Dimensity 9400 is a compelling choice. In the end, both chipsets are incredibly powerful, and your decision may come down to other factors like device pricing, cooling system, software optimization, and brand preference.

Snapdragon 8 Elite phones:

• Samsung Galaxy S25 / S25+ / S25 Ultra
• iQOO 13
• OnePlus 13
• Realme GT 7 Pro

Dimensity 9400 phones:

• Vivo X200
• Vivo X200 Pro
• Vivo X200 Pro mini
• Oppo Find X8
• Oppo Find X8 Pro
• iQOO Neo 10 Pro

The post Snapdragon 8 Elite vs Dimensity 9400: Benchmark showdown appeared first on Gizmochina.

Smartphone chipsets have reached a point where even the so-called “sub-flagship” SoCs pack more power than most users need in their day-to-day usage. But when comparing something like MediaTek’s Dimensity 9400 (a proper 2025 flagship) to Snapdragon’s 8s Gen 4, which sits just below the top-tier Snapdragon 8 Gen 4, it becomes more about how much better the flagship actually is, rather than if it’s better.

This isn’t just about specs on paper. It’s a look at how both chips stack up in real-world relevance. From performance and AI to gaming, camera tech, and power efficiency. Here’s what you need to know.

Performance

Starting with CPU performance, MediaTek’s Dimensity 9400 clearly flexes its flagship status. It’s running a second-gen all-big-core architecture from ARM. The prime is a Cortex-X925 core clocked at 3.62GHz backed by three Cortex-X4 cores and four Cortex-A720s. 

The SoC also has bigger L2 and L3 caches (2x and 1.5x, respectively) and a 15% IPC uplift over the previous generation, which official claims delivers up to 35% better single-core and 28% better multi-core performance compared to its predecessor.

On the other hand, Snapdragon’s 8s Gen 4 keeps things a little more measured. The Cortex-X4 prime core tops at 3.2GHz while the rest are Cortex-A720 cores — three clocked at 3.0GHz, two at 2.80GHz, and the remaining two at 2.0GHz. Qualcomm claims the setup delivers a 31% performance boost over the 8s Gen 3. 

Essentially, 8s Gen 4 is meant to offer strong performance where it counts without breaking the power budget.

Gaming

Gaming is one area where both chips make big promises. 

The Dimensity 9400 uses the Immortalis-G925, a 12-core GPU based on ARM’s 5th-gen architecture. It’s not just about brute force, though. MediaTek has layered in hardware-based ray tracing, up to 44% better power efficiency, and features like opacity micromaps that make scenes feel more complex without actually being so.

There’s also MediaTek’s HyperEngine Gaming Tech 3.0 offering real-time FPS stabilization, upscaling with Frame Rate Converter, and AI-driven resolution scaling. 

Qualcomm’s Adreno GPU in the 8s Gen 4 is no slouch either. It uses sliced architecture like the flagship Snapdragon 8 Elite and delivers up to 49% better graphics performance versus its last-gen counterpart.

The chip also has features like Snapdragon Elite Gaming, Adaptive Performance Engine, Game Super Resolution 2.0, and even hardware ray tracing to help it stay competitive in most real-world gaming scenarios.

The 9400 is ahead for gaming purists who care about every frame, lighting effect, and temperature drop. But the 8s Gen 4 doesn’t feel far behind for more mainstream gaming. 

AI

We can’t miss AI in 2025, of course. And both chips were designed with this in mind. 

The Dimensity 9400 uses MediaTek’s 8th-gen NPU and goes all-in on what it calls “Agentic AI.” It’s the first mobile chip to support on-device video generation, LoRA model training, and diffusion transformers. 

The performance numbers are also aggressive. The company claims it has double the diffusion generation speed and 80% faster LLM prompt handling compared to the Dimensity 9300. It also supports more complex models like Diffusion Transformers and Mixture of Experts (MoE), which are increasingly central to AI workloads.

Qualcomm’s 8s Gen 4 doesn’t trail far behind. It’s Hexagon NPU supports on-device LLMs and LVMs, and on-device multimodal and multilingual AI assistants. It delivers 44% faster AI performance and has 2x larger memory bandwidth than last-gen.

All in all, it’s no surprise the Dimensity 9400 is ahead in raw AI horsepower and capabilities. But unless you’re really into on-device generation or AI training, the 8s Gen 4’s capabilities will feel just as seamless for regular folks.

Cameras

Both chips offer solid camera support with advanced AI-assisted photography. The Dimensity 9400’s Imagiq 1090 ISP is particularly impressive. It enables continuous HDR video capture across zoom ranges, real-time AI segmentation, and generative AI super-resolution up to 100x zoom. Plus, MediaTek promises enough power efficiency to record 4K 60fps video for three hours straight.

The Snapdragon 8s Gen 4 brings Qualcomm’s Spectra AI ISP, with 18-bit capture and support for 320MP sensors. It can handle real-time semantic segmentation and night vision 2.0, capturing 4K 30fps footage in low-light conditions. You’re also getting skin and sky tone correction in real-time, which is useful in everyday shots.

Connectivity

The Dimensity 9400 uses a 3GPP Release-17 modem with 7 Gbps peak sub-6 5G speeds and new power-saving tricks like UltraSave 4.0. It also supports Wi-Fi 7 with tri-band concurrency, and MediaTek’s Xtra Range 3.0 for reliable network coverage. 

Snapdragon’s 8s Gen 4 maxes out at 4.2 Gbps on 5G, 5.8 Gbps on Wi-Fi 7, and supports Bluetooth 6.0. It also has support for features like Bluetooth Channel Sounding and Snapdragon Seamless to help switch devices fluidly within the ecosystem.

Final Thoughts: Flagship or Just Enough?

So, where do we land?

The Dimensity 9400 is very much a flagship chip. Big cores, big cache, top-shelf AI, serious gaming credentials, and advanced camera and connectivity features. The spec sheet says it all!

The Snapdragon 8s Gen 4 is a more affordable chip that brings enough of Snapdragon’s ecosystem to power premium devices at a lower cost. Just that it won’t top benchmark charts. 

So if you’re choosing between phones with these chips, think about what kind of user you are. Want the absolute best? Go with Dimensity 9400. Need something that’s “pretty much great” without breaking the bank? 8s Gen 4 will be more than capable for you.

Dimensity 9400 vs Snapdragon 8s Gen 4

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The post Dimensity 9400 vs Snapdragon 8s Gen 4: What really separates a flagship from a sub-flagship in 2025? appeared first on Gizmochina.

MediaTek has officially announced the Dimensity 9400 Plus as a high-bin version of the regular 9400.  Its closest rival is the Snapdragon 8 Elite chip, which was released in October of last year.

Both chips are flagship SoCs built on the same 3nm TSMC process node—specifically the N3E variant—but have very different architectures, design priorities, and implementations.

The Dimensity 9400 Plus runs on ARM Cortex cores, whereas the Snapdragon 8 Elite has its own Oryon cores. Let’s look at the main differences between the two, from raw specifications to on-device impact.

CPU Architecture and Performance

Based on Arm’s latest Cortex cores, the Dimensity 9400 Plus is an improved version of the standard 9400. It features one Cortex-X925 core running at up to 3.73GHz, paired with three Cortex-X4 cores and four Cortex-A720 cores.

That’s a typical big.LITTLE structure which leans heavily into high-performance cores.  It has eight CPU cores in total, supported by 10MB of system-level cache (SLC) and 12MB of L3 cache.

The Snapdragon 8 Elite, meanwhile, opts for a full custom Oryon CPU design. It uses eight 2nd-gen Oryon cores including two “Prime” cores clocked up to 4.32GHz, and six performance cores reaching 3.53GHz. The architecture also features a substantial 24MB of L2 cache, double that of the Dimensity 9400 Plus.

Although Qualcomm’s twin Prime core configuration theoretically offers higher raw power, flagships shouldn’t bother about benchmarks. But in real-world use, that difference may not be noticeable for most users.

GPU and Gaming Capabilities

On the GPU front, the Dimensity 9400 Plus uses the 12-core Arm Immortalis-G925, a unit MediaTek claims brings “PC-level features” to mobile including hardware-based ray tracing with opacity micromap support. This GPU is said to offer a 40% improvement in power efficiency over the previous generation and double the effective FPS for long gaming sessions.

Qualcomm uses its Adreno 830 solution which is claimed to deliver up to 40% better performance and power efficiency compared to the Adreno 750 used in Snapdragon 8 Gen 3. 

It also supports ray tracing which is reportedly improved by 37%. And there is even support for Unreal Engine 5.3, Nanite rendering, and Qualcomm’s latest graphics optimization frameworks like Game Super Resolution 2.0 and Frame Motion Engine 2.0.

AI and NPU Capabilities

The AI story is central to both chips. The Dimensity 9400 Plus includes the MediaTek NPU 890 which supports DeepSeek R1 (a local LLM (large language model). 

It also incorporates support for several key AI features like Mixture of Experts, Multi-Token Prediction, Multi-Head Latent Attention, and FP8 precision. MediaTek says the NPU offers “exceptional edge-AI performance” with reasoning speed and generative model improvements of up to 20% over the original 9400.

Qualcomm’s answer to this is the revamped Hexagon NPU claimed to be 45% faster than its predecessor and more power-efficient. It includes a 6-core vector engine and 8-core scalar engine, designed to support on-device multimodal generative AI.

In practical terms, neither chip’s AI engine has been extensively benchmarked in public yet. Until we see side-by-side comparisons using real-world AI workflows — like camera assistance, speech recognition, or on-device assistants — the differences remain theoretical.

Camera and ISP

Both SoCs support camera sensors up to 320MP and can record 8K video at 60fps. MediaTek includes its Imagiq 1090 ISP with support for HDR video across the zoom range, and Smooth Zoom for more fluid transitions in video capture. Qualcomm’s Spectra AI ISP takes a more AI-heavy approach and offers real-time segmentation, ultra-low-light capture, and video tools like semantic relighting and object erasure.

Qualcomm also brings support for Truepic’s cryptographic seal, a privacy-and trust-focused feature that may appeal to journalists and creators needing to verify the authenticity of photos.

Connectivity

Both chipsets offer support for Wi-Fi 7 and Bluetooth 6.0, but the Snapdragon 8 Elite has an edge in modem performance. It includes the Snapdragon X80 5G modem which gives download speeds up to 10Gbps and satellite connectivity via Snapdragon Satellite. Qualcomm also touts a more advanced AI-based location engine and dual-SIM capabilities with global 5G multi-SIM support.

MediaTek integrates a BeiDou GNSS system with a 60% speed boost over the 9400, and Bluetooth range extended to 8km for direct phone-to-phone connections. These are niche advantages that may matter for specific regions or use cases, but they don’t fundamentally alter the connectivity equation for most users.

Memory, Storage, and Display

Both chips support LPDDR5X RAM and the Dimensity 9400 Plus offers peak memory speeds of 10667 Mbps. Snapdragon 8 Elite doesn’t quote memory speed figures as aggressively, but pairs with the same LPDDR5X spec and UFS 4.0 storage.

In terms of display, the Dimensity chip supports up to WQHD+ at 180Hz and is designed for tri-fold displays via triple-port MIPI support. Snapdragon 8 Elite, by contrast, can drive QHD+ panels at up to 240Hz and supports external 8K displays — a specification more relevant for future hybrid mobile-desktop form factors.

Final Thoughts

There’s no single winner here—both chips are highly competent, deeply optimized, and designed to anchor flagship devices well into 2025.

The Snapdragon 8 Elite has a performance edge in CPU benchmarks, a more integrated AI ecosystem for user-aware experiences, and a well-rounded gaming and imaging stack. It’s the safer pick for premium flagships and gaming phones looking for every advantage.

The Dimensity 9400 Plus, while not the chart-topper in raw CPU speeds, brings an incredibly efficient GPU, smart integration with next-gen AI models like DeepSeek R1, and notable innovations in satellite and peer-to-peer communication. It’s also likely to appear in a more diverse set of devices due to MediaTek’s broader OEM partnerships.

For most consumers, the decision won’t likely be about which chip is better on paper. It will come down to the devices that integrate them, the thermal designs, and how well OEMs optimize performance. As always, specs can’t tell the full story. But they’re still worth paying attention to.

MediaTek Dimensity 9400 Plus vs Snapdragon 8 Elite

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MediaTek typically launches two flagship mobile SoCs each year. The company introduced the Dimensity 9400 SoC back in October, and we’re expecting a slightly upgraded version, likely called the Dimensity 9400+, to debut sometime this year.

Now, reliable tipster Digital Chat Station (DCS) has revealed the expected launch timeframe of this upcoming SoC, along with details on potential upgrades.

MediaTek Dimensity 9400+ launch timeframe

According to DCS, the Dimensity 9400+ will feature the same ARM Cortex-X925 prime core as the regular 9400. But the clock speed is expected to see a jump from 3.62 GHz to 3.7 GHz. 

Moreover, the tipster suggests that the processor will launch in March, with two smartphone brands reportedly preparing to introduce their first devices powered by it.

One of these devices is likely the Vivo X200s, as previous reports have also hinted that this phone will feature the same SoC. This also aligns with Vivo’s previous strategy, as its predecessor, the X100s, came equipped with the Dimensity 9300+ processor.

Meanwhile, the second phone the tipster may be referring to could be the Oppo Find X8S, based on recent leaks.

Specifications

There typically aren’t many differences between the regular and Plus versions of MediaTek’s flagship chip. So, we can expect the upcoming Dimensity 9400+ to follow a similar pattern. If that’s the case, here are the expected specifications:

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The next generation of flagship smartphones has started rolling out, being equipped with advanced new chipsets. MediaTek’s latest Dimensity 9400 powers these premium devices. So now, here’s a list of all the smartphones that are powered by this flagship processor. So let’s check it out.

Oppo Find X8 Series

First on the list are the Oppo Find X8 series of smartphones. The lineup consists of the Find X8 and Find X8 Pro. While the company is expected to be working on the Find X8 Ultra model as well, this model has yet to be officially unveiled. The base and Pro variant were first launched in China, with its global release recently kicking off in markets like India.

Both models are equipped with the Dimensity 9400, which offers top notch performance. There is AI powered software features, premium design, and much more. You can even click here to check out our review video of the Find X8 Pro. The Find X8 series starts from around $600.

Vivo X200 Series

Just like the Find X8 series, the Vivo X200 lineup was one of the first new generation smartphones to roll out. The series includes three models, namely the Vivo X200, X200 Pro, and X200 Pro Mini. All three models are equipped with MediaTek’s flagship Dimensity 9400 chipset.

The X200 Pro Mini model is quite interesting since it is one of the most powerful compact smartphones. All of these models get an advanced camera system, AI powered features, and much more. The X200 series also starts from just under $600. This model just made its global debut in Malaysia with its Indian release being right around the corner. There is also a Vivo X200S model in the work, which is expected to launch with the Dimensity 9400 as well.

iQOO Neo 10 Pro

iQOO just unveiled the iQOO Neo 10 series, although only one model features MediaTek’s flagship grade chipset. The iQOO Neo 10 was announced with the Snapdragon 8 Gen 3 SoC, while the iQOO Neo 10 Pro is equipped with the Dimesnity 9400. With a starting price tag of under $500, the iQOO Neo 10 Pro is a great budget flagship smartphone, offering top notch performance and capable hardware. This model was announced in China, but there’s no official word on its global release. So stick around for more updates.

The post Here’s Every Smartphone Powered by MediaTek Dimensity 9400: Oppo Find X8, Vivo X200, & More appeared first on Gizmochina.

OPPO and MediaTek have joined hands to introduce the upcoming OPPO Find X8 Series, the first smartphones in India powered by MediaTek’s latest Dimensity 9400 chipset. Announced at the MediaTek Technology Diaries event held on November 15, this partnership focuses on improving performance, gaming, photography, and battery life, making the Find X8 Series a strong contender in the smartphone market.

Powerful Performance with the Dimensity 9400

The Dimensity 9400 chipset is built using TSMC’s advanced 3nm process. Its second-generation “All Big Core” design improves speed and efficiency significantly, offering a 35% boost in single-core performance and 28% better multi-core performance compared to its predecessor. At the same time, it reduces power usage by 40%, ensuring smoother multitasking and quicker app launches.

The chipset’s 8th Generation NPU enables smarter AI features, such as Magic Compose in Google Messages. This feature generates replies that match the conversation’s tone, saving time and making messaging more convenient.

Better Gaming and Photography

The Dimensity 9400’s 12-core ARM Immortalis-G925 GPU enhances gaming by delivering 40% faster ray tracing performance and 41% better peak performance. With OPPO’s custom cooling system, users can enjoy long gaming sessions without worrying about overheating or lag.

Photography also sees major upgrades. The Find X8 Series combines MediaTek’s Imagiq 1090 ISP with OPPO’s Hasselblad Master Camera System. This pairing improves zoom quality, low-light photography, HDR video, and camera transitions. These features make it a solid choice for anyone who loves capturing photos or creating content.

Extended Battery Life and Efficient Charging

The Silicon-Carbon battery in the Find X8 Series works well with the Dimensity 9400 chipset to offer multi-day battery life. The phone consumes 14% less power when recording 4K video at 60fps. Recharging is also efficient, with the battery designed to handle demanding tasks while lasting longer.

Improved Connectivity

Connectivity is another highlight. MediaTek’s enhancements and OPPO’s AI LinkBoost ensure stable performance for gaming, streaming, and calls. The Dimensity 9400’s Xtra Range 3.0 extends Wi-Fi coverage by up to 30 meters, offering better connections in busy areas.

A Step Forward in Smartphone Innovation

“The Find X8 Series will put ultra-grade gaming, imaging, and smoothness in customers’ hands. This world-class performance is made possible thanks to our strong partnership with MediaTek,” said Andy Wu, OPPO Vice President.

What’s Next?

OPPO has not yet revealed the price or availability, but the Find X8 Series is expected to stand out with its strong performance, improved gaming and photography features, and dependable battery life. The smartphone will be launched on November 21 at 5 AM UTC, along with ColorOS 15.

The Find X8 will feature a 6.59-inch 1.5K AMOLED flat display, while the Find X8 Pro will sport a 6.8-inch LTPO micro-curved AMOLED screen. Both will support 120Hz adaptive refresh rates, up to 4500 nits of brightness, and durable Oppo Crystal Shield glass.

They will debut the world’s first dual periscope camera system, with the X8 featuring a triple 50MP camera setup, and the Pro model adding dual 50MP periscope lenses for 3x and 6x optical zoom. Both devices will offer AI-powered Telescope Zoom, the HyperTone Image Engine, and a Hasselblad partnership for professional-grade photography and videography, including Dolby Vision and 12-bit processing.

The phones are expected to come with large batteries—5630mAh for the X8 and 5910mAh for the X8 Pro—and support 80W wired charging, 50W wireless charging, and 10W reverse wireless charging.

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The competition among major chipmakers is more fierce than ever, with all of them bringing massive upgrades every year to their latest chips. Recently, MediaTek unveiled the Dimensity 9400 with significant performance and efficiency improvements. Qualcomm’s Snapdragon 8 Elite, featuring Oryon cores for the first time in a mobile chipset, shatters benchmark records like anything. We also have Apple A18 Pro, powering the latest iPhone 16 series.

These three chips are the most powerful mobile chipsets from their respective brands. But how do they stack up against each other? Let’s put them through different benchmarks to see which one holds the crown.

Let’s begin with the spec sheet:

Snapdragon 8 Elite vs Dimensity 9400 vs Apple A18 Pro: Benchmark

Geekbench results

Geekbench runs a device through a series of tests to measure its CPU capabilities. The benchmarking platform outputs single-core and multi-core performance results.

The Snapdragon 8 Elite and Apple A18 Pro have similar single-core performance, while the Dimensity 9400 lags behind both. However, in the multi-core test, the Dimensity chip climbs ahead of the A18 Pro but falls short of the Snapdragon 8 Elite.

As per Geekbench 6 scores, the Snapdragon 8 Elite has the most powerful CPU of all three, followed by Dimensity 9400 and Apple A18 Pro. 

AnTuTu results

AnTuTu is a popular benchmarking tool for measuring the CPU, GPU, UX, and memory performance of a device. The total score represents the overall strength. One thing to note here is that the AnTuTu for Android runs on Vulkan API, while the iOS version runs on Metal API.

The Dimensity 9400 rocks the AnTuTu chart, though the Snapdragon 8 Elite isn’t far behind. The Apple A18 Pro, however, has a significantly weaker AnTuTu score than the other two. 

Snapdragon 8 Elite vs Dimensity 9400 vs Apple A18 Pro: Key differences

CPU

The Snapdragon 8 Elite and Dimensity 9400 have eight CPU cores, whereas the Apple A18 Pro only has six. The Snapdragon 8 Elite is a game-changer chipset for Qualcomm as it’s equipped with an in-house Oryon CPU, the first time on a Snapdragon chip, and the results have been impressive so far. 

The 8 Elite’s CPU has two Oryon cores clocked at 4.32GHz and six Oryon cores at 3.53GHz. The Dimensity 9400’s CPU architecture consists of a Cortex-X925 large-core running at 3.63GHz, three Cortex-X4 performance cores running at 3.3GHz, and the remaining four are Cortex-A720 clocked at 2.4GHz.

Apple A18 Pro’s CPU has two custom-designed high-performance cores running at 4.04GHz and six custom-designed power-efficiency cores running at 2.2GHz. 

GPU

The Snapdragon 8 Elite ships with Adreno 830 GPU; Dimensity 9400 gets Immortalis-G925 MC12; and the A18 Pro gets a 6-core GPU.

The GPU inside the 8 Elite chip brings support for Unreal Engine 5 with Nanite for a film-quality 3D environment for immersive gaming. It comes with a full suite of Snapdragon Elite Gaming features, such as Qualcomm Adaptive Performance Engine 4.0, real-time hardware-accelerated ray racing, Snapdragon Game Super Resolution 2.0, and Adreno Frame Motion Engine 2.0.

The Dimensity 9400’s 12-core GPU aims to match desktop PC-grade ray tracing capabilities. It brings MediaTek HyperEngine gaming technologies, such as MediaTek Adaptive Gaming Technology 3.0, MediaTek Frame Rate Converter, and HyperEngine’s Super Resolution, for a smooth gaming experience.

The A18 Pro has a 6-core GPU that is 20% faster than its predecessor, the A17 Pro and delivers 2x faster hardware ray tracing. The Snapdragon 8 Elite’s GPU is 40% faster, and the Dimensity 9400’s GPU is 41% faster than their predecessors.

Connectivity

All three chips have an integrated 5G modem with many dissimilarities. The Snapdragon 8 Elite and Apple A18 Pro have a peak download speed of 10Gbps, which is 7.3Gbps on the Dimensity 9400. All these have Wi-Fi 7 support. However, the 8 Elite supports the newer Bluetooth 6.0 standard, while the other two support Bluetooth 5.4.

AI capabilities

For on-device AI tasks, the Snapdragon 8 Elite has a hexagon NPU that delivers 45% better AI performance than its predecessor. The Dimensity 9400 gets the AI job done through MediaTek NPU 890, which offers 80% faster LLM prompt performance while being 35% more power efficient compared to its predecessor.

The 8th gen NPU inside the Dimensity 9400 is the world’s first high-quality on-device video generation and the world’s first on-device LoRA training, MediaTek claims.

The Apple A18 Pro has a 16-core neural engine that can perform 35 trillion operations per second (TOPS).

Snapdragon 8 Elite vs Dimensity 9400 vs Apple A18 Pro: Final words

Snapdragon 8 Elite, Dimensity 9400, and Apple 18 Pro are the most powerful smartphone chips, offering a smoother experience no matter how demanding the apps/games are. They can handle the needs of most users.

On benchmarks, the Snapdragon 8 Elite outperforms the other two. In some tests, the Dimensity 9400 leads the race. The Apple A18 Pro also shows strong performance on Geekbench. However, the AnTuTu is significantly lower compared to the other two.

In the end, I’d say the choice comes down to your preferred ecosystem. If you’re highly invested in the Apple ecosystem, Apple A18 Pro makes a lot of sense. For Android, I’d prefer the Snapdragon 8 Elite over Dimensity 9400.

Snapdragon 8 Elite phones:

• Xiaomi 15 (review)
• Xiaomi 15 Pro
• iQOO 13
• OnePlus 13 (review)
• Realme GT7 Pro (review)

MediaTek Dimensity 9400 phones:

• Vivo X200
• Vivo X200 Pro (hands-on)
• Vivo X200 Pro mini
• Oppo Find X8
• Oppo Find X8 Pro

Apple A18 Pro phones:

• Apple iPhone 16 Pro
• Apple iPhone 16 Pro Max

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When it comes to flagship smartphones, the processor is a major factor that showcases performance, features, and much more. Qualcomm’s Snapdragon 8 Elite and MediaTek’s Dimensity 9400 are two of the most powerful chipsets in the market right now. Both of these promise the best performance on Android devices, but which one should you choose for your next smartphone purchase? Let’s find out in this comparison.

Snapdragon 8 Elite or Dimensity 9400: Performance

While the two processors have different core configurations, they are pretty comparable in terms of performance. In our first comparison between the two processors, we saw that the Snapdragon 8 Elite’s performance managed to rival the Apple A18 Pro. It was on par with the A18 Pro in single core test in GeekBench 6, while its multi core scores crossed over 10,000 points. A previous GeekBench sighting listed the device with 2884 (single) and 8840 (multi) points respectively. On AnTuTu, this chip managed to get a score of over 3 million. Regardless, it is one of the fastest processors for Android smartphones right now.

Meanwhile, the Dimensity 9400 was first seen getting a GeekBench score of 2818 points in the single core test, while its multi core scores reached 8847 points. Just like the Snapdragon 8 Elite, the MediaTek chip also crossed the 3 million mark on AnTuTu. So the Snapdragon 8 Elite performed better in GeekBench, while the Dimensity 9400 took the lead in AnTuTu (3,109,010 points vs 3,007,853 points respectively). Although in real world use, people would be hard pressed to notice a major difference. So let’s check out other avenues.

Thermals & Battery Performance

Qualcomm has claimed a 45% boost in CPU performance along with a 44% improvement in power efficiency. MediaTek also promises a 40% upgrade in both performance and battery efficiency as well. However, a recent real world test from C4ETech, which compared the Oppo Find X8 Pro (Dimensity 9400) and OnePlus 13 (Snapdragon 8 Elite), revealed that the Dimensity 9400 consumes less battery and runs cooler overall.

We have already seen reports of heating issues with the Snapdragon 8 Elite, so thermals could be one area where the Dimensity edges ahead. Battery efficiency could still be tweaked with optimizations and it is still early to tell how these chips perform over time. But this is a notable aspect to take into account.

Camera Support

Both Qualcomm and MediaTek have updated their ISPs (Image Signal Processor) to support a single 320MP capture. The Snapdragon 8 Elite brings triple 48MP capture with Zero Shutter Lag, 8K@60fps, and 1080p slo-mo capture at 480fps. On the other hand, MediaTek’s Dimensity 9400 offers full range HDR zoom without losing the subject focus thanks to the new Imagiq 1090 ISP. It also has AI super zoom with 100x magnification and maximum video recording resolution of 8K. This includes 30fps and 60fps.

Which one should you choose?

Both the Snapdragon 8 Elite and Dimensity 9400 are top-tier chipsets, so the differences at this price point wouldn’t be the performance. Other factors come into play like camera specs of the smartphone you’re buying, its pricing, and more. As of right now, the Snapdragon 8 Elite on the Realme GT 7 Pro is the cheapest flagship phone in the market. However, it there have been reports of the device heating up during use. So it’s best to wait a bit more for more launches, so we have better options to choose from. During this time, brands would likely offer optimizations for their new premium phones, making them even better.

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MediaTek recently announced Dimensity 9400, promising significant upgrades over its predecessor. And to a large extent, MediaTek’s claims are true (see our Dimensity 9400 vs 9300 comparison for more details). Its predecessor, Dimensity 9300, fell short of Snapdragon 8 Gen 3 in our benchmarking tests. However, the Dimensity 9400 is a strong contender.

It will be interesting to see how the latest Dimensity 9400 chip stacks up against the Snapdragon 8 Gen 3. In this post, we’ll look at the benchmark data of these two chips and their key differences.

Let’s begin our comparison with the spec sheet:

Dimensity 9400 vs Snapdragon 8 Gen 3: Benchmarks

Geekbench comparison

Geekbench is a popular benchmarking platform for testing the CPU capabilities of a device. On this platform, the Dimensity 9400 has completely outshined the Snapdragon 8 Gen 3 with over 20% better single-core and multi-core scores.

AnTuTu comparison

AnTuTu is a more popular benchmarking tool that measures the overall strength of a device. The Dimensity 9400 is leading here as well, with over 35% better AnTuTu score than Snapdragon 8 Gen 3.

Here’s a more detailed look at AnTuTu scores:

MediaTek Dimensity 9400 is way ahead of Snapdragon 8 Gen 3 on these benchmarks. But how has MediaTek been able to achieve this big leap? Let’s look at the core differences between them below.

Dimensity 9400 vs Snapdragon 8 Gen 3: Key Differences

TSMC has manufactured both the Dimensity 9400 and Snapdragon 8 Gen 3, although the process nodes are different. The former is fabricated using a 3nm node, offering better performance and power efficiency than the 4nm node used for the latter chip.

The Dimensity 9400 features all big cores design; there are no small cores for efficiency. In contrast, the Snapdragon 8 Gen 3 has two efficiency cores. The former chip has one Cortex-X925 core with up to 3.63GHz peak frequency, three Cortex-X4 cores running at 3.3GHz, and four Cortex-A720 cores at 2.4GHz.

The Snapdragon 8 Gen 3, on the other hand, has just one Cortex-X4 prime core with the same clock speed, five Cortex-A720 performance cores (two of them run at 3.15GHz and two at 2.96GHz), and two Cortex-A520 efficiency cores at 2.27GHz. Because of the Cortex-X925 super large core and all-big-core design, the Dimensity 9400 offers significantly better performance than the Snapdragon 8 Gen 3.

Since the Dimensity 9400 is primarily tuned for high performance, one would expect high battery consumption, but that’s not actually true. When tested with Genshin Impact, the Dimensity 9400-powered Vivo X200 Pro resulted in less power consumption than the Snapdragon 8 Gen 3-powered Xiaomi 14 Ultra.

The Dimensity chip has a new Imagiq 1090 ISP, which enables HDR video capture throughout the entire zoom range, the first on any flagship chip. It also has AI-enabled camera features such as Gen-AI Super Resolution and Gen-AI Super Zoom for better outputs. The latter AI technology can achieve up to 100x magnification in photos with clear details.

MediaTek has also increased the maximum camera resolution to 320MP (vs. 200MP on the Snapdragon 8 Gen 3). It now natively supports 8K recording at 60fps, while the Snapdragon chip is limited to 8K/30fps recording. In terms of connectivity, the Dimensity chip offers a higher peak download speed, while the rest of the connectivity features are almost similar.

Dimensity 9400 vs Snapdragon 8 Gen 3: Verdict

MediaTek has done an excellent job with Dimensity 9400. In fact, it’s the best Dimensity chip upgrade in recent years and is certainly better than the Snapdragon 8 Gen 3 in almost all aspects. However, that doesn’t make Snapdragon 8 Gen 3 a bad choice all of a sudden.

Snapdragon 8 Gen 3 is still one of the best smartphone chips. Whether you opt for Dimensity 9400 or Snapdragon 8 Gen 3, you’ll get a great mobile gaming experience. Both chips offer a suite of gaming-focused features tailored to enhance the experience. The MediaTek chip has better power efficiency, though.

If I had to pick from these two, I would go with Dimensity 9400. However, a great deal on Snapdragon 8 Gen 3 phones would be difficult to ignore.

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Qualcomm just announced the Snapdragon 8 Elite as the flagship processor, which will power upcoming premium smartphones. This announcement arrives mere weeks after MediaTek unveiled its own high end Dimensity 9400 SoC. We had written an early comparison based on rumors and leaks of these two chips. So let’s see how the Snapdragon 8 Elite compares against the Dimensity 9400 now.

Snapdragon 8 Elite vs Dimensity 9400: Specifications

MediaTek’s new Dimensity 9400 features MediaTek’s 2nd Gen All Big Core design, which includes the powerful ARM Cortex-X925 core. These run at over 3.62GHz and combine three Cortex X4 cores and four Cortex A720 cores. This enables the chip to offer 35% faster single-core and 28% faster multi-core performance compared to the Dimensity 9300.

It is built on TSMC’s 2nd Gen 3nm process, allowing for up to 40% more power efficiency as well. The Dimensity 9400 has a new NPU for improved AI functionality and a 12-core ARM Immortalis-G925 GPU for 40% faster ray tracing performance.

Qualcomm and MediaTek had the same idea as the Snapdragon 8 Elite also incorporates an All Big Core design. It has eight cores with 2x prime cores, which are clocked at an impressive 4.32GHz along with 6x performance cores with a 3.53GHz clock speed. The new Snapdragon 8 Elite was built on TSMC’s 3nm process, promising a 45% increase in CPU performance while boasting a 44% improvement in power efficiency.

Thanks to an upgraded Adreno 830 GPU, there is also a 40% improvement in both performance and power efficiency along with 35% faster ray tracing as well. This chip also supports Unreal Engine 5.3 and its Nanite virtualized geometry system.

Big Focus on AI

MediaTek showcased its Dimensity 9400 chip with its 8th Gen NPU. It launched as the first mobile chipset to support on-device LoRA training and high-quality on-device video generation. The chipset features Dimensity Agentic AI Engine (DAE) for up to 80% faster LLM prompt performance and 35% improved efficiency.

On the other hand, Qualcomm’s Snapdragon 8 Elite packed the new Hexagon NPU with a 45% improvement in AI processor speed. It arrives with support for both large and small AI models along with Qualcomm’s QI Engine, which brings multimodal AI support.

Benchmarks

Just earlier today, our report covered how the Snapdragon 8 Elite’s performance managed to rival the Apple A18 Pro. It managed to rival the A18 Pro in single core test in GeekBench 6, while its multi core scores crossed over 10,000 points. Ahead of the launch, an older GeekBench sighting listed the device with 2884 (single) and 8840 (multi) points respectively. On AnTuTu, this chip managed to get a score of over 3 million. Regardless, it is one of the fastest processors for Android smartphones right now.

Meanwhile, the Dimensity 9400 was first seen getting a GeekBench score of 2818 points in the single core test, while its multi core scores reached 8847 points. Just like the Snapdragon 8 Elite, the MediaTek chip also crossed the 3 million mark on AnTuTu.

Conclusion

Both Qualcomm and MediaTek are offering a notable leap in performance with their latest flagship chips. But as I initially suspected, the Snapdragon 8 Elite and Dimensity 9400 are quite competitive in most aspects. Not only is there a notable bump in raw performance, but AI and graphics processing speeds have also seen an upgrade. Even battery efficiency has seen improvements. In the benchmarks, the two chips only have a single digit percentage difference. So real world test with the new premium phones might determine which processor is the best. But whatever you choose, these two are the best chipsets you can have on your Android flagship.

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MediaTek officially unveiled the Dimensity 9400 as its most powerful chip that will power upcoming flagship Android smartphones. It boasts impressive performance upgrades and new features. But MediaTek is always compared to Qualcomm’s Snapdragon series, but which one is better? Can the Snapdragon 8 Gen 4 beat the Dimensity 9400?

Before we get started, it is worth noting that Qualcomm’s Snapdragon 8 Gen 4 is expected to launch with the Snapdragon 8 Elite moniker.

Snapdragon 8 Gen 4 vs Dimensity 9400: Specifications

Talking about the newly announced chipset first, the Dimensity 9400 features MediaTek’s 2nd Gen All Big Core design. This integrates the powerful ARM Cortex-X925 core, which runs at over 3.62GHz and combines three Cortex X4 cores and four Cortex A720 cores. The company claims that this chip offers 35% faster single-core and 28% faster multi-core performance compared to the Dimensity 9300.

It is built on TSMC’s 2nd Gen 3nm process, making it up to 40% more power efficient to improve battery life. It has a new NPU for improved AI functionality and 12-core ARM Immortalis-G925 GPU for 40% faster ray tracing performance. So there’s a bump in performance and energy efficiency.

The Snapdragon 8 Gen 4 (or the Snapdragon 8 Elite) has yet to be released. Although, rumors and reports have revealed a lot of its key specifications. It is also manufactured on TSMC’s 3nmm process with a 6 core CPU (2 x 4.05GHz + 4 x 2.2GHz), a 6 core GPU, and a 16 core Neural Engine that is capable of 35 trillion operations per second. There are also rumors of a 4.37GHz variant, which could be dubbed as Snapdragon 8 Gen 4 for Galaxy.

This is paired with a 6 core Adreno 830 graphics unit that has a 1.45GHz clock frequency and improved hardware ray tracing. The GPU alone is expected to offer 56% faster performance compared to its predecessor, the Adreno 750. From these specs alone, it is hard to compare these two high end processors, so let’s have a look at their benchmark performance.

Benchmarks

The Snapdragon 8 Gen 4/8 Elite was previously spotted on GeekBench. It achieved a score of 2884 points in the single core test and 8840 points in the multi core test. It is worth noting that the score was for the Snapdragon 8 Gen 4, but this variant was running at a 4.09GHz clock speed and not 4.37GHz. On AnTuTu, this processor was previously seen achieving a score of over 1.7 million. Certain benchmarking based websites have even listed the chip with a score of over 3 million.

On the other hand, the MediaTek Dimensity 9400 achieved 2818 points in the single core test of GeekBench, while its multi core scores reached 8847 points. Just recently, the Dimensity 9400 managed to breach the 3 million mark on AnTuTu, showcasing impressive performance. We covered this in our recent report where we compared Apple’s A18 Pro and Dimensity 9400.

So which one is faster?

Unfortunately, since Qualcomm hasn’t announced the Snapdragon 8 Gen 4, it is hard to do a proper comparison at the moment. But these leaks and rumors have shown that MediaTek isn’t an afterthought in the top end segment anymore and directly competes if not surpasses Snapdragon with its newer Dimensity chips. So stick around for more, as we will be covering the Snapdragon 8 Gen 4/8 Elite release and revisit this comparison in the near future.

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The vivo X200 series is going to be the first flagship based on the just-released Dimensity 9400 chip, which reportedly boasts up to 41% faster peak CPU performance, and 40% faster ray tracing performance. But what about the AI capabilities? Well, the vivo X200 Pro and X200 Pro Mini, which powers the chipset, are currently topping the AI-Benchmark listing.

Interestingly, the third and fourth positions are also occupied by two of the predecessors—the vivo X100 Pro and X100—which are equipped with the Dimensity 9300 chip.

Dimensity 9400 sets a new record in AI performance

For those curious about numbers, the X200 Pro and X200 Pro Mini scored 10132 and 10095 points in the AI benchmark test.

For those unfamiliar with the platform, AI-Benchmark tests and ranks smartphones based on their AI (Artificial Intelligence) performance. It assesses different devices using AI-related tasks, benchmarks their ability to handle machine learning models, and provides a score that reflects their AI performance capabilities.

The D2400 chipset packs MediaTek’s 8th Generation NPU, which enables flagships for the next wave of generative AI innovations. According to the company’s tests, it offers 100% faster diffusion generation performance and 80% faster LLM prompt performance all while consuming 30% less power as compared to its predecessor.

As for the devices, both the X200 Pro and Pro Mini are rumored to pack up to 16GB of LPDDR5x RAM and 1TB of UFS 4.0 storage. The compact flagship uses a 6.3″ 1.5K 120Hz display and packs a 5700mAh battery inside, which supports 90W fast charging.

Alongside the D2400 chip, the X200 series devices (at least the Pro models) also use a V3 imaging chip for better processing of details and color.

Speaking of real-world performance, the Oppo Find X8 Pro, powered by the D2400 chip, has significantly outperformed the iPhone 16 Pro in a 30-minute Genshin Impact gameplay test. Both the flagship lineups from vivo and Oppo are scheduled for launch on October 14 and October 24, respectively.

(Source)

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MediaTek recently unveiled the Dimensity 9400 as its most powerful chipset for mobile devices. The upcoming Vivo X200 series and Oppo Find X8 series will feature the D9400 SoC. The chipset has managed to breach the 3 million mark on AnTuTu, showcasing its remarkable performance. How does it fare against the Apple A18 Pro, which powers models like the iPhone 16 Pro and iPhone 16 Pro Max? This post provides a detailed comparison of these two processors, examining their performance, AI capabilities, power efficiency, and overall impact on the smartphone market.

Performance and Architecture

The MediaTek Dimensity 9400 is built on TSMC’s second-generation 3nm process, featuring an impressive array of cores: one Arm Cortex-X925 core operating at over 3.62GHz, three Cortex-X4 cores, and four Cortex-A720 cores. This configuration offers a 35 percent increase in single-core performance and a 28 percent boost in multi-core performance compared to its predecessor, the Dimensity 9300.

On the other hand, Apple’s A18 Pro is also manufactured using TSMC’s 3nm technology, with a six-core CPU composed of two performance cores clocked at 4.05GHz and four efficiency cores. Apple’s design focuses on balancing power and efficiency, delivering a processor that is both powerful and energy efficient. Benchmarks tests suggest that the A18 Pro can surpass the Dimensity 9400 in single-core performance. However, in multi-core scenarios, the 8-core design of the Dimensity 9400 might give it an edge.

Graphics and Gaming

When it comes to graphics and gaming, both chipsets push the boundaries of mobile GPU performance. The Dimensity 9400 features a 12-core Arm Immortalis-G925 GPU, providing a 40 percent boost in ray tracing performance and a 41% increase in peak performance compared to the Dimensity 9300. It also supports HyperEngine technology for super-resolution and improved picture quality, making it a formidable choice for gaming enthusiasts.

The Apple A18 Pro, with its six-core GPU, is nearly 40 percent faster than the GPU in the iPhone 15 series, enhancing the gaming experience and computational photography capabilities. This significant improvement ensures that the A18 Pro remains competitive against the latest Snapdragon processors. Early benchmarks of the D9400 suggest a significant lead over the A18 Pro’s 6-core GPU, particularly in graphics-intensive tasks and gaming.

AI Capabilities

AI and machine learning have become crucial in modern smartphones, and both the Dimensity 9400 and A18 Pro excel in this domain. The Dimensity 9400 is equipped with MediaTek’s 8th generation NPU, which introduces industry-first features like on-device LoRA training and high-quality video generation. It is designed to support agentic AI applications, offering up to 80 percent faster performance in large language model (LLM) prompts and 35 percent greater power efficiency compared to the Dimensity 9300.

Apple’s A18 Pro, with its new 16-core neural engine, can perform 35 trillion operations per second, more than doubling the AI processing power of the A16 Bionic. This enhancement allows for faster and more efficient on-device AI tasks, such as computational photography and voice recognition.

Power Efficiency

Power efficiency is a critical factor for mobile processors, impacting battery life and overall device performance. The Dimensity 9400 is up to 40 percent more power-efficient than its predecessor, the Dimensity 9300. This improvement translates to longer battery life, even under heavy use.

The Dimensity 9400 and Apple A18 Pro are built on TSMC’s advanced 3nm process, but with slight variations. The Dimensity 9400 utilizes TSMC’s N3B process, while the A18 Pro is uses the more advanced and power-efficient N3P process. This could give the A18 Pro an edge in power consumption and thermal management.

Additional Features

Beyond raw performance, both processors incorporate features that enhance the overall user experience. The Dimensity 9400 supports HDR video recording throughout the entire zoom range, with MediaTek’s Smooth Zoom technology for capturing moving subjects. It also includes Imagiq 1090 for improved image processing. A refreshed 5G modem with up to 7Gbps sub-6GHz performance, Wi-Fi 7 tri-band MLO support, and MediaTek Xtra Range 3.0 for extended Wi-Fi coverage. Additionally, the Dimensity 9400’s dual SIM dual active (DSDA) capabilities offer greater flexibility for users.

Apple’s A18 Pro likely integrates a custom 5G modem with similar capabilities. Additionally, the new chip continues the tradition of integrating advanced technologies seamlessly into the iOS ecosystem. Its 16-core neural engine enhances on-device AI calculations, making tasks like image processing and real-time language translation more efficient. The A18 Pro’s architecture also supports future-proofing for larger AI models, ensuring the chipset remains relevant as AI technology evolves.

Final Thoughts

The Dimensity 9400 and Apple A18 Pro represent the pinnacle of mobile chip technology, each with its own strengths and weaknesses. The Dimensity 9400 appears to have a significant advantage in GPU performance, potentially making it a better choice for gamers. Its “all-big-core” CPU design and advanced AI capabilities also make it a strong contender.

Apple’s A18 Pro, while potentially lagging in GPU performance, is likely to excel in single-core CPU performance and power efficiency. Its tightly integrated design and optimization within the Apple ecosystem will continue to be a major advantage. Both chipsets cater to different segments of the market, but they share a common goal: delivering unparalleled performance and efficiency to meet the demands of modern smartphone users.

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MediaTek just unveiled its next gen flagship chip, the Dimensity 9400. This processor was manufactured on TSMC’s 3nm process and is set to power upcoming premium Android phones, bringing significant improvements in performance across the CPU, GPU, gaming, and AI capabilities. So now, here’s a list of all smartphones that will be powered by MediaTek’s Dimensity 9400.

Vivo X200 Series

The first on the list is the Vivo X200 series. The Chinese brand’s X200 lineup will be the first to debut the Dimensity 9400 SoC ahead of any other company’s offerings. Vivo is set to launch the X200 series on 14th October 2024. The lineup will consist of Vivo X200, X200 Pro, and X200 Pro Mini. Notably, there will also be an X200 Pro Satellite Edition, which recently received an impressive AnTuTu score of over 3 million. This is the first Android flagship phone to achieve this milestone.

Oppo Find X8 Series

Oppo has just announced the launch date for its flagship Find X8 series. The lineup consists of the Find X8, Find X8 Pro, and Find X8 Pro Satellite Communication Version. These devices are set to be unveiled later this month on 25th October 2024. These devices will likely take advantage of the AI performance bump in the Dimensity 9400 to bring more AI powered features on the the Find X8 series.

Samsung Galaxy S25 Series

Samsung is known to known for releasing its flagship smartphones at the start of the year. Depending on the region, the Galaxy S series features either the Snapdragon chipsets (US and South Korea) or the Exynos processors (Rest of the World). However, in a surprising twist, rumors have claimed that the Galaxy S25 and Galaxy S25+ models will be powered by MediaTek Dimensity chips for the first time. The processor in question is rumored to be the Dimensity 9400.

iQOO Neo 10 Pro

Back in August 2024, known tipster Digital Chat Station revealed the chipsets that will power iQOO’s next gen flagship smartphones. DCS claims that the base iQOO Neo 10 will be powered by Qualcomm’s Snapdragon 8 Gen 3 SoC. On the other hand, the higher end iQOO Neo 10 Pro is reportedly equipped with the MediaTek Dimensity 9400 SoC. To recall, the iQOO Neo 9 and Neo 9 Pro also packed the Snapdragon 8 Gen 2 and Dimensity 9300 SoCs respectively.

Redmi K80 Ultra

Xiaomi is expected to be working on the Redmi K80 series with Qualcomm’s Snapdragon 8 Gen 3 SoC. This would mark a performance improvement over its predecessor, the Redmi K70 series, that featured the Snapdragon 8 Gen 2. However, the series top end Redmi K70 Ultra model packed the Dimensity 9300+ SoC. So it won’t be surprising if its successor features a new Dimensity flagship chipset. While this is still just speculation at this point, the Redmi K80 Ultra could house the Dimensity 9400 SoC.

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MediaTek has unveiled its latest flagship chipset, the Dimensity 9400, designed to deliver unprecedented performance and efficiency for next-generation smartphones. This new chipset represents a significant leap from its predecessor, the Dimensity 9300, with enhancements across CPU performance, AI capabilities, and gaming features.

Advanced CPU Design and Efficiency

The Dimensity 9400 incorporates MediaTek’s second-generation All Big Core design. It integrates a powerful Arm Cortex-X925 core running at over 3.62GHz, combined with three Cortex-X4 cores and four Cortex-A720 cores. This configuration offers 35% faster single-core and 28% faster multi-core performance compared to the Dimensity 9300. Built on TSMC’s second-generation 3nm process, the Dimensity 9400 is up to 40% more power-efficient, significantly extending battery life.

Enhanced AI Capabilities

One of the standout features of the Dimensity 9400 is its 8th Generation NPU, which introduces several industry firsts in generative AI performance. It is the first mobile chipset to support on-device LoRA training and high-quality on-device video generation. MediaTek’s new Dimensity Agentic AI Engine (DAE) transforms traditional AI applications into sophisticated agentic AI applications, offering up to 80% faster large language model (LLM) prompt performance while being up to 35% more power-efficient.

Exceptional Gaming Performance

The Dimensity 9400 promises an immersive gaming experience with its 12-core Arm Immortalis-G925 GPU, which delivers up to 40% faster ray tracing performance compared to its predecessor. It also supports opacity micromaps (OMM) for realistic visual effects and offers a 41% peak performance boost with up to 44% power savings. Additionally, the HyperEngine technology co-developed with Arm provides super resolution and impressive picture quality.

Advanced Camera and Multimedia Features

The Dimensity 9400 is equipped with the MediaTek Imagiq 1090, which supports HDR video recording throughout the entire zoom range. The chipset’s Smooth Zoom technology enables easy capture of moving subjects and reduces power consumption by up to 14% during 4K60 video capture. It supports a maximum camera sensor of 320MP and 8K60 video capture.

Connectivity and Additional Features

The chipset includes a refreshed 3GPP Release-17 5G modem with 4CC-CA, offering up to 7Gbps sub-6GHz performance. It also features a new 4nm Wi-Fi/Bluetooth combo chip with 7.3Gbps data rates and Wi-Fi 7 tri-band MLO support. MediaTek Xtra RangeTM 3.0 enhances Wi-Fi coverage by up to 30 meters. The chipset supports 5G/4G Dual SIM Dual Active and tri-fold smartphones, allowing manufacturers to design innovative form factors.

Availability

The first smartphones powered by the MediaTek Dimensity 9400 will hit the market in Q4 2024. The Vivo X200, X200 Pro, and X200 Pro Mini, debuting on Oct. 14 in China, will be the world’s first Dimensity 9400 phones. The Find X8 series, scheduled to break cover on Oct. 24 in China, will also feature the D9400 chip.

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Several 2024 flagship smartphones are expected to launch this month, with many powered by MediaTek’s Dimensity 9400 chipset. In line with current trends, these brands are integrating numerous AI features into their custom skins, most of which are based on Android 15. But what about AI processing capabilities? According to official sources, the Dimensity 9400 is specifically designed to meet the demands of AI processing.

The chipset supports Google’s Gemini Nano with multimodality, featuring an 8th-generation NPU that offers hardware acceleration for text, image, and speech processing. This reportedly results in a 41% boost in AI capabilities compared to its predecessor. MediaTek has partnered with Google to ensure smartphone manufacturers can integrate more AI features, aiming to enhance user experience.

On-device processing ensures user privacy reduces network dependence

One key advantage of this improved NPU and support for on-device AI processing is enhanced user privacy and security, as more data will be processed locally rather than relying on cloud servers. On-device AI also reduces dependence on network connectivity for feature functionality.

Speaking of the implementation, Vivo’s Android 15-based OriginOS 5 custom skin is rumored to include AI-powered features such as voice transcription, real-time translation, beauty filters, and even AI-controlled NPCs to enhance gaming experiences. OriginOS 5 will debut with the vivo X200 series this month, powered by the Dimensity 9400.

Similarly, the Oppo Find X8 series, also featuring the Dimensity 9400, is expected to introduce new AI features like the “AI Note Assistant”, designed to simplify information storage and retrieval.

That said, the implementation of AI features still depends on the smartphone manufacturers and there’s not much information about the Android 15-based custom skins yet.

Aside from its powerful NPU, the Dimensity 9400 also brings substantial CPU and GPU improvements. The chipset is rumored to have a 1+3+4 core cluster consisting of a Cortex-X925 prime CPU core clocked at 3.626 GHz, three Cortex-X4 cores clocked at 2.80 GHz, and four power-efficient Cortex-A725 (or Cortex-A720) cores.

The Dimensity 9400 is fabricated using TSMC’s N3E (3nm) process node, which is expected to be 30% more power efficient than its predecessor.

(Source)

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Vivo has officially announced that the X200 series will be launched at 7pm on Oct. 14 in China. This new series not only brings significant upgrades but also debuts the MediaTek Dimensity 9400, the first 3nm chip in the Android ecosystem, built on TSMC’s 3nm process. MediaTek has also confirmed that it will announce its next-generation chip on Oct. 9 in China. Although the Taiwanese tech giant has not made a specific announcement, it seems that they will unveil the all-new Dimensity 9400 tomorrow.

Vivo X200 series to feature MediaTek Dimensity 9400 chip

According to reports, the Dimensity 9400 features the new Arm Cortex-X925 prime CPU core, delivering a 36% improvement in performance and a 41% boost in AI capabilities compared to its predecessor, the Cortex-X4. Additionally, the chip includes the Mali-G925-Immortalis MC12 GPU, touted as Arm’s most powerful and efficient GPU to date. In tests, the GPU achieved 134fps in the GFXBench Aztec 1440P off-screen Vulkan scene, outperforming the A18 Pro by 86% and the Snapdragon 8 Gen 3 by 41%.

Vivo has confirmed that the X200 series will include three models: Vivo X200, X200 Pro, and X200 Pro Mini. These will be the first phones to feature the Dimensity 9400 SoC. Regarding the chip’s performance, the X200 Pro Satellite Edition, equipped with this chip, has achieved an impressive AnTuTu score exceeding 3 million, making it the first Android flagship to do so.

Vivo X200 series to arrive with top-notch cameras

The Vivo X200 series is expected to provide an exceptional photography experience. A highlight of the X200 Pro is that it will flaunt a 200-megapixel f/2.67 85mm periscope telephoto lens with a V3+ imaging chip, covering focal lengths from 15mm to 85mm. It is the same periscope telephoto lens that’s available on the Vivo X100 Ultra.

The X200 Pro and X200 Pro Mini are both expected to come equipped with the Sony LYT818 f/1.57 23mm main sensor. For optically zoomed shots, the X200 Pro Mini is expected to feature a 70mm mid-telephoto periscope lens.

According to reports, the X200 will come with a 50-megapixel Sony IMX921 primary camera and a 50-megapixel Sony IMX882 (or LYT-600) telephoto camera. All three phones are expected to feature a 50-megapixel Samsung JN1 lens for ultra-wide shots.

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Just days before its official launch, key details about the MediaTek Dimensity 9400’s core configuration have been leaked by trusted tech insider Digital Chat Station (DCS). The leak reveals both the CPU and GPU architecture of the upcoming chipset.

Dimensity 9400 Specifications

According to DCS, the Dimensity 9400 will feature a single prime core, the Cortex-X925, running at 3.62 GHz—a notable jump from the 3.25 GHz speed of the previous generation’s Cortex-X4 core.

The leak also suggests that the three Cortex-X4 cores will retain the same 2.80 GHz clock speed as those in the Dimensity 9300.

There is, however, a slight inconsistency regarding the low-power cores. While earlier reports suggest that the SoC will use newer Cortex-A725 cores would be used, DCS mentions that the Dimensity 9400 may stick with the Cortex-A720 cores from its predecessor. 

This could be a typo by DCS as newer processors are expected to use the most recent CPUs. But even if accurate, the core clock speed is expected to stay at 2.0 GHz. On the graphics side, the leak points to an Immortalis-G925 MC12 GPU clocked at 1.612 GHz. 

Moving on, according to previous reports, the Dimensity 9400 will transition from TSMC’s 4nm node to the second-generation 3nm N3E node. 

The newer manufacturing process should offer improvements in terms of performance as well as efficiency. And being a flagship SoC of 2024/2025, we can also expect it to handle AI tasks quite well.

The MediaTek Dimensity 9400 is also confirmed to feature Samsung’s LPDDR5X memory, the first for the industry. It’s the world’s fastest memory with data transfer speeds reaching 10.7Gbps and is touted for improved on-device AI performance for tasks such as voice-to-text generation.

Based on these leaked specs, here’s how the Dimensity 9400 compares to the Dimensity 9300:

(Source)

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A new leak from usually reliable tech tipster Digital Chat Station (DCS) suggests that the next generation of flagship processors from Qualcomm and MediaTek might come at a steeper price than expected. 

The reason behind this is TSMC’s expensive N3E manufacturing process, which will be the core of both the Snapdragon 8 Gen 4 (or 8 Elite, whatever it is called) from Qualcomm and Dimensity 9400 from MediaTek. The tipster mentions a roughly 20% jump in the price compared to previous generations. 

Here’s how much Snapdragon 8 Gen 4 and Dimensity 9400 might cost

With this increase, the Dimensity 9400 is expected to cost around $155, while the Snapdragon 8 Gen 4 is projected to be about $190. Although chip manufacturers typically do not disclose their prices, a 20% increase implies that last year’s flagship Dimensity 9300 should cost $124, and the Snapdragon 8 Gen 3 should be priced at $152.

This isn’t the first time we’ve heard about the rising cost of upcoming chips. In June, industry analyst Min-Chu Kuo predicted an even steeper increase, suggesting a 25-30% hike—higher than what Digital Chat Station claims. 

Similarly, tipster Ice Universe suggested a 20.68% price increase for the Snapdragon 8 Gen 4 which aligns more closely with DCS’s claims. Regardless of the exact amount, multiple reports confirm that both flagship SoCs are seeing a price hike this year.

And if manufacturers are indeed paying more for these core components, they will likely pass those costs on to consumers. As a result, expect more expensive flagships from brands this year and in 2025.

As for whether the increased cost is justified, the Snapdragon 8 Gen 4 is expected to have some big changes this year. The new SoC will be the first mobile chip from Qualcomm to feature in-house Oryon cores and early benchmarks show a notable performance boost. 

Meanwhile, MediaTek’s Dimensity 9400 will use ARM’s most powerful Cortex-X925 core. The SoC posted the highest AnTuTu benchmark score ever for an Android phone, recently.

(Source)

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MediaTek has constantly been on the headlines recently, mainly due to benchmark news about its upcoming Dimensity 9400 processor. It recently set a new record for the highest score on an Android phone in AnTuTu. Now, its GPU has made a run on another benchmarking platform, Geekbench.

MediaTek Dimensity 9400 GPU Geekbench

The Dimensity 9400 features the Arm Immortalis-G925 MP12 GPU, which scored 16,257 points in Geekbench’s OpenCL benchmark. 

While the score is higher than the Dimensity 9300, the new SoC is just 10% ahead of its predecessor. ARM, the GPU maker, has been touting the Immortalis-G925 as “the highest performing, most efficient GPU” to date. This Geekbench performance suggests otherwise, though. 

However, before we write off the Dimensity 9400’s graphics prowess, important to consider the limitations of benchmarks. Geekbench offers a good starting point for gauging overall performance. However, it doesn’t always tell the whole story. 

In this case, a previous leak suggests the Immortalis-G925 might perform better in real-world scenarios. According to the leak, the Dimensity 9400 might even outperform the Apple A18 Pro in the GFXBench Aztec 1440p off-screen Vulkan benchmark. 

So, there’s still a chance the Dimensity 9400 could perform significantly better in real-world games and other intensive tasks. 

Even if you walk through the raw specs, the Immortalis-G925 has some impressive specs. It has 12 compute units and a peak clock speed of 1.62 GHz, making it one of the fastest smartphone GPUs. 

The benchmark was also conducted on an unreleased Vivo X200 series phone, so the test environment might not have been optimized for the Dimensity 9400.

The official launch of the Dimensity 9400 is scheduled for October 9th. This will hopefully provide a clearer picture of the Immortalis-G925’s true capabilities. Until then, it’s best to hold off on any definitive judgments based solely on Geekbench scores. 

(Source)

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MediaTek has officially announced that its Dimensity 9400 flagship chipset will be launched on October 9. The “AI Chip Leap” slogan for the chipset suggests that it will enable upcoming flagships such as the Oppo Find X8 and Find X8 Pro to offer more demanding AI features.

The Dimensity 9400 will continue the all-large-core CPU design of its predecessor and adopt the ARM ‘BlackHawk’ CPU architecture, which reportedly offers improved performance. For fabrication, Mediatek is using TSMC’s N3E (3nm) process node.

The Dimensity 9400 uses a 3.63 GHz Cortex-X925 super core, 3 2.80 GHz X4 large cores, and 4 2.10 GHz A725 cores. For graphics, it uses the Mali-G925-Immortalis MC12. The chipset also reportedly supports the industry’s fastest 10.7Gbps LPDDR5X memory, which should enable smartphones to offer faster loading times for heavy apps and games.

According to NanoReview, the chipset scores 2874 and 8969 in Geekbench single and multi-core tests respectively. Speaking of graphics, the chipset reached 134fps in the GFX Aztec 1440P off-screen Vulkan test, which is 86% higher than the Apple A18 Pro that powers the iPhone 16 Pro and iPhone 16 Pro Max. It suggests that the upcoming chipset from MediaTek has the potential to offer a major improvement in gaming performance.

It’s worth mentioning that the score was also 41% higher than last year’s Snapdragon 8 Gen 3 chip. Weibo tipster Digital Chat Station also previously revealed that the GPU performance was 30% higher than the Snapdragon 8 Gen 3 in the 3D Mark test while the power consumption was 40% lower.

The ray tracing performance has been improved by nearly 20% compared with the previous generation. MediaTek offered a strong graphics performance last year and this year seems to be no different. The company is also working on a new ray tracing technology for its smartphone chips, which is reportedly comparable to the top ray tracing technology OMM (ray tracing accelerator) on PC. Not to mention, it has the potential to enable smartphone makers to take the graphics quality in games to the next level.

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We know the MediaTek Dimensity 9400 processor is on the horizon, expected for an October reveal. Now, thanks to blogger Digital Chat Station, we have a glimpse of its graphics processing power (GPU) through benchmark scores. 

The leaked data focuses on the Dimensity 9400’s performance in the GFX Aztec 1440P off-screen Vulkan test, a popular benchmark for mobile GPUs. The tipster shared a screenshot showing the upcoming MediaTek SoC scored 134fps in the benchmark. For comparison, Apple’s A18 Pro reportedly reaches 72fps, while the Snapdragon 8 Gen 3 hits 95fps.

The numbers speak for themselves. The Dimensity 9400 reportedly delivers a staggering 86% performance improvement over Apple’s latest A18 Pro chip found in the iPhone 16 Pro series. It also edges out the Snapdragon 8 Gen 3 by a respectable 41%.

The Dimensity 9400 utilizes the latest Mali-G925-Immortalis MC12 GPU, paired with a powerful 3.63GHz Arm Cortex-X925 CPU. We also can’t forget rumors suggesting a 30% jump in GPU performance compared to the Snapdragon 8 Gen 3.

ARM, the maker of the GPU, claims the Immortalis G925 is their “highest performance and most efficient GPU” to date. Compared to the previous generation G720, it boasts:

• 37% increase in graphics application performance
• 52% improvement in ray tracing for complex objects
• 34% boost in AI and machine learning workload performance
• 30% reduction in power consumption

That’s a significant all-around upgrade. We’ll need independent benchmarks to confirm these figures, but the potential is exciting.

Meanwhile, Apple’s A18 Pro utilizes a 6-core GPU and delivers a 20% performance increase over its predecessor. While respectable, it falls short of the Dimensity 9400’s raw power based on these leaks.

It’s still early days, though. Qualcomm’s Snapdragon 8 Gen 4 is also expected to launch in October, and details remain under wraps. The three-way battle for mobile GPU supremacy is definitely heating up, with MediaTek making a bold statement with the Dimensity 9400. We’ll have to wait and see how the final chips stack up.

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The Android market is gearing up for another flagship chipset showdown. MediaTek is set to unveil its new Dimensity 9400 chip, to compete head-on with established players like Qualcomm’s Snapdragon and Samsung’s Exynos series.

Expected to launch by early October, the Dimensity 9400 will face stiff competition from the Apple A18 Pro, Qualcomm Snapdragon 8 Gen 4, and Samsung Exynos 2500. Here’s a breakdown of what to expect from MediaTek’s latest offering.

MediaTek Dimensity 9400 Overview

The Dimensity 9400 will serve as MediaTek’s next flagship chipset in the Dimensity 9000 series, succeeding the Dimensity 9300. One of the highlights of the SoC will be its transition from TSMC’s 4nm node to the second-generation 3nm N3E node. 

The newer manufacturing process should offer improvements in terms of performance as well as efficiency. And being a flagship SoC of 2024/2025, we can also expect it to handle AI tasks quite well. 

The MediaTek Dimensity 9400 is also confirmed to feature Samsung’s LPDDR5X memory, the first for the industry. It’s the world’s fastest memory with data transfer speeds reaching 10.7Gbps and is touted for improved on-device AI performance for tasks such as voice-to-text generation.

According to rumors, the Dimensity 9400 should offer 30% improvement in single-core CPU performance and a 40% boost in Neural Processing Unit (NPU) capabilities compared to its predecessor.

Release Date and Expected Availability

MediaTek is likely to unveil the Dimensity 9400 in October 2024, in line with the company’s history of releasing flagship chips during the final quarter of the year. The Dimensity 9000, 9200, and 9300 were all released in Q4 of 2021, 2022, and 2023 respectively, and it seems MediaTek will continue this trend with its upcoming launch.

While no exact date has been confirmed, a Chinese news outlet has suggested an October 2024 release. This seems more likely now that Vivo has scheduled the release of its X200 series smartphones for October 14. Since these devices are expected to feature the Dimensity 9400, the chipset will likely be unveiled ahead of the smartphone launch.

Key Features of the Dimensity 9400

MediaTek will use TSMC’s 3nm N3E node for the first time with the Dimensity 9400. This advanced node is expected to offer up to 30% energy efficiency compared to previous generations, which could result in noticeable improvements in battery life for devices using this chip.

On the processing side, the Dimensity 9400 will support a tri-cluster octa-core CPU setup, as confirmed via a recent Geekbench AI benchmark listing. The SoC includes a single high-performance Cortex-X5 core running at 3.63 GHz, three Cortex-X4 cores at 2.80 GHz for additional power, and four Cortex-A725 cores at 2.10 GHz for handling everyday tasks.

Compared to the Dimensity 9300, there’s a noticeable boost in clock speed, especially with the prime core which increases from 3.25 GHz to 3.63 GHz. 

However, the competition is tough for MediaTek. Qualcomm’s Snapdragon 8 Gen 4 is rumored to reach a peak clock speed of 4.32 GHz, while Apple’s A18 series supposedly reaches 4.04 GHz.

We’ll have to wait and see how the Dimensity 9400 compares, but here’s how it stacks up against the Dimensity 9300:

Benchmark claims

The SoC hasn’t yet appeared on performance benchmarks, so its exact performance remains unclear. However, rumors have surfaced about how the Dimensity 9400 might perform in these tests.

For instance, the Dimensity 9400 is expected to achieve a Geekbench 6 single-core score of 2700, a 19.3% increase over the Dimensity 9300. Its multi-core score is rumored to reach 9800, reflecting a 24.7% improvement. 

As for the GPU, equipped with the Immortalis G9xx series, it’s expected to deliver 110fps in the GFXBench Aztec Ruins test at 1440p resolution—an 11.1% boost from the previous generation’s 99fps.

Additionally, ray tracing performance is said to have improved by nearly 20% over the previous generation. This performance reportedly brings the Dimensity 9400 closer to offering PC-level ray tracing support.

Phones Expected to Feature the Dimensity 9400

MediaTek chips power a wide range of smartphones, from budget models to high-end devices. The Dimensity 9400 is likely to appear in several flagship Android phones. 

As previously mentioned, the Vivo X200 and X200 Pro are likely to be the first phones to feature this chipset. There are even claims that Vivo may have secured exclusive launch rights for the Dimensity 9400 with its X200 series, which now appears to be true.

Additionally, the Oppo Find X8 and Find X8 Pro are also rumored to be among the first devices to adopt this new chipset.

Why the Dimensity 9400 Matters for Android Devices

The Dimensity 9400’s advancements in CPU and NPU architecture suggest it will bring meaningful improvements to Android devices. With a 30% boost in single-core performance and a 40% improvement in AI-related tasks, users can expect faster processing speeds, better multitasking, and enhanced on-device AI capabilities. These improvements should also translate to more efficient battery usage, allowing smartphones to last longer on a single charge.

The inclusion of Samsung’s LPDDR5X memory at 10.7Gbps and the new Immortalis G9 GPU further enhances the chipset’s potential, particularly for gaming and graphics-heavy applications. 

These upgrades could make the Dimensity 9400 a strong contender in the premium smartphone market, providing stiff competition to Qualcomm’s Snapdragon 8 Gen 4 and Samsung’s Exynos 2500.

Final Thoughts

The MediaTek Dimensity 9400 looks set to be a major player in the high-end smartphone market. It will offer upgrades in performance, battery life, and AI functionality. 

With several key phones likely to feature this chipset, MediaTek is strengthening its position as a key competitor in the industry.

Of course, we will have to wait for the official release to see how the Dimensity 9400 truly stacks up against its rivals. Based on the available details, though, it appears to be a strong contender for Android users, offering the power and efficiency expected from a flagship SoC.

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MediaTek is reportedly aiming for a mid-October release of the Dimensity 9400 chip, which is around the same time Qualcomm will release the Snapdragon 8 Gen 4 chip. Now tipster makes strong claims about the ray tracing performance of the Dimensity 9400.

According to a Weibo post from tipster Ice Universe, the ray tracing performance of Dimensity 9400 has been improved by nearly 20% compared to the previous generation.

He also claims that this is made possible thanks to a new ray tracing technology, which will be released for the first time on the mobile terminal. This is reportedly comparable to the best ray tracing technology OMM (Opacity Micro-Maps) on PC. According to NVIDIA, Opacity Micro-Maps are used to accelerate ray tracing of high detail geometry by efficiently encoding the opacity states of micro-triangles and micro meshes.

Another Weibo tipster named ‘Digital Chat Station’ also made a bold claim about the GPU performance of the Dimensity 9400. He mentioned that the chip scores 30% higher in the 3D Mark test with 40% 40% lower power consumption as compared to the current Snapdragon 8 Gen 3.

The Dimensity 9400 is said to be based on TSMC’s 3nm process, the same as the upcoming Snapdragon 8 Gen 4. The chipset is expected to feature an octa-core architecture consisting of a single Cortex-X5 prime core running at a 3.4GHz clock speed, paired with three Cortex-X4 performance cores, and four Cortex-A720 efficiency cores. The company may also further increase the clock speed of the Cortex-X5 core before launch. Speaking of the CPU performance, the single-core score is said to be around 30% higher than the Dimensity 9300.

The Dimensity 9400 will power flagships like the Vivo X200, Vivo X200 Pro, OPPO Find X8, OPPO Find X8 Pro, and Redmi K80 Ultra.

(Source)

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A recent leak from usually reliable tipster Digital Chat Station suggests that MediaTek is preparing to launch its next flagship chipset, the Dimensity 9400, earlier than usual.

Typically, MediaTek releases its top-tier processors in the last quarter of the year. However, the company is now reportedly aiming for a mid-October release for phones powered by the Dimensity 9400. So we can expect the SoC to be unveiled even earlier. Meanwhile, its competitor Qualcomm is set to launch its Snapdragon 8 Gen 4 on October 21st.

The leak aligns with an earlier report suggesting that the Vivo X200 series or Oppo Find X8 series, powered by the Dimensity 9400, could launch before the Xiaomi 15 series, which is expected to be the first with the Snapdragon 8 Gen 4 processor.

The tipster also notes that Snapdragon 8 Gen 4-powered phones are likely to debut in November or December. Additionally, there’s mention of a mid-range Snapdragon 8 Gen 3 device in the works, though no specific model has been named. Digital Chat Station also mentions the arrival of a Dimensity 8400 chipset targeting the slightly lower price range.

While specific details about the Dimensity 9400 are still scarce, previous leaks suggest it will be built on a 3nm process for improved performance and better battery life.

It will feature an upgraded CPU architecture with the new Cortex-X925 as its performance core. With this, the SoC might deliver up to a 30% increase in single-core performance over its predecessor, if a report is to be believed. 

Moreover, it’s expected to achieve this while consuming 30% less power than the Snapdragon 8 Gen 3 for similar tasks. Additionally, the Dimensity 9400 is set to be the first chip to use Samsung’s lightning-fast 10.7 Gbps LPDDR5x memory, the fastest in the industry.

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Reliable tech tipster Digital Chat Station in a Weibo post revealed that the upcoming Vivo X200 and Oppo Find X8 series, powered by MediaTek’s next-generation Dimensity 9400 chip, will launch ahead of the previously expected Xiaomi 15 series featuring Qualcomm’s Snapdragon 8 Gen 4 processor.

Qualcomm typically releases its flagship SoC first, with MediaTek following about a month later. If this leak holds true, MediaTek may be the first to launch its next-gen flagship SoC this year, along with the phones powered by the chip.

That said, MediaTek has yet to confirm the launch of the Dimensity 9400. Qualcomm, on the other hand, has officially announced the Snapdragon 8 Gen 4 launch at the Snapdragon Summit 2024, starting on October 21.

The Dimensity 9400 looks to be an impressive SoC so far. It’s likely to be the only SoC featuring ARM’s latest Cortex cores, including the new X925 performance core. Meanwhile, Qualcomm is shifting away from its long-favored ARM cores this year, opting for its in-house Oryon CPU cores instead.

A report from earlier this week reveals that the Dimensity 9400 has a 30% increase in single-core performance over its predecessor. 

Considering the Dimensity 9300 scores around 2207 points, we could see the Dimensity 9400 reach 2870 points in Geekbench single-core tests. Interestingly, leaked benchmarks for the Snapdragon 8 Gen 4 show a similar single-core performance of 2884, suggesting a close competition in raw processing power.

The Dimensity 9400 is also rumored to be highly efficient, delivering this performance while consuming 30% less power than the Snapdragon 8 Gen 3 for similar tasks. Additionally, it will be the first chip to use Samsung’s lightning-fast 10.7 Gbps LPDDR5x memory, the fastest in the industry.

The launch of the Vivo X200 and Oppo Find X8 series with Dimensity 9400 earlier could give MediaTek a crucial first-mover advantage, especially if the processor lives up to its efficiency and performance claims. 

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Xiaomi is reportedly testing a phone with the Dimensity 9400 flagship chip. It’s important to note that Xiaomi usually uses Snapdragon flagships to power its flagship devices.

The news comes from Weibo tipster 智慧皮卡丘, who also claimed that the Dimensity 9400 chipset performed well in Xiaomi’s tests and that the phone could launch earlier than its expected launch time.

According to rumors, the MediaTek Dimensity 9400 chip will be equipped with the more advanced TSMC 3nm process. The single-core performance is about 30% higher than the previous Dimensity 9300 chip. It suggests that the Dimensity 9400 will perform similarly to the Snapdragon 8 Gen 4 chip. It is also reported that the Dimensity 9400 should be able to outperform the Apple A17 Pro chip in terms of multi-core performance.

The tipster also hinted that the flagship Xiaomi 15 series will come with an ultrasonic fingerprint scanner, which will be an upgrade from the optical ones Xiaomi has been using for quite a while.

When it comes to the Dimensity 9400-powered phone, it can be the Redmi K80 Ultra or a Xiaomi Civi series device. However, regarding the ahead-of-schedule launch he talked about, it doesn’t seem to be the next K series device. Therefore it is expected to be a Civi series model. Nonetheless, he didn’t reveal anything about the device himself.

The Dimensity 9400 chip will still come with a fully large core design and will boast the Cortex-X925 CPU core developed in cooperation with Arm. This is expected to be the key to the chipset’s 30% improvement in single-core performance. The chipset is also expected to offer an overall improved power efficiency and adopt a faster 10.7 Gbps LPDDR5x memory module.

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MediaTek’s next flagship processor, the Dimensity 9400, is expected to launch in October, ahead of Qualcomm’s Snapdragon 8 Gen 4, which is planned for an October 21st reveal.

A new leak from Digital Chat Station suggests that the Dimensity 9400 will have a 30% improvement in single-core performance compared to its predecessor. 

Based on benchmarks, this increase over the Dimensity 9300 (which scored 2,207 in Geekbench 6.2) suggests a potential score of around 2,869 for the Dimensity 9400. This would put it very close to the Snapdragon 8 Gen 4’s single-core performance of 2,884. This performance boost could likely be due to the collaboration of MediaTek with Arm on the development of the Cortex-X925 CPU core, codenamed Blackhawk. 

Additionally, the leak suggests the Dimensity 9400 achieves this performance while using only 30% of the power consumed by the Snapdragon 8 Gen 3 for similar tasks, highlighting a focus on efficiency.

The Dimensity 9300 featured an all-performance core design, a strategy likely to continue with the 9400. While this approach enhances raw power, it can cause thermal throttling. However, the reported efficiency gains of the Dimensity 9400, along with the use of Samsung’s faster 10.7 Gbps LPDDR5x memory modules, could address these thermal issues and position the chip as a strong competitor in the smartphone processor market.

Both the Dimensity 9400 and Snapdragon 8 Gen 4 are expected to be manufactured on TSMC’s N3 process node, leveling the playing field in terms of raw power.

The real wildcard in this upcoming generation might be Samsung’s Exynos 2500. Rumored to mark a comeback for Samsung’s mobile chip division, it uses the 3GAP process node and incorporates the innovative GAAFET (Gate-All-Around Field-Effect Transistor) technology instead of the traditional FinFET design. 

Additionally, there are rumors of an RDNA 3-based integrated GPU suggesting the Exynos 2500 might become a strong contender in the mobile gaming arena.

While MediaTek’s focus on single-core performance and efficiency promises a competitive offering, the true performance picture will only become clear with benchmark results and real-world testing.

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MediaTek is pursuing the power consumption and efficiency of SoC (system on a chip) with more cutting-edge technology and TSMC’s second-generation 3nm process node. CEO Cai Lixing confirmed that this year’s Dimensity 9400 flagship chipset will be unveiled in October.

Dimensity 9400 reportedly offers 40% higher AI performance as compared to its predecessor

According to the company, the Dimensity 9400 is capable enough to handle most on-device large language models on the market. The CEO is also quite confident that the revenue from this flagship chipset will result in a 50% revenue increase year-over-year.

The news comes from a press conference the company held on the 31st of July. According to the company, the Dimensity 9400 will have 40% higher AI performance as compared to the predecessor. For context, the Dimensity 9300‘s AI performance is measured at 48 TOPS. According to the CEO, MediaTek is leading the market in the NPU (neural processing unit) performance of the flagship SOC. However, he also mentioned that the ASP (average price) of phones with the flagship chip will also be higher as compared to last year.

Speaking of the CPU core configuration, it is rumored that the Dimensity 9400 will lack power-efficient cores, just like its predecessor. The new chip will reportedly use ARM’s BlackHawk CPU architecture and will solely on performance cores to deliver unrivaled single-core and multi-core performance. It’s also rumored that the Dimensity 9400 will boast the largest die ever, which will be measured at 150mm² and will include 30 billion transistors. Nonetheless, we will need to look at real-life test data before commenting on the performance capability of this chip.

MediaTek and Nvidia are also collaborating on automotive chips and are expected to launch the first one in early 2025. It is said that Nvidia will provide the GPU and MediaTek will provide the CPU+ISP. With this development, CEO Cai Lixing expects that there will be significant progress in the automotive field from 2027 to 2028.

(Via)

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Vivo and Oppo are both working on their next-generation flagship phones that will feature the Dimensity 9400 chip. For those who don’t know, the D9400, which is expected to debut in October of this year, will be MediaTek’s most powerful chipset. A new leak by tipster Smart Pikachu suggests that the Vivo X200 Pro and the Oppo Find X8 Pro will be the best Dimensity 9400-powered phones for photography even in 2025.

Vivo X200s, X200s Pro may not launch in 2025

Last year, Vivo announced the Vivo X100 and X100 Pro equipped with the Dimensity 9300 chipset in October. Updated versions of these phones with the Vivo X100s and X100s Pro monikers equipped with the Dimensity 9300+ were announced in May in China.

The above leak suggests that Vivo will not launch the Vivo X200s and Vivo X200s Pro smartphones in 2025. According to the tipster, those seeking a Dimensity 9400-powered flagship phone for photography can either opt for the Vivo X200 Pro or the Oppo Find X8 Pro. He added that there will be no better photography-focused Dimensity 9400 phones than these in 2025. Therefore, it appears that the successors of these phones, possibly featuring the Dimensity 9500 chip and arriving at the end of 2025 may offer a better photography experience.

While he did not mention anything significant about the specifications of the Vivo X200 series or the Oppo Find X8 lineup, he revealed that the standard models (X200 and Find X8) will also offer a stellar photography experience as they will come equipped with a periscope telephoto camera. Both devices will also have a glass back and their highest variant will have 16 GB of RAM and 512 GB of storage.

As per other reports, the X200 Pro may feature a 200-megapixel periscope telephoto camera, a large 2K 120Hz OLED panel with micro-curvature on all four sides and an in-screen fingerprint scanner. The X8 Pro, on the other hand, may feature a quad-camera setup equipped with two periscope telephoto cameras.

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Back in April, Samsung unveiled the industry’s fastest LPDDR5X RAM with data transfer speeds reaching 10.7Gbps. Now, the chip giant has completed verification of this new memory in collaboration with MediaTek.

Samsung paired MediaTek’s upcoming flagship Dimensity 9400 processor with 16GB of the new LPDDR5X RAM to test the memory speed. According to Samsung, the test process took three months, so quite a long time. 

MediaTek is yet to share any details regarding the test or about Dimensity 9400 in its entirety, but it’s now safe to assume that the Dimensity 9400 will be the first chip to support this cutting-edge RAM technology. MediaTek has only confirmed a second-half 2024 release window of the SoC. 

Samsung’s new LPDDR5X promises a 25% improvement in both power efficiency and performance compared to the previous generation. The new memory is also touted for improved on-device AI performance for tasks such as voice-to-text generation. 

The reach of LPDDR5X might extend beyond smartphones since these chips are finding applications in the automotive industry, particularly for AI-powered features like self-driving cars.

Commenting on the development, JC Hsu, Corporate Senior Vice President at MediaTek, stated, “This collaboration with Samsung Electronics has positioned MediaTek’s next-generation Dimensity chipset as the world’s first to be validated for LPDDR5X speeds. This translates to unprecedented levels of AI functionality and mobile performance. The updated architecture empowers developers and users to leverage advanced AI capabilities and enjoy a wider range of features with minimal impact on battery life.”

It remains to be seen how this new hardware combination translates to real-world performance. As the details on the Dimensity 9400 itself are still under wraps, we will have to wait for the official launch to get a clearer picture of the chipset’s capabilities.

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MediaTek recently launched its latest automotive platform, the Dimensity CT-X1. The SoC is particularly important for two reasons: it’s MediaTek’s first chip built on a 3nm manufacturing process, and it features ARM’s next-generation Cortex-X5 CPU core.

The Cortex-X5 core will also power MediaTek’s upcoming flagship mobile chipset, the Dimensity 9400. Now the Dimensity CT-X1 has surfaced on Geekbench, likely from a test machine, revealing what the Cortex-X5 might be capable of.

The chip scored 1606 points in single-core and 5061 points in multi-core tests on Geekbench. These scores fall short of competitors like the Qualcomm Snapdragon 8 Gen 3 and even MediaTek’s own Dimensity 9300.

But it’s likely due to the lower clock speed of the Cortex-X5 core in the CT-X1, which is clocked at 2.12 GHz, according to leakster Digital Chat Station. The leakster also clarifies that this is a test sample of the chipset.

Despite the lower clock speed, reports suggest the IPC (instructions per clock) of the Dimensity 9400 will be close to Apple’s A17 Pro chip and will even surpass to that of Qualcomm Snapdragon 8 Gen 4 which will have custom Oryon cores. 

DCS further suggests that the Dimensity 9400 might debut first in a Vivo smartphone, followed by an Oppo model.

But keep in mind that the Dimensity CT-X1 performance doesn’t necessarily reflect the final performance of the Dimensity 9400. The final clock speeds and optimizations in the 9400 will significantly impact its benchmark scores.

More information about the Dimensity 9400, including its official launch date and specifications is likely to surface closer to its release.

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Details about the upcoming MediaTek Dimensity 9400 keep popping up, and the latest rumor suggests it might be much faster than its rivals. 

A trustworthy source, Digital Chat Station (DCS) claims that the Dimensity 9400 will outperform Qualcomm’s Snapdragon 8 Gen 4 and Apple’s A17 Pro in terms of instructions per clock (IPC) performance.

DCS confirms earlier leaks that MediaTek and ARM are working closely to develop the next-generation Dimensity 9400. This chip will reportedly use ARM’s newest CPU architecture which is codenamed “BlackHawk.”

Meanwhile, Qualcomm is going a different route altogether as it will use Nuvia-designed CPU cores in the Snapdragon 8 Gen 4. That’s a departure from their usual ARM-based designs for flagship SoCs.

The big news from the leak is that the Dimensity 9400’s Cortex-X5 core supposedly offers better IPC performance than Qualcomm’s Nuvia cores and Apple’s A17 Pro core in the iPhone 15 Pro. However, DCS hasn’t shared any concrete numbers to back up these claims.

If the Dimensity 9400 indeed surpasses Qualcomm’s new Nuvia cores in IPC, it could mean a significant performance boost over the current generation. 

However, it’s important to remember that these are just leaks. We’ll need to wait for the official specs and benchmarks to surface to confirm the Dimensity 9400’s true capabilities.

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MediaTek is poised to make strides in the flagship chip market with the forthcoming Dimensity 9400. Leaked details indicate the chip aims for notable performance upgrades compared to its predecessor, the Dimensity 9300, potentially challenging Qualcomm’s stronghold in the high-end segment. The chipset is expected to launch in the fourth quarter of this year.

Dimensity 9400 Will Feature Immortalis G9xx Series GPU

Renowned tipster Digital Chat Station has shared intriguing details about the chipset. He reports that the Dimensity 9400 has achieved a Geekbench 6 single-core score of 2700, which is a notable 19.3% increase over the Dimensity 9300. Furthermore, its multi-core score reaches 9800, marking a 24.7% improvement. The GPU, equipped with the Immortalis G9xx series, is expected to deliver a framerate of 110fps in the GFXBench Aztec Ruins test at 1440p resolution, an 11.1% improvement from the previous generation’s 99fps.

Leaks suggest MediaTek will continue to rely on ARM’s CPU and GPU architectures this year. The Dimensity 9400 will benefit from TSMC’s advanced 3nm manufacturing process, promising a 32% boost in power efficiency. Its CPU setup is planned to include one Cortex-X5 prime core, three Cortex-X4 prime cores, and four Cortex-A720 performance cores—a step up from the Dimensity 9300’s configuration, which was built on a 4nm process.

The chipset is also expected to support advanced memory and AI processing technologies. It will support LPDDR5T RAM, which is crucial for enhancing on-device AI capabilities, potentially outperforming the Dimensity 9300’s 33 billion parameter large language model.

Despite these advancements, MediaTek‘s new chip still faces tough competition, particularly from the upcoming Snapdragon 8 Gen 4. Initial Geekbench comparisons suggest that while the Dimensity 9400 shows considerable improvements, it may not fully surpass the performance benchmarks of its rivals.

Concerns have also been raised about the power consumption and performance of the Cortex-X5 core at different clock speeds. MediaTek is expected to address these issues to find the perfect balance between power and efficiency, ensuring the Dimensity 9400 achieves its full potential.

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Taiwanese chipmaker MediaTek held a ceremony on January 30th to mark the start of construction for a new office building near the Hsinchu High-speed Railway station. The 22-story building is expected to accommodate 3,000 employees by 2027.

During the event, CEO Cai Lixing mentioned the upcoming Dimensity 9400 chip (though not specifically referred to) will arrive in the fourth quarter of 2024. According to Cai, the new SoC will boast improved AI capabilities, aiming to compete with other high-end smartphone processors.

Even though we don’t know all the details about its performance, a report by China Times spilled some beans about the Dimensity 9400. 

The leak includes a table detailing potential upgrades for the upcoming SoC, which unsurprisingly mentions the use of TSMC’s 3nm process. The switch from 4nm to 3nm should result in improved performance and power efficiency compared to its predecessor, the Dimensity 9300.

Moreover, unlike Qualcomm, which is transitioning to its custom Oryon CPU cores, MediaTek will likely stick with Arm’s CPU designs and will upgrade to the Cortex-X5 for its main core. Besides this, the Dimensity 9400 will have three Cortex-X4 and four Cortex-A720 performance cores. 

The leaked details also suggest that the Dimensity 9400 will be able to process 12 to 15 tokens (most basic units of a text for an LLM) per second using a specific model called Llama 2 from Meta. 

Additionally, for image creation using Stable Diffusion 1.5, the Dimensity 9400 is expected to be faster than the 9300, taking only 3 seconds compared to 3.5 seconds.

This improvement will make the Dimensity 9400, and its APU 790 successor, potentially 20-50% faster for processing tokens and up to 16.7% faster for image creation. 

These are still early details about the MediaTek Dimensity 9400, so we suggest you take this information with a pinch of salt.

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The upcoming next-generation System-on-Chips (SoCs) from Qualcomm and MediaTek are expected to be the world’s first 3nm SoCs. Although their official announcements are still far away, leaks have begun surfacing, providing a glimpse into what these chips might offer. 

A well-known source, Digital Chat Station, suggests that MediaTek’s Dimensity 9400 SoC could outperform Qualcomm in all aspects.

According to the tipster, the Dimensity 9400 will differ from its predecessor, the Dimensity 9300, as it won’t feature four Cortex-X5 performance cores. 

It will still maintain a configuration with performance cores throughout, omitting the inclusion of efficiency cores. However, the company might be looking to decrease the X-core count on their next SoC. 

The lack of an efficiency core may raise concerns about the processor’s efficiency, but the 3nm manufacturing process is expected to enhance thermal efficiency due to improved fabrication.

Details regarding the GPU of the upcoming SoC are currently unavailable. As a result, the tipster might be focusing solely on comparing the CPU performance of the Dimensity 9400 with Qualcomm’s Snapdragon 8 Gen 4.

Moreover, Vivo is also expected to play a significant role in the development of the MediaTek Dimensity 9400 chip. A previous report suggests that Vivo is actively involved in this chip’s development, building on their collaboration with MediaTek on the Dimensity 9300, particularly in the AI domain. 

While much remains unknown about the Dimensity 9400 and its performance, it is certain that Qualcomm is also working hard on its first 3nm mobile processor, the Snapdragon 8 Gen 4. We will be sure to keep an eye on it.

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Vivo has emerged as a key player in the development of MediaTek‘s flagship chips. While we were already aware of Vivo’s collaboration with MediaTek on the Dimensity 9300 particularly in the field of AI, a recent report by CNMO suggests that the company is also actively involved in the development of the upcoming Dimensity 9400. Industry insiders have highlighted that Vivo’s influence within MediaTek allows it to stay ahead in the market by incorporating cutting-edge flagship chips into its products.

Vivo’s Strategic Role in Advancing MediaTek’s Dimensity Series

The MediaTek Dimensity 9300 is a flagship 5G AI mobile chip manufactured using a TSMC’s 4nm process with 22.7 billion transistors. It integrates 1B and 7B AI language models and a 1B AI vision model directly into devices. This integration enhances data security, improves real-time performance, and enables personalized user experiences by keeping sensitive data on the device and tailoring AI functions to individual preferences.

The collaboration between Vivo and MediaTek centers around MediaTek’s flagship AI processor APU and the AI development platform NeuroPilot, which greatly improves the operational efficiency of AI models on devices, providing powerful and efficient AI experiences. Vivo’s smartphones, notably the Vivo X100 series benefit substantially from this tech, positioning them as leaders in on-device AI models.

The partnership has been mutually beneficial, with Vivo’s X90 series being the first to feature the Dimensity 9200 processor globally, garnering significant user attention. This trend continued with the Vivo X100 series. Moreover, the Dimensity 8200 mid-range chip was launched worldwide through Vivo’s iQOO brand with the iQOO Neo 7 SE model.

Additionally, MediaTek is also working with OPPO on AI integration into their chips, highlighting the industry’s focus on advanced AI capabilities in smartphones.

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(Via)

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