Samsung has just released the Exynos 2600 with the Galaxy S26 series, and it feels like a real upgrade rather than just an annual refresh. The CPU now features all big cores, the GPU’s performance has improved dramatically, and the connectivity speed is just unmatched.

While the Exynos 2600 brings serious upgrades over the Exynos 2500, the real question is: how does it perform against its biggest rivals, the Snapdragon 8 Elite Gen 5 and Dimensity 9500? We’ll look at the spec sheet, benchmark numbers, and important differences to figure it out.

Here’s the spec sheet to begin with:

Quick verdict:

Choose Snapdragon 8 Elite Gen 5 if you want the best overall performance, stronger gaming power, and the most complete flagship experience.
Choose Dimensity 9500 if you care more about better gaming stability under heavy load and strong Wi-Fi 7 performance.
Choose Exynos 2600 if you want a more balanced chip with solid everyday performance, strong memory results, and promising efficiency and connectivity upgrades.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Exynos 2600: Benchmark numbers

Note: To obtain the benchmark results, the tests were performed using these devices:
– Galaxy S26 Ultra (Snapdragon 8 Elite Gen 5)
– Vivo X300 Pro (Dimensity 9500)
– Galaxy S26 Plus (Exynos 2600)

Geekbench score

The Snapdragon 8 Elite Gen 5 delivers the best result in the Geekbench CPU test. It scored 3725 points in the single-core test, which is about 7% higher than the Dimensity 9500 (3452 points) and about 22% higher than the Exynos 2600 (3040 points).

In multi-core performance, however, the Exynos 2600 delivers a noticeably better score than the Dimensity 9500, scoring 10,290 points (vs. 10,128). The Snapdragon 8 Elite Gen 5 is miles ahead of them with a total score of 11,318 points.

AnTuTu score

On the AnTuTu platform, the Snapdragon 8 Elite Gen 5 has scored close to 3.9 million points, putting it well ahead of the other two. The Dimensity 9500 scored 3.5 million, and the Exynos 2600 scored 3.2 million.

More important is the breakdown of the total score, which offers clearer insights. It shows a stronger CPU for the Snapdragon 8 Elite Gen 5, which scored 1.16 million points, followed by the Exynos 2600 (1.06 million points) and the Dimensity 9500 (1.03 million points).

The Snapdragon chip also scores the highest in the GPU test among the three chips, with a total of 1.56 million. The Dimensity 9500 is just behind it with 1.41 million score, while the gap widens with Exynos 2600, which has scored just 1.21 million points. Memory performance, however, favors the Exynos chip over the other two.

3DMark score

Wild Life Extreme performance

The Snapdragon 8 Elite Gen 5 takes the top spot here as well with the best score of 7786. The Dimensity 9500 sits below it with 7,163 points, and then comes the Exynos 2600  with 7,061 points. However, the order changes in the low score.

The Dimensity 9500 surprises with the best low score of 4,092 points. The Snapdragon 8 Elite Gen 5 and Exynos 2600 achieve a low score of 3,753 and 3,280, respectively. This results in better stability on Dimensity 9500.

According to benchmark results we’ve seen so far, the Snapdragon 8 Elite Gen 5 offers much more promising CPU and GPU performance than the other two, while the competition between the Dimensity 9500 and Exynos 2600 is closer.

The benchmarks alone do not tell the full story; therefore, we’ve included a section below that discusses the camera, connectivity, and other important aspects.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Exynos 2600: The differences you should know

The Snapdragon 8 Elite Gen 5 and Dimensity 9500 were announced in September 2025, built using TSMC’s advanced 3nm process node. Three months later, the Exynos 2600 arrived as the world’s first mobile chipset to use the 2nm GAA process, offering enhanced efficiency and thermals.

Performance

The Snapdragon 8 Elite Gen 5 offers an 8-core CPU, featuring third-generation Oryon cores, while the Dimensity’s 8-core CPU includes ARM’s C1-Ultra, C1-Premium, and C1-Pro cores. Unlike them, the Exynos 2600 features a 10-core CPU comprising C1-Ultra and C1-Pro cores.

The Snapdragon chip offers the highest peak clocked speed of 4.6 GHz, while the Dimensity 9500 peaks at 4.21 GHz and the Exynos 2600 peaks at 3.8 GHz. This helps the Snapdragon 8 Elite Gen 5 achieve better performance during demanding tasks.

For graphics-intensive workloads, the Snapdragon 8 Elite Gen 5 relies on the Adreno 840 GPU, which delivers excellent gaming performance and ray tracing capabilities. Plus, it comes with a full suite of Snapdragon Elite Gaming features to further enhance the gaming performance, stability, and battery efficiency.

The other two chips, the Dimensity 9500 and Exynos 2600, also deliver smooth gaming performance and support ray tracing. Plus, they integrate a range of features to improve the frame rate and the overall performance. Notably, the Exynos 2600 features Heat Path Block (HPB) for the first time on a mobile chipset, while the Snapdragon 8 Elite Gen 5 and Dimensity 9500 rely on phone-level passing cooling solutions, such as vapor chambers and graphite sheets.

AI and NPU

The Snapdragon 8 Elite Gen 5 features a hexagon NPU with agentic AI capabilities, enabling a proactive, on-device AI assistant for a personalised experience. The Dimensity 9500 with MediaTek NPU 990 NPU also supports agentic AI, but it isn’t explicitly mentioned on the Exynos 2600 official page. However, the latter, with 32K MAC NPU, offers on-device inference, Visual Perception System for proactive camera AI, and Nota AI integration for enhanced offline processing.

Camera and connectivity

All three chips feature advanced triple ISPs with support for up to 320MP single camera, real-time semantic segmentation, and 8K video recording. The Snapdragon and Exynos chips also offer Advanced Professional Video (APV) codec for lossless pro-level video capture and editing on smartphones.

On the connectivity side, there are several crucial differences. The Snapdragon 8 Elite Gen 5 and Exynos 2600 have integrated 5G modems, while the Exynos 2600 uses an external modem for better manufacturing yields and improved power efficiency. Furthermore, the Exynos chip excels at peak upload and download speeds over a 5G connection, while the Dimensity 9500 offers the highest Wi-Fi 7 speeds. The Snapdragon chip benefits from a mature modem with superior carrier integration.

The post Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Exynos 2600: Benchmark score, spec sheet, and key differences appeared first on Gizmochina.

The Snapdragon 8 Gen 5 is a powerful high-end chipset from Qualcomm, featuring third-generation Oryon CPU, the same CPU from the top-tier Snapdragon 8 Elite Gen 5 chip, but at a lower price. The chipset also integrates a capable Adreno GPU, advanced camera ISP, and robust connectivity, making it a well-rounded option.

On the other hand, the Dimensity 9500 is MediaTek’s most premium smartphone chip, featuring newer-gen C1-series cores. This chip offers serious performance and power efficiency. It would be exciting to see how the Snapdragon 8 Gen 5 performs against the Dimensity 9500. So, let’s dive in.

Here’s the spec sheet to begin with:

Snapdragon 8 Gen 5 vs Dimensity 9500: Benchmark score

Note: The benchmark tests were performed on the OnePlus 15R (powered by Snapdragon 8 Gen 5) and the Vivo X300 Pro (powered by Dimensity 9500).

Geekbench score

The Dimensity 9500 comfortably outperforms the Snapdragon 8 Gen 5 on Geekbench, with a 21% higher single-core score and an 8% higher multi-core score. This should result in better peak performance on Dimensity 9500-powered devices across tasks that require either a single CPU core or multiple cores.

AnTuTu score

AnTuTu scores tell a similar story, with the Dimensity 9500 getting about 22% higher score than the Snapdragon 8 Gen 5. The Dimensity chip continues to lead the CPU score, but the GPU makes a bigger impact here, with a massive 40% higher score. The memory score is more than twice that of the Snapdragon 8 Gen 5, while the user experience (UX) score just beats the Snapdragon chip.

Benchmark scores suggest a clear performance advantage for the Dimensity 9500 over the Snapdragon 8 Gen 5. However, that’s not the complete picture. They do not cover every aspect, such as connectivity, on-device AI, ISP, and more. So, let’s dig further to find out which one is actually the better chipset overall.

Snapdragon 8 Gen 5 vs Dimensity 9500: Key differences that matter

CPU, GPU, & NPU

The Snapdragon 8 Gen 5 uses a 2+6 CPU configuration, featuring two Oryon prime cores and six Oryon performance cores. In contrast, the Dimensity 9500 features a 1+3+4 CPU configuration, with one Cortex C1-Ultra prime core, three Cortex C1-Premium performance cores, and four Cortex C1-Pro lower-power cores. The Dimensity chip has a higher peak speed, allowing it to achieve higher peak performance. We just saw that in benchmark scores.

For rendering graphics, the Snapdragon 8 Gen 5 primarily relies on the Adreno 829, leveraging the Qualcomm Sliced architecture and a full suite of Snapdragon Elite Gaming features to deliver smooth gaming performance with lower latency and stable frame rates. In contrast, the Dimensity 9500s uses Mali-G1 Ultra MP12 GPU with support for MediaTek HyperEngine Gaming Technology and 120fps ray-traced mobile gaming.

Both chipsets feature capable NPUs (the Hexagon NPU on the Snapdragon 8 Gen 5 and the MediaTek NPU 990 on the Dimensity 9500) with multimodal and agentic AI capabilities. The AI also helps optimize camera output, the gaming experience, and connectivity.

Camera, ISP, & connectivity

The Snapdragon 8 Gen 5 uses a 20-bit Spectra triple AI-ISP, while the Dimensity 9500 relies on the Imagiq 1190 ISP to convert raw data into usable photos and videos. Additionally, there are numerous features to improve the output quality. Furthermore, there are additional optimizations from the smartphone brand that could make a significant difference.

Both chipsets deliver robust connectivity features, including 5G support, Bluetooth 6.0 standard, and impressive peak download and upload speeds. However, Qualcomm may have an edge in some markets, such as North America, due to stronger carrier aggregation and more mature modem capabilities.

Snapdragon 8 Gen 5 vs Dimensity 9500: Which is a better choice?

The Dimensity 9500 is the better choice overall. Its newer C1-series CPU cores, higher clock speeds, and stronger GPU output translate into superior benchmark scores and better peak performance, especially in demanding tasks and high-end gaming. The chip should also deliver better power efficiency.

However, if peak performance and longer gaming sessions are not your thing, the Snapdragon 8 Gen 5 is actually a more sensible choice. It delivers robust connectivity, a mature ISP, and better computational photography. On top of everything, the Snapdragon 8 Gen 5 phones tend to be cheaper than phones powered by Dimensity 9500.

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MediaTek’s Dimensity 9400 made a strong impression last year, but it couldn’t quite outperform Qualcomm’s powerhouse, the Snapdragon 8 Elite. Fast forward to September, and MediaTek is back with a bold new challenger: the Dimensity 9500. The company claims it brings massive gains in performance, power efficiency, and AI processing — all areas where Snapdragon has long dominated.

The Dimensity 9500 is MediaTek’s best shot yet at taking the performance crown. But does it finally outmuscle the Snapdragon 8 Elite, or is Qualcomm still the benchmark to beat? Let’s dive into the numbers and find out.

Let’s begin with the spec sheet.

Dimensity 9500 vs Snapdragon 8 Elite: benchmark comparison

Note: For benchmark numbers, we tested the Vivo X300 Pro (Dimensity 9500) and Xiaomi 15 (Snapdragon 8 Elite).

Geekbench score

On the Geekbench 6 platform, the Dimensity 9500 achieves roughly 13% higher score in single-core and 9% higher score in multi-core performance. While these are not huge leaps, the Dimensity 9500-powered phones should feel faster compared to Snapdragon 8 Elite.

AnTuTu score

On AnTuTu v11, MediaTek’s chip takes a clear lead with a total score about 22% higher than the Snapdragon 8 Elite.

The CPU gains are modest at around 5%, but the GPU score jumps by over 25%, signaling a major leap in graphics performance. The Dimensity 9500 also shows stronger memory and UX performance, hinting at smoother multitasking and faster app responsiveness.

3D Mark Wild Life Extreme score

The 3D Mark’s Wide Life Extreme is a popular gaming benchmark that measures a GPU’s performance under demanding graphics workloads.

The high score represents the best performance when the device runs at its maximum capability. In other words, it represents how well a device can handle short bursts of intense graphics workloads, similar to what happens in demanding mobile games. The low score reflects how well the device maintains performance over time, showing the impact of thermal throttling and sustained workload management.

Here, the Dimensity 9500 delivers a 49% higher high score and 17% higher sustained score, suggesting it can maintain better performance over longer gaming sessions.

Dimensity 9500 vs Snapdragon 8 Elite: key differences

Both chips have been manufactured by TSMC using its 3nm process node, but they still bring several differences. The Dimensity 9500 utilizes the latest N3P technology, which provides slightly improved performance and power efficiency compared to the N3E process used for the Snapdragon 8 Elite.

The Dimensity 9500’s CPU consists of the latest ARM cores, which include one C1-Ultra core, three C1-Premium cores, and four C1-Pro cores. The Snapdragon 8 Elite, on the other hand, uses self-designed second-generation Oryon CPU cores. In fact, this is the first Qualcomm mobile chipset to feature Oryon cores.

For the graphics-related tasks such as gaming and visual rendering, the Dimensity 9500 features a 12-core Mali-G1 Ultra GPU with support for 120fps ray-traced mobile gaming. The chip also features MediaTek HyperEngine Gaming Technology, a suite of gaming features designed to offer optimized gaming performance and power efficiency.

The Snapdragon 8 Elite is equipped with the Adreno 830 GPU, featuring the new sliced architecture. It also supports hardware-based ray tracing and the Snapdragon Elite Gaming features for an enhanced gaming experience.

The two chipsets also don’t miss out on the on-device AI capabilities, thanks to MediaTek NPU 990 on the Dimensity 9500 and a Qualcomm Hexagon NPU on the Snapdragon 8 Elite. Both are high-performance and highly efficient NPUs with large context windows and agentic AI capabilities. The NPUs also help optimize camera performance, connectivity, and gaming.

The Dimensity 9500 features the Imagiq 1190 ISP, which supports up to 320MP single camera and up to 8K video recording. MediaTek says the chip can record 4K/120fps videos with electronic image stabilization (EIS) and 4K/60fps cinematic video. The chip also supports real-time semantic segmentation.

The Snapdragon 8 Elite also features power camera capabilities, enabling up to 320MP single-camera capture and up to 8K video recording. It features 18-bit triple ISPs with limitless semantic segmentation at 4K resolution. Additionally, the chip offers numerous camera features, including AI-based auto-exposure, AI-based auto-focus, AI-based face detection, Truepic photo capture, Video super resolution, and Engine for Visual Analytics 3.0.

The two flagship chipsets also bring notable differences in connectivity. The Dimensity 9500, featuring a 3GPP Release-17 5G modem, supports a peak speed of up to 7.4 Gbps. On a Wi-Fi 7 connection, it can reach up to 7.3 Gbps. On the other hand, the Snapdragon 8 Elite’s X80 5G modem supports download speeds of up to 10 Gbps and upload speeds of up to 3.5 Gbps. The peak speed over a Wi-Fi 7 connection is 5.8 Gbps. In short, MediaTek leads in Wi-Fi throughput, while Qualcomm maintains an edge in 5G performance.

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The smartphone chip battle between Qualcomm, MediaTek, and Apple is more intense than ever before. All three have made huge progress with their high-end chips in recent years, particularly MediaTek, which is emerging as a strong competitor to the other two. Its latest Dimensity 9500 chip goes neck-to-neck with the Snapdragon 8 Elite Gen 5 and Apple A19 Pro on benchmarks.

Here, we’ll look at the benchmark data and real-world differences to find out who has the edge over the other two chipsets.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Apple A19 Pro: benchmark comparison

Note: Devices that have been used for benchmark testing are Honor Magic 8 (Snapdragon 8 Elite Gen 5), Vivo X300 Pro (Dimensity 9500), and iPhone 17 Pro (Apple A19 Pro).

Geekbench score

Apple still leads the single-core chart with 3,784 points, the most for a smartphone chipset, but the Snapdragon 8 Elite Gen 5 with 3,634 points is not very much behind. The Dimensity 9500 sits behind the two with 3,177 points.

The multi-core score is an entirely different story, as the Snapdragon 8 Elite Gen 5 leads the race with 10,813 points. This is about 11% higher than the Dimensity 9500 (9701 points) and Apple A19 Pro (9752 points).

In short, the Apple A19 Pro leads the single-core chart, but the Snapdragon 8 Elite Gen 5 makes a strong comeback in the multi-core territory. The Dimensity 9500 lags behind the two, but the gap has significantly narrowed over the years.

AnTuTu score

On the AnTuTu v11 platform, the Snapdragon 8 Elite Gen 5 gets about 4.16 million total score. The Dimensity 9500 is a little behind with a 4 million score, while the Apple A19 Pro is nowhere near either of them, scoring about 2.43 million points.

There are several reasons for this massive difference between the Apple A19 Pro and the other two chips from Qualcomm and MediaTek. One is that AnTuTu uses different testing methods for iOS and Android devices. Secondly, the A19 Pro has been tested on AnTuTu v10, while the Snapdragon and Dimensity chips have been tested on a newer AnTuTu v11 platform.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Apple A19 Pro: spec sheet and key differences

The Snapdragon 8 Elite Gen 5, Dimensity 9500, and Apple A19 Pro were announced in September, built using the same TSMC’s 3nm (N3P) process node. The Snapdragon 8 Elite Gen 5 features eight third-gen Oryon CPU cores, with two of them running at 4.61 GHz and the remaining six at 3.63 GHz.

The Dimensity 9500 uses the latest ARM cores, featuring one C1-Ultra at 4.21 GHz, three C1-Premium at 3.5 GHz, and four C1-Pro at 2.7 GHz. Unlike the two, the Apple A19 Pro features six CPU cores, with two performance cores at 4.26 GHz and six performance cores at 2.6 GHz.

As for the graphics needs, the Snapdragon chip relies on the newly announced Adreno 840 with improved ray tracing capabilities, better performance, and power efficiency. The 12-core Mali-G1 Ultra on the Dimensity 9500 and the 6-core Apple GPU on the A19 Pro also bring substantial gaming enhancements.

The flagship chips also bring better on-device AI capabilities. They use the same LPDDR5x memory, although the storage type differs: UFS 4.1 on Snapdragon 8 Elite Gen 5 and NVMe on Apple A19 Pro. The connectivity part brings notable differences, with the Snapdragon 8 Elite Gen 5 featuring the highest peak download speed of 12.5 Gbps. The Dimensity 9500 makes a comeback by offering the highest Wi-Fi speed (7.3 Gbps). The Apple A19 Pro uses a Snapdragon X80 5G modem, which was used on last year’s Snapdragon 8 Elite.

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The Dimensity 9500 is the latest and greatest mobile chipset from MediaTek, promising a significant boost to performance and power efficiency across CPU and GPU. The NPU, camera, and connectivity have also received notable upgrades, making it a well-rounded option for high-end devices.

Built on TSMC’s 3nm (N3P) process node, the latest Dimensity chip adopts a third-generation “All Big Core” CPU design featuring ARM’s latest C1-series processors, which promises a significant boost to performance and power efficiency. The new 12-core Mali-G1 Ultra GPU also delivers notable performance gains and enhancements for ray tracing.

The Dimensity 9500 looks excellent on paper, but how big of an upgrade is it over last year’s Dimensity 9400? Let’s look at the benchmark scores to find out.

Dimensity 9500 vs Dimensity 9400: benchmark score

Note: The benchmark scores were obtained from leaked listings of Vivo X300 Pro (Dimensity 9500). For Dimensity 9400, we used the Vivo X200 Pro.

Geekbench score

On the Geekbench 6 platform, the Dimensity 9500 gets 3,177 in single core, which is about 18% higher than the Dimensity 9400. The gap widens further in multi-core, where the Dimensity chip has posted a total score of 9,701, while its predecessor couldn’t cross the 8,000 mark. That’s a solid 25% gain in multi-core score for the newer chip.

AnTuTu score

On the AnTuTu benchmarking platform, the Dimensity 9500’s total score crosses the 4 million mark, which is a big achievement in itself. This is about 57% higher than Dimensity 9400.

The breakdown reveals that the Dimensity 9500’s CPU achieves a significantly higher CPU score (1,043,247 vs 591,239). That’s a solid 76% increase. The GPU gets a 32% higher score (1,510,982 vs 1,144,638). The memory (667,254 vs. 411,334) and the UX (790,449 vs. 394,544) have also gained about 62% and 100% higher scores, respectively.

The latest advancements to the Dimensity 9500 are the driving factors behind this significant gap, but this is also partly due to differences in AnTuTu versions. The AnTuTu score for the Vivo X200 Pro (powered by Dimensity 9400) is from AnTuTu v10, while the X300 Pro (powered by Dimensity 9500) is tested on a newer version, v11. So, we’ll update the score for Dimensity 9400 after benchmarking on the same AnTuTu version for a fair comparison.

Dimensity 9500 vs Dimensity 9400: spec sheet

Key upgrades to Dimensity 9500

The Dimensity 9500 brings comprehensive upgrades across all major components. It’s built on TSMC’s 3nm (N3P) process node, which offers better performance and power efficiency over the N3E node used for Dimensity 9400.

CPU, GPU, and NPU

The latest Dimensity chip adopts MediaTek’s third-generation “All Big Core” CPU design, featuring ARM’s latest C1-series processors. The chipmaker claims a 32% uplift in single core performance and a modest 17% jump in multi-core performance. Remarkably, the Ultra core achieves 55% lower power consumption at peak performance, while there’s a 37% reduction in power consumption at peak CPU usage. The overall chip is 30% more power efficient during multitasking in gaming and social audio applications.

The Dimensity 9500 also brings significant upgrades to graphics capabilities and gaming experience. The new 12-core ARM Mali-G1 Ultra GPU, combined with MediaTek HyperEngine Gaming Technology, offers 33% faster GPU performance and 42% improved power efficiency at peak performance. Furthermore, the Dimensity 9500 claims a 119% boost to raytracing performance.

The chip introduces MRFC 3.0 technology to upgrade 60fps titles to 120fps. In fact, it’s the first mobile chipset to support 120FPS raytraced mobile gaming. Furthermore, the Dimensity 9500 debuts two first-to-market features: support for the Vulkan Raytracing Pipeline and native Unreal Engine 5.5+ integration, further enhancing the gaming experience. The GPU also supports advanced gaming technologies, including MegaLights and Nanite, enabling console-class rendering and lighting effects on mobile devices.

The Dimensity 9500 introduces the ninth-generation MediaTek NPU 990, paired with Generative AI Engine 2.0 doubles the computer power for seamless and immediate AI execution. Furthermore, it offers 100% faster 3 billion parameter LLM output, 128K token long text processing, and 4K ultra-high-definition image generation on-device. On top of this, the peak power consumption has reduced by 56%.

Storage, Camera, and Connectivity

The storage read/write speed has doubled compared to UFS 4.0 in the Dimensity 9400. This also helps in 40% faster loading of AI models. There’s no change to memory, though — still LPDDR5X at 10667 Mbps.

The Dimensity 9500 still supports up to 320MP camera, but it introduces a new Imagiq 1190 ISP with higher bandwidth and lower latency, and brings support for RAW-domain pre-processing for cleaner detail and color fidelity. It introduces a powerful AI denoise technology, which works with up to 200MP camera capture. The video capture capabilities have also improved, with the inclusion of support for 4K/120fps video capture with EIS and 4K/60fps cinematic video capture. In contrast, the Dimensity 9400 only supports 4K/60fps video capture.

The connectivity part has also received several upgrades, including a 10% reduction in power consumption for 5G, a 20% reduction in power consumption for Wi-Fi, and a 50% reduction in latency, thanks to AI-assisted technologies. The AI also helps to achieve 20% higher signal accuracy. The peak connection speed on a 5G network has increased to 7.4Gbps (up from 7Gbps), while the peak Wi-Fi speed remains unchanged at 7.3Gbps.

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MediaTek’s Dimensity 9500 chipset is set to power a new generation of flagship smartphones. Built on a 3nm process, the chip features console-grade ray tracing, improved AI capabilities, and major gains in power efficiency.

It introduces an updated NPU, a faster CPU architecture, and support for advanced display and camera features. The first phones with the Dimensity 9500 will arrive in October, with Vivo and Oppo leading the charge.

Vivo X300 & X300 Pro

Vivo will be the first brand to launch Dimensity 9500-powered phones. The company will unveil the Vivo X300 series on October 13 in China. The lineup includes the standard X300 and the higher-end X300 Pro.

As per leaks, both devices use BOE’s Q10 Plus LTPO OLED displays with a 1.5K resolution and 120Hz refresh rate. The X300 has a 6.31-inch screen, while the X300 Pro features a 6.78-inch panel. The panels support minimum brightness as low as 1 nit for better eye protection.

Vivo has equipped both models with the Dimensity 9500 chip. This enables faster performance, hardware-based ray tracing, and AI enhancements for imaging and power management. The X300 Pro has a triple rear camera setup with a 50MP Sony LYT-828 sensor, a 200MP Samsung HPB periscope telephoto lens, and a 50MP JN5 ultra-wide camera.

The X300 has a slightly different configuration, using the same 200MP HPB sensor as its main camera, alongside a 50MP ultra-wide lens and a 50MP Sony LYT602 periscope unit. Both phones support 4K 60fps portrait video recording and Zeiss optics.

According to a recent leak, the X300 will feature a 6,040mAh battery, while the X300 Pro will use a larger 6,510mAh unit. Both support 90W wired charging and fast wireless charging. The phones will ship with Android 16 and Vivo’s OriginOS 6, which includes ecosystem support for Apple devices.

Oppo Find X9 & X9 Pro

Oppo has scheduled the China launch of the Find X9 and Find X9 Pro for October 16, and a global launch event is set to follow on October 28. Both devices will use the Dimensity 9500 chip, with ColorOS 16 based on Android 16 running out of the box.

According to leaks and rumors, the Find X9 Pro features a 6.78-inch flat LTPO OLED display with 1.5K resolution and 120Hz refresh rate. The screen supports up to 3,600 nits of peak brightness and uses Tianma’s latest 1-nit bright eye-protection panel. Oppo has confirmed an ultrasonic fingerprint sensor under the display.

The Pro model uses a 50MP Sony LYT-828 main sensor, a 50MP Samsung JN5 ultra-wide, and a 200MP Samsung HP5 periscope telephoto camera. The module also includes a 2MP multispectral sensor.

Oppo has designed the camera layout with a rounded-square design and included Hasselblad branding. The phone supports an external Hasselblad teleconverter for added zoom capabilities. For selfies, a 32MP lens is present on the Find X9, while the Pro version upgrades to a 50MP front-facing unit.

The Find X9 Pro includes a 7,500mAh battery with 80W wired charging and 50W wireless charging. The Find X9 uses a slightly smaller 7,025mAh battery and retains the same charging speeds.

The Find X9 and X9 Pro have received certification in multiple markets, including Thailand, India, Singapore, and Malaysia, confirming their international rollout plans. Oppo has also revealed that ColorOS 16 will be released on October 15, just ahead of the Find X9 launch.

Why Dimensity 9500 Matters

The Dimensity 9500 uses an eight-core architecture with a 4.21GHz Ultra Core, three 3.5GHz Super Cores, and four 2.7GHz Performance Cores. MediaTek claims a 32 percent increase in single-core performance and a 17 percent boost in multi-core performance over its predecessor. The chip also uses 55 percent less power at peak load.

MediaTek has added support for 4-channel UFS 4.1 storage and LPDDR5X RAM at 9600Mbps, enabling faster data transfers and smoother multitasking. The new NPU 990 improves large model processing and allows 100 percent faster AI image generation at 4K resolution while consuming 33 percent less power.

The G1-Ultra GPU delivers a 33 percent jump in graphics performance and improves power efficiency by 42 percent. Features like MegaLights in Unreal Engine 5.6 and support for Nanite rendering position the chip as a serious option for mobile gaming.

The Imagiq 1190 ISP allows for 320MP image capture, Dolby Vision 4K recording at 120fps with stabilization, and adaptive display enhancements via MiraVision.

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The post Upcoming Smartphones with Dimensity 9500: Vivo X300, X300 Pro, Oppo Find X9 & X9 Pro appeared first on Gizmochina.

For years, Qualcomm Snapdragon chips have been the go-to choice for top performance and efficiency on Android devices over MediaTek. However, recent MediaTek Dimensity chips have been closing in on the gap, and as a result, the competition between the two chipmakers is now fiercer than ever before.

In September, both chipmakers announced their most powerful mobile chipsets, Snapdragon 8 Elite Gen 5 and Dimensity 9500, promising significant improvements to performance and power efficiency. But how do they stack up against each other? Let’s look at benchmark figures and key differences to find out the answer.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500: Benchmark Score

Note: The benchmark scores were obtained from the listings of the Honor Magic 8 (powered by Snapdragon 8 Elite Gen 5) and Vivo X300/Pro (powered by Dimensity 9500) spotted on benchmark websites.

Geekbench Score

The Snapdragon 8 Elite Gen 5 posts 3,364 points in single-core, which is about 15% higher than Dimensity 9500. The multi-core performance also tells the same story, getting about 12% higher score than the Dimensity chip.

The Snapdragon chip, featuring a robust Oryon CPU, dominates Geekbench with higher single-core and multi-core scores. In other words, the 8 Elite Gen 5 should offer better performance than the Dimensity 9500 in tasks that require a single core, as well as in multi-core tasks such as multitasking, running heavy apps, and managing background apps.

AnTuTu Score

Both Snapdragon 8 Elite Gen 5 and Dimensity 9500 have managed to cross the 4 million mark on AnTuTu, becoming the first mobile chipsets to achieve this feat. The Snapdragon chip comes at the top, posting a total score of 4,166,339 (vs. 4,011,932). The difference here is just 4%, but it gets wider as you look at the breakdown.

The Snapdragon 8 Elite Gen 5 achieves a 16% higher CPU score (1,213,845 vs. 1,043,247). The GPU score, however, favors the Dimensity 9500 (1,510,982 vs. 1,468,351), but the difference is small — just 3%. It also gets a higher memory score, but the Snapdragon chip bounces back with a higher UX score.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500: Specs and Key Differences

Both flagship chipsets utilize TSMC’s 3nm (N3P), shifting from the N3E process used in their predecessors, for improved power efficiency and performance density. The key difference lies in the CPU architecture, where Qualcomm maintains its proven “2+6” core configuration, featuring two prime cores at 4.6GHz and six performance cores at 3.62GHz. MediaTek, on the other hand, continues with its “All Big Core” design, featuring one C1-Ultra core at 4.21 GHz, three C1-Premium cores at 3.5 GHz, and four C1-Pro cores at 2.7 GHz.

The GPU also gets notable upgrades on both chips. The Snapdragon 8 Elite Gen 5 introduces a new Adreno 840 GPU clocked at up to 1.2 GHz, paired with Qualcomm’s gaming technologies, which offer exceptional gaming performance. The Dimensity 9500 chip features an Arm Mali-G1 Ultra GPU, which delivers significant improvements in ray-tracing capabilities and power efficiency.

Coming to the NPU, the improved Hexagon NPU inside the 8 Elite Gen 5 is 37% faster and 16% more power-efficient than its predecessor. It supports advanced “agentic AI” capabilities. The Dimensity 9500 has a MediaTek NPU 990, which is 2x faster and offers a 56% reduction in peak power consumption compared to its predecessor.

Both chipsets offer excellent connectivity features, albeit with some differences. The Snapdragon 8 Elite Gen 5 supports a maximum speed of 12.5 Gbps over a 5G connection, while the Dimensity 9500 can go up to 7.4 Gbps. However, it’s a different story with Wi-Fi speed, as the Snapdragon chip peaks at 5.8 Gbps, but the Dimensity 9500 can reach 7.3 Gbps.

The camera has also received notable upgrades, including a 20-bit triple ISP (upgraded from 18-bit) for the Snapdragon 8 Elite Gen 5, which offers nearly four times the dynamic range. Additionally, it supports Advanced Professional Video (APV), making it the first mobile chipset to offer near-lossless video recording quality. The Dimensity 9500 features the Imagiq 1190 ISP, which includes an NPU-assisted focusing tracking engine and powerful AI denoise technology.

Also Read:
1. Snapdragon 8 Elite Gen 5 tops Apple A19 Pro and Dimensity 9500 in early benchmarks
2. Snapdragon 8 Elite Gen 5 vs Snapdragon 8 Elite: here are all the major upgrades
3. Upcoming smartphones powered by the Snapdragon 8 Elite Gen 5

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The post Snapdragon 8 Elite Gen 5 vs Dimensity 9500: Flagship Showdown appeared first on Gizmochina.

After months of leaks and rumors, the Snapdragon 8 Elite Gen 5 is finally here, and it’s clearly a big leap over last year’s Snapdragon 8 Elite. More importantly, it outperforms its biggest rivals, the Apple A19 Pro and Dimensity 9500, in early benchmark figures.

Built on a 3nm process, the Snapdragon 8 Elite Gen 5 is touted as the “world’s fastest mobile system-on-a-chip” by Qualcomm, and the benchmark numbers mostly tell the same thing. For the benchmark comparison, we’re using the first-party benchmark numbers as shared by Notebookcheck.

Note that the benchmark figures have been obtained from a reference device, which has a high-end setup like a massive 24GB of LPDDR5X RAM, 1TB UFS4.1 storage, and a large 6.8-inch 3,200×1,440 AMOLED LTPO display. Retail handsets might not perform as well as they prioritize battery life, optimal temperature, and other features over raw performance.

Snapdragon 8 Elite Gen 5 benchmarks

Geekbench Score

Geekbench 6 (single core)

On Geekbench 6, the Snapdragon 8 Elite Gen 5 gets about 20% higher single-core score over last year’s Snapdragon 8 Elite. It also beats the Dimensity 9500 by a 10% margin, but there’s a close matchup with Apple’s powerful A19 Pro. The 8 Elite Gen 5 is slightly behind Apple’s A19 Pro, although the gap is now very thin. The Tensor G5, with a single-core score of 2,316, isn’t a trouble to other chips on the list.

So, in terms of single-core performance on Geekbench, the Snapdragon 8 Elite Gen 5 easily outperforms most of its rivals, except for the Apple A19 Pro, which is as good as Qualcomm’s. However, the multi-core CPU performance is a whole different story.  

Geekbench 6 (multi core)

The Snapdragon 8 Elite Gen 5 achieves over 12,000 points in multi-core performance on Geekbench, leaving all other smartphone chips in the dust. This means more than 20% boost for the latest Snapdragon flagship compared to the A19 Pro and Dimensity 9500 when it comes to tasks that utilize multiple cores. The Tensor G5 disappoints again, scoring just 6,452, almost half of the Snapdragon 8 Elite Gen 5.

AnTuTu score

The reference device, powered by the Snapdragon 8 Elite Gen 5, scores over 4.3 million points on the AnTuTu benchmark. Other than this, only the Dimension 9500 could reach the 4 million territory, with a total score of 4,011,932.

The Apple A19 Pro barely gets past last year’s Snapdragon 8 Elite, while the Tensor G5 struggles at 1.4 million.

Please note that AnTuTu uses different test methods for Android and iOS platforms. This is one of the major reasons you’re seeing a huge difference in the scores here.

3DMark Wild Life Extreme Score

The Snapdragon 8 Elite Gen 5 also shines in the 3DMark test, thanks to architectural upgrades and software enhancements. In the Wild Life Extreme test, it scores 8,329 points, while the A19 Pro can’t get past the 6,000 mark. The Snapdragon 8 Elite, surprisingly, performs better than Apple’s fastest chipset, while the Tensor G5 continues to struggle by a significant margin.

For the Dimensity 9500, we obtained the 3DMark benchmark numbers from the test conducted by Xiaobai’s Tech Reviews. Since no device with this chip has been released yet, the test was likely carried out on a reference device. For the Vivo X300 Pro, we used the leaked benchmark figures from Geekbench, while the AnTuTu score was recently revealed by the company itself.

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MediaTek has just announced the Dimensity 9500, and it brings serious upgrades over its predecessors. The latest chip features MediaTek’s third-generation All Big Core design and ARM’s latest C1 series CPU cores, offering a significant boost to performance and efficiency. The new G1-Ultra GPU also offers a much better gaming experience while drawing substaintially less power.

The chipmaker promises huge upgrades for the Dimensity 9500, but we’re more interested in what the benchmarks have to say. While we are yet to test the chip, company officials have already published its raw performance data from AnTuTu and Geekbench. We’ll also look at the spec sheet and the biggest upgrades to the chip later in this post.

MediaTek Dimensity 9500 Geekbench Score

During the launch event, MediaTek revealed that the Dimensity 9500 scores 4,007 points in single-core and 11,217 points in multi-core on the Geekbench v6.4 platform. That’s a 32% increase in single-core score and 17% in multi-core score over last year’s Dimensity 9400.

Please note that these are official figures from MediaTek, and it’s likely that the chip is tested under optimal conditions. Anyway, we’ll update the score once we do the testing.

Apple’s A19 Pro (4,019/11,054) recently became the first smartphone chip to surpass the 4000 mark in single-core performance, now joined by the Dimensity 9500. The latter also matches Apple’s latest silicon in multi–core performance. Qualcomm’s Snapdragon 8 Elite Gen 5 is also expected to put on a tough show against these two chips.

MediaTek Dimensity 9500 AnTuTu Score

MediaTek didn’t share the AnTuTu score for the Dimensity 9500 at the event, but a Vivo executive, Han Boxiao, recently shared the AnTuTu (v11) score for Vivo X300 Pro, which runs the same chipset. The latest Dimensity chipset surpassed the 4 million AnTuTu mark, becoming the first smartphone chip to achieve this feat.

Here’s a breakdown of the AnTuTu score:

That’s an impressive 40% jump in the overall AnTuTu score from last year’s Vivo X200 Pro, powered by the Dimensity 9400, scoring 2.88 million AnTuTu points.

MediaTek Dimensity 9500 Spec Sheet

The Dimensity 9500 is fabbed using TSMC’s 3nm (N3P) process, which offers slightly better performance and efficiency than the N3E process used for Dimensity 9400. It features ARM’s latest C1 architecture, enabling the chip to deliver up to 32% faster single-core performance. The Ultra core achieves 55% lower power consumption at peak performance, while the overall chip is 30% more power efficient.

There’s a new 12-core Mali-G1 Ultra GPU with significant upgrades. MediaTek says the new GPU offers a 33% performance uplift and 42% better power efficiency at peak performance, and supports 120fps raytracked gaming and 119% ray tracing improvements.

The chip also gets better at AI capabilities, thanks to ninth generation MediaTek NPU 990 with 2nd gen Gen-AI Engine. It enables 2x faster token generation speed, 4K text-to-image generation, and offers up to 56% reduced power consumption at peak AI performance.

The Dimensity 9500 features a new MediaTek Imagiq 1190 ISP with support for 200MP capture with 30fps continuous focus tracking and 4K 60fps portrait video recording with advanced RAW-domain pre-processing. The connectivity portion has also undergone several upgrades, including a 10% power savings with AI traffic prediction, a 50% reduction in latency with AI congestion prediction, a 20% power saving on Wi-Fi, and a 20% improvement in location accuracy. There’s also some boost to the connection speed.

Overall, the Dimensity 9500 looks promising. It has got a faster and efficient CPU, a more powerful GPU with excellent ray tracing capabilities, enhanced AI capabilities, and more robust connectivity features. However, it remains to be seen how this MediaTek’s flagship fares against the Snapdragon 8 Elite Gen 5.

We’ll soon post a comparison between the Dimensity 9500 and Snapdragon 8 Elite Gen 5. Be sure to follow us on Telegram so you stay up-to-date with the latest happenings in tech.

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MediaTek has officially unveiled its latest flagship mobile chipset, the Dimensity 9500. Designed to power the next wave of premium smartphones, the new SoC brings a major leap in AI processing, gaming graphics, and overall efficiency. It is based on a refined 3nm process that brings console-level ray tracing tech, a faster NPU, and upgrades to CPU performance. So here’s everything new and improved.

MediaTek Dimensity 9500: Faster CPU

The chipmaker unveiled the Dimensity 9500 earlier today (22nd September 2025) with eight cores that consists of a 4.21GHz C1 ultra core, three super core C1 cores clocked at 3.5GHz, and four 2.7GHz big core C1 pro. MediaTek claims up to 32 percent bump in single core performance and 17 percent jump in multi core performance over its predecessor. Even at peak performance with the ultra core, the Dimensity 9500 claims to offer up to 55 percent lesser power consumption.

So you get improved performance without sacrificing power efficiency. Overall, the brand stated that the Dimensity 9500 is 30 percent more power efficient during multitasking, gaming, and calls made via social media apps. This is paired with new cache and memory architecture, bringing the industry’s first 4 channel UFS 4.1 support that helps improve performance with large AI models by 40 percent.

Improved AI Processing

Similar to the new Google Tensor G5 on the Pixel 10 series, MediaTek also focused on improving the AI performance on its latest flagship chip with an upgraded NPU. The latest MediaTek NPU 990 arrives with Generative AI Engine 2.0 that doubles compute power for faster large model processing while also offering up to 33 percent reduction in power consumption.

Thanks to this, users get access to 100 percent faster LLM output for 4K image generation, which is another industry first. The super efficient NPU is also 56 percent more power efficient than its predecessor when performing this task.

Console-level Gaming Tech

MediaTek’s latest flagship chip arrives with upgrades to its graphical prowess, with the new ARM G1-Ultra GPU. It promises to offer up to 33 percent higher performance, along with 42 percent improvement on power efficiency. You also get up to 120fps frame rate interpolation with ray tracing enabled. The company worked with leading studios to bring support for MegaLights in Unreal Engine 5.6 and Nanite in Unreal Engine 5.5 to offer AAA console-like real time rendering and ray tracing lighting effects.

New & Improved ISP

The Dimensity 9500 features MediaTek’s new Imagiq 1190 ISP that supports RAW domain, up to 320MP camera, 30fps continuous focus tracking, an upgraded portrait engine, and supports cinematic 4K 60fps portrait videos. It is also the first on Android to bring Dolby Vision recording at 4K 120fps with EIS (Electronic Image Stabilization).

Another major addition is MiraVision’s Adaptive Display technology that can intelligently adjust contrast and color saturation based on ambient lighting via real time analysis. This should allow for improved color reproduction and better shots in low light scenarios.

Other Notable Features

MediaTek’s latest and greatest brings support for WiFi 7, Bluetooth 6.0, Dual SIM Dual Active 5G/4G support, and various satellite based positioning technologies like GLONASS, GPS, NavIC, and others. The Dimensity 9500 supports LPDDR5X 10667 9600Mbps RAM and memory up to 10.7Gbps, along with UFS 4.0 for storage.

This chip will make its global debut on the upcoming Vivo X300 series that will be unveiled in China on 13th October 2025. Vivo’s new premium phones are among the first wave of next gen flagship devices.

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MediaTek has officially confirmed the date for its upcoming flagship chip reveal. The company’s Weibo post announced a launch event scheduled for September 22 at 14:00pm (local time). The upcoming Dimensity 9500 is set to power premium smartphones from Vivo and Oppo, and later on from other brands.

Dimensity 9500 specifications and performance

As per reports, the Dimensity 9500 will adopt a 1+3+4 CPU configuration made up of one Travis core clocked at 4.21GHz, three Alto cores at 3.50GHz, and four Gelas cores at 2.7GHz. Both Travis and Alto belong to Arm’s new X9 line, while Gelas are part of the updated A7 series.

The chip will also feature a Mali-G1 Ultra MC12 GPU built on a new architecture, promising over 40 percent efficiency gains and more than 40 percent improvement in ray tracing capabilities. Early figures suggest that ray-traced gaming could exceed 100 frames per second, signalling a significant upgrade for mobile gaming.

The platform includes 16MB of L3 cache, 10MB SLC, SME instruction set support, and NPU 9.0 with an expected 100 TOPS of AI performance. Memory support extends to LPDDR5x at 10667Mbps along with UFS 4.1 storage for faster data handling.

Vivo’s X300 series will be the first to introduce the Dimensity 9500 to the market. Last week, Vivo’s product manager revealed benchmark results for the X300 Pro satellite communication variant, which crossed the 4 million mark on AnTuTu, making it the first Android device to achieve this milestone. However, the Oppo Find X9 Pro satellite communication version’s AnTuTu score, which was confirmed today, has even surpassed that of the X300 Pro satellite version.

Rumours are rife that the Vivo X300 series will debut on Oct. 13, whereas the Oppo Find X9 lineup may break cover on Oct. 21 in China.

MediaTek Dimensity 9600 could be a 2nm chip

Interestingly, MediaTek also disclosed progress on its 2nm flagship SoC, expected to enter mass production by the second half of 2026, likely as the Dimensity 9600.

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New flagship phones are expected to launch soon, starting with Apple introducing the iPhone 17 series on Sept. 9, followed by the Xiaomi 16 series towards the end of the month. A slew of new flagship phones from brands such as Vivo, Oppo, Honor, iQOO, Realme, OnePlus, and Redmi are also anticipated in October. Alongside the flagship war, this period will also mark the battle of new chipsets that will power these phones.

Chipset war to begin soon

According to reliable tipster Digital Chat Station, the smartphone industry is heading into a major “chip war” before the big wave of flagship phone launches. Apple is leading with the A19 and A19 Pro, followed by MediaTek with the Dimensity 9500, and then vwith two Snapdragon 8 series platforms, the SM8850 and SM8845. These Qualcomm chips are likely to hit the market with respective names such as the Snapdragon 8 Elite Gen 5 (aka. Snapdragon 8 Elite 2) and Snapdragon 8 Gen 5.

All of these are based on TSMC’s N3P process and are positioned as powerful “performance beasts.” The tipster also mentions that Apple and Qualcomm have already shifted to a dual-chip strategy. With chipset makers expected to adopt the 2nm process next year, which will bring higher costs, it remains to be seen whether MediaTek will also follow a dual-chip strategy.

As per reports, the cost of TSMC’s 2nm wafers is estimated at around $30,000 per wafer, higher than the price of 3nm wafers. This surge in cost is expected to affect the pricing of Android flagship phones in 2026.

Snapdragon 8 Gen 5 to power next-generation foldable phones

DCS said that the Snapdragon 8 Gen 5 is currently being tested by manufacturers such as Honor, Oppo, and Vivo, and he plans to share his own hands-on results soon. He added that some brands are considering using the Snapdragon 8 Gen 5 for foldable phones.

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MediaTek’s next flagship processor, the Dimensity 9500, is expected to launch later this month, and a new leak has laid out most of its key specifications. The information comes from tipster Digital Chat Station, who has a track record of detailing smartphone hardware ahead of release.

At the heart of the Dimensity 9500 is a CPU built on TSMC’s advanced N3P process. The setup follows an all-large-core layout that MediaTek has been using for the past few generations.  The configuration includes one Cortex-X930 core running at 4.21GHz, three Cortex-X930 cores at 3.5GHz, and four Cortex-A730 cores at 2.7GHz. 

On the graphics side, the processor integrates a Mali-G1 Ultra MC12 GPU, running at around 1MHz. The leak notes that the GPU has a new microarchitecture that improves ray tracing performance while reducing power draw.

Beyond cores and graphics, the Dimensity 9500 has a 16MB L3 cache, 10MB system-level cache, and support for the SME instruction set, plus a next-gen NPU 9.0 said to hit 100 TOPS (trillion operations per second). For memory and storage, the chip supports LPDDR5X RAM at 10667Mbps and UFS 4.1 storage over a 4-lane setup.

Digital Chat Station also pointed out that the imaging stack may include a version of Vivo’s V3+ ISP, though this will likely be exclusive to Vivo devices.

MediaTek Dimensity 9500 known specs

According to earlier leaks, the Dimensity 9500 will debut on September 22nd, slightly ahead of Qualcomm’s next-gen Snapdragon. The processor is expected to launch first in the vivo X300 series, with Oppo’s Find X9 lineup following in October.

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(Source)

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A new leak suggests that MediaTek’s upcoming flagship chip, the Dimensity 9500, could be one of the first processors to break past 400,000 points on the upcoming AnTuTu v11 benchmark. 

The info comes from reliable tipster Digital Chat Station, who claims that test platforms running the new chip are already showing promising results.

The score isn’t final yet. In fact, AnTuTu v11 itself hasn’t even launched. However, the leak suggests that storage will play a big role in pushing numbers higher. 

Better storage, more speed on AnTuTu 

According to the tipster, both “blue” and “green” platforms (likely Vivo and Oppo) are experimenting with 1TB 4-lane UFS 4.1 storage and it could add anywhere from 80,000 to 100,000 points on top of the raw CPU and GPU performance. That means a properly equipped Dimensity 9500 device could easily widen the gap over older flagships.

On the technical side, the Dimensity 9500 will stick to ARM’s reference designs rather than going custom. It reportedly features four Cortex-X930 cores (with three clocked slightly lower) and four Cortex-A730 cores, paired with a 12-core Mali-G1 Ultra GPU. 

It’s fastest core may reach 4.00GHz mark. That’s still behind Qualcomm’s upcoming Snapdragon 8 Elite 2, which is rumored to hit 4.74GHz with its custom Oryon cores.

As for Geekbench 6, the Dimensity 9500 scored over 3,900 in single-core and more than 11,000 in multi-core tests. The chip is built on TSMC’s 3nm process and includes support for ARM’s Scalable Matrix Extension (SME), which should improve AI and machine learning tasks.

MediaTek is expected to unveil the Dimensity 9500 on September 22, just a day before Qualcomm’s Snapdragon 8 Elite 2. Several phone manufacturers are expected to announce their respective devices powered by the chip soon after.

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The upcoming Android flagship chips are expected to launch in September. Qualcomm has already confirmed the launch of the Snapdragon 8 Elite 2 during the Snapdragon Summit on September 23.

Now, tipster Digital Chat Station says the new Dimensity 9500 will be announced on September 22, just one day before Qualcomm’s Snapdragon event.

We’ve already seen some early benchmark numbers for Qualcomm’s chip in a phone that appears to be the Galaxy S26 Edge. The results weren’t final, but they gave us a rough idea of its power.

Both new chips are expected to use TSMC’s latest 3nm process, which should make them faster and more power-efficient. However, their designs are different.

MediaTek will use ARM’s standard CPU and GPU designs for Dimensity 9500. It is expected to feature a combo of four Cortex-X930 (three clocked slightly lower) and four Cortex-A730. Qualcomm, on the other hand, is working on custom Oryon cores for 8 Elite 2.

Moreover, the Dimensity 9500’s fastest cores could run at 4.00GHz, faster than last year’s Dimensity 9400, but still slower than Qualcomm’s rumored 4.74GHz for the 8 Elite 2. The chip will likely keep the same 12-core Mali-G1 Ultra GPU as before.

With this setup, MediaTek’s solution reportedly scores over 3,900 in single-core and exceeds 11,000 in multi-core tests on Geekbench 6. 

Another notable upgrade could be support for ARM’s Scalable Matrix Extension (SME), which could make the Dimensity 9500 much better at heavy computing tasks and boost multi-core performance by a notable margin. 

September will not be just about the chips, though. Once they’re official, we are pretty sure that Android manufacturers will start teasing their new flagship phones with these chips. In fact, the Xiaomi 16 series, powered by the Snapdragon 8 Elite 2, is expected to launch later that month.

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(Source)

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MediaTek is reportedly working on the Dimensity 9500 chipset, which will power the next-generation flagship phones arriving later this year. A new leak has shed light on MediaTek’s upcoming Dimensity 9500 chipset. As per a new leak, the next-generation flagship chip could deliver notable performance and efficiency upgrades, with a particular focus on gaming enhancements.

Dimensity 9500: Significant GPU and ray tracing improvements expected

According to reliable tipster Ice Universe, the forthcoming Dimensity 9500 will bring a significant leap in GPU performance, with efficiency improving by more than 40 percent compared to its predecessor. Peak performance is also expected to be notably stronger, while ray tracing capabilities could see a similar 40 percent boost.

Most strikingly, the leak suggests that smartphones powered by this chip may finally push ray-traced graphics beyond 100 frames per second, delivering a much smoother and more immersive gaming experience. According to the tipster, MediaTek appears to have fully unlocked the potential of Arm’s latest Drage GPU architecture, making the Dimensity 9500 a highly anticipated upgrade for mobile gaming.

As per reports, the Dimensity 9500 will be equipped with the all-big-core CPU configuration, including one Cortex-X930 ultra core, three Cortex-X9 series cores, and four A7 series cores, supported by 16MB of L3 cache and 10MB of system-level cache.

Built on TSMC’s third-generation 3nm N3P process, the chip could also introduce updated AI processing, with GPU compute performance reportedly reaching 100 TOPS for enhanced AI-driven tasks. Geekbench 6 scores may exceed 3,900 in single-core and 11,000 in multi-core performance, indicating gains of up to 34.5 percent and 19.6 percent, respectively, over the Dimensity 9400.

The Dimensity 9500 is expected to debut in September. Speculations are rife that the Vivo X300 series will be the first to feature it followed by the Oppo Find X9 lineup.

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As expected, the last quarter of the year is anticipated to see the arrival of multiple flagship and sub-flagship phones in the Chinese market. In a new leak, tipster Digital Chat Station has mentioned the launch timeframes of the expected smartphones. Here’s a look at all the details shared by the tipster.

Xiaomi 16 series, Vivo X300 series – September-end launch

According to tipster Digital Chat Station, only one brand is tentatively set to launch a new SM8850 (Snapdragon 8 Elite 2) powered device by the end of September. Based on recent reports, the tipster could be talking about the Xiaomi 16 series.

He added that another brand is working hard to get its D9500 (Dimensity 9500) powered phone ready for a late September debut, but if it can’t make it, the launch will be pushed to after the National Day holidays in early October. The national holidays will last between Oct. 1 to Oct. 8 this year. The tipster could be referring to the Vivo X300 series of smartphones. If it does not debut by the end of September, it may break cover within the first half of October in China.

October launches

DCS added that October is shaping up to be a fierce battleground for SM8850 and D9500 flagship launches, with both main and sub-brands planning to release new flagships at a rapid pace. Therefore, October is likely to see the arrival of multiple smartphones, such as the Oppo Find X9 lineup, Honor Magic 8 series, iQOO 15 series, OnePlus 15, and Realme GT 8 Pro.

November–December launches

Then, moving into November and December, we can expect the rollout of final flagship devices for the year as well as mid-range phones, featuring chips like the SM8845 and D8500. The SM8845’s final moniker is not known, but there’s a possibility that it could be called the Snapdragon 8 Plus / Turbo and is expected to bridge the gap between Snapdragon 8 Elite and Snapdragon 8s Gen 4.

Recent reports have revealed that the Redmi K90 Pro and Honor GT 2 series are expected to feature the Snapdragon 8845 chip. Based on recent reports, it can be said that the Chinese market will see the arrival of the Oppo Reno 15 series, Vivo X31 (or S30) series, iQOO Neo 11 (or Neo 20) lineup, Realme Neo 8 series, OnePlus Ace 6 lineup, and Redmi Turbo 5.

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According to a recent leak from tipster Digital Chat Station, the second half of 2025 will see new flagship chips from all major players in the mobile silicon market. This not only includes Apple, Qualcomm, and MediaTek, but also Huawei. 

DCS claims that Apple’s A19 Pro chip will debut in September, continuing the company’s yearly cadence. Qualcomm is expected to follow shortly after with its next flagship SoC, Snapdragon 8 Elite 2, internally known as SM8850.

Both Apple and Qualcomm are said to be utilizing TSMC’s N3P node, a refinement of the foundry’s current 3nm process. The tipster says these upcoming chips will hit a new high in frequency (i.e., clock speed) and will have improved energy efficiency over the previous generation.

Huawei Kirin 9030 is a surprise

MediaTek’s high-end chip, possibly named Dimensity 9500, will also launch by September end. Meanwhile, Huawei’s Kirin 9030 is reportedly scheduled for release toward the end of the year. 

We’re sure to learn more about the Dimensity 9500 or any chip, for that matter, in detail when it launches. But Huawei, as in the past, might keep the specifics of the Kirin 9030 under wraps. If timelines hold, all four flagship processors will enter the market between late 2025 and early 2026.

Elsewhere in the comments section of the leak, discussion emerged about Xiaomi’s in-house XRING processor. DCS says Xiaomi CEO Lei Jun did not expect the first-generation XRING O1 to perform so well, so there were no plans for its successor. However, DCS claims the XRING O2 will be even “more popular.”

Separately, a report from IT Home this morning suggests that Apple is preparing to launch M5 chips this fall in new versions of the iPad Pro and MacBook Pro. The update is likely to be limited to the processor itself, with little else changing in the hardware design or features.

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(Source)

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ARM’s next big CPU upgrade is now a little more official, at least by leak standards. A new leak by industry tipster Digital Chat Station claims that ARM will introduce a new high-performance CPU core, codenamed Travis, this September. And reportedly, the main talking point of this core will be IPC or instructions per cycle.

IPC essentially measures how much work a processor can do at a given clock speed. DCS claims that the Travis core brings double-digit IPC gains compared to its predecessor. That’s a meaningful jump, especially as chipmakers are increasingly looking to efficiency and smart workload distribution rather than pushing clock speeds endlessly higher.

ARM’s Travis core will support SME and IPC

The core also supports the Scalable Matrix Extension (SME) feature that will improve performance in AI and ML-related tasks. SME is part of ARM’s broader strategy to modernize compute architecture for increasingly heterogeneous workloads across mobile and edge devices.

What adds weight to the leak is that DCS shared images from what appears to be an official ARM press conference confirming these features directly. 

While ARM is responsible for the core design, MediaTek appears to be first in line to ship it in a commercial product. The Dimensity 9500 is expected to be MediaTek’s answer to whatever Qualcomm is preparing with the Snapdragon 8 Elite 2. 

DCS suggests the new MediaTek chip is already showing signs of strong performance, and it will likely benefit not just from the CPU upgrades, but also from a new GPU design reportedly ARM’s Mali-G1 Ultra, codenamed Drage.

ARM hasn’t made any public announcements yet, but if these leaks hold, the Travis core could become one of the more important under-the-hood changes in next-gen Android flagships.

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Smartphones powered by Qualcomm’s Snapdragon 8 Elite 2 and MediaTek’s Dimensity 9500 might come with higher price tags this year.

According to a leak from tipster Digital Chat Station, these new flagship chips will offer AI computing power that is double that of their predecessors. As a result, the tipster claims that phone manufacturers are considering offering 24GB of RAM and 1TB of storage to meet the increased demands for AI.

Next Android flagships will have 24GB of RAM

Just a year ago, most brands pulled back from launching 24GB models due to rising memory costs. The short-lived push for oversized memory in smartphones lost momentum as prices climbed and mainstream demand remained limited. That left the market settling around 12GB and 16GB of RAM as the typical maximum.

But the AI hardware race might shift priorities. The Snapdragon 8 Elite 2 reportedly delivers up to 100 TOPS (trillion operations per second) of AI performance, and we expect something similar from the Dimensity 9500 as well. 

As a result, DCS claims that the top five smartphone brands are now preparing to reintroduce premium-tier models with 24GB + 1TB configurations. However, with increased memory, smartphone prices might also see a rise. While the tipster doesn’t explicitly mention pricing, a jump in memory specs will almost certainly lead to higher smartphone prices.

In related news, leaked Geekbench 6 scores give us an early look at just how powerful these chips might be. The Snapdragon 8 Elite 2 reportedly hits over 4,000 points in single-core tests and surpasses 11,000 in multi-core performance. MediaTek’s Dimensity 9500 isn’t far behind, scoring over 3,900 in single-core and also breaking past 11,000 in multi-core benchmarks.

(Source)

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MediaTek’s upcoming flagship chipset, believed to be the Dimensity 9500, has made its first appearance on Geekbench under the model number MT6993. The benchmark listing, spotted by a trusted Chinese tech blogger, Digital Chat Station, has revealed the configuration of the new chipset.

Dimensity 9500: Major CPU upgrade confirmed through Geekbench

The Dimensity 9500’s Geekbench listing reveals that it has one ultra-core clocked at 3.23GHz (Travis), three performance cores at 3.03GHz (Alto), and four efficiency cores at 2.23GHz (Gelas). According to DCS, the D9500 will be the first chipset to introduce a full-core CPU layout based on the new X930 ultra-core architecture. For graphics, the chipset includes Mali-G1 Ultra MC12 GPU.

Travis and Alto are said to be based on Arm’s new Cortex-X9 architecture with SME support, while Gelas is said to come from the next-gen A7 core family. This marks a shift away from the Cortex-X4 used in the Dimensity 9400. The chip is built on TSMC’s N3P 3nm process, aiming for a balance of raw power and power efficiency.

The GPU section reveals a new Immortalis-Drage architecture with improved ray tracing and efficiency, though the current GPU clock is capped at 1MHz, limiting its early benchmark score to 15,717. MediaTek is expected to finalize GPU performance next month. Reports have claimed that the new chip is powerful enough to breach 4 million mark on AnTuTu benchmarks.

According to reports, the Dimensity 9500 also supports up to 4x LPDDR5x RAM at 10,667Mbps and UFS 4.1 storage with a 4-lane interface. It packs 16MB of L3 cache and 10MB of system-level cache for improved multitasking and data throughput.

Dimensity 9500 is expected to be officially announced in September, with the Vivo X300 series and Oppo Find X9 series likely among the first smartphones to ship with the new chip.

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Qualcomm and MediaTek are expected to unveil their flagship chipsets for next-generation flagship phones in September this year. While the US-based chip manufacturer is expected to announce the Snapdragon 8 Elite 2 through its 2025 Snapdragon Summit, which will be held between Sept. 23 to 26, MediaTek is said to announce the Dimensity 9500 earlier than Qualcomm’s event. Yesterday, reliable tipster Digital Chat Station revealed the Geekbench scores of the Snapdragon 8 Elite 2; today, he is back with the benchmark scores of the D9500.

Dimensity 9500 Geekbench scores revealed

According to DCS, the Dimensity 9500 scores over 3,900 in single-core and exceeds 11,000 in multi-core tests on Geekbench 6. This is a significant leap from the Dimensity 9400’s 2,900+ and 9,200+ scores, respectively. The chip also features the new Immortalis-Drage GPU, which brings architectural changes for better ray tracing performance with reduced power draw. A previous report revealed that the D9500 is capable of achieving over 4 million score on AnTuTu benchmarks.

Recent reports have revealed that the Dimensity 9500 will be designed on TSMC’s N3P process, the third-generation 3nm node, offering enhanced power efficiency and improved performance. The CPU features a newly designed all-big-core layout with an 8-core structure: 1 Travis core, 3 Alto cores, and 4 Gelas cores. Both Travis and Alto are based on Arm’s new Cortex-X9 line, while Gelas cores come from the new Arm A7 series. This marks a clear departure from the Cortex-X4 cores used in the Dimensity 9400.

The Dimensity 9500 is also said to come with 16MB of L3 cache and 10MB of system-level cache to improve data throughput. It will support 4-channel LPDDR5x RAM at 10,667Mbps and UFS 4.1 storage via a 4-lane interface, making it suitable for demanding workloads like 8K video and multitasking.

Speculations are rife that the Vivo X300 series debuting in September will be the first to feature the Dimensity 9500. The Find X9 series launching in the same month will also pack the same chip.

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MediaTek appears to be racing ahead of Qualcomm this year as well for the next gen flagship processors. The upcoming Dimensity 9500 SoC could launch before the anticipated Snapdragon 8 Elite 2. The new chipset likely offers improvements in performance, AI processing, and much more. So here’s what we know.

Next-Gen Dimensity 9500 May Arrive Before Snapdragon 8 Elite 2

Last year, both the MediaTek Dimensity 9400 and Qualcomm Snapdragon 8 Elite debuted in the market in the month of October. But the Dimensity processor arrived a couple of days ahead of the Snapdragon competitor. A fresh leak now hints that the new Dimensity 9500 will continue to hold this announcement lead. Qualcomm has already confirmed the 23rd September 2025 event date for the Snapdragon Summit. During this conference, the Snapdragon 8 Elite 2 is expected to make its global debut.

While an official launch date for the Dimensity 9500 is still unknown, known tipster, Digital Chat Station, claims that it will arrive before the Snapdragon processor. So, it might drop earlier in September 2025. With these chips being unveiled, the next round of flagship Android smartphones are expected to hit the market as well, bringing cutting edge specs and performance.

To recall, the Oppo Find X8 and Vivo X200 series featured the Dimensity 9400, so we can expect the Find X9 and X300 lineup to pack the Dimensity 9500. Similarly, the Galaxy S25 series, OnePlus 13, and others came with the Snapdragon 8 Elite, and should bring the newer Snapdragon 8 Elite 2 to their successors. Keep in mind that this is still just an unconfirmed report, so take this news with a pinch of salt for now.

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The upcoming Oppo Find X9 series could bring some serious upgrades in terms of hardware. Oppo’s next generation of flagships might be bringing insane camera upgrades along with a newer flagship MediaTek chip for faster performance. So here’s everything we know.

Oppo Find X9: A True Flagship Camera Phone?

The latest details were shared by known tipster Digital Chat Station on Weibo. The leak hints at the entire Find X9 series getting a massive upgrade in terms of camera. In particular, this improvement might be to the periscope telephoto shooter. Meanwhile, the top end Find X9 Ultra could push the boundary in smartphone photography. DCS also claimed that the Find X9 Ultra may pack a 200MP and 50MP periscope shooters on the back, along, which likely offers different optical magnification levels.

The tipster bases the information on a prototype Find X9 Ultra, which reportedly packs Samsung’s high end ISOCELL HP5 and JN5 as the telephoto lenses. So the Chinese brand would likely make some changes to the camera specifications. That’s not all, the Find X8 Ultra’s spectral image sensor might make its way to the other affordable Find X9 variants like the standard Find X9 and X9 Pro. This sensor helps capture more accurate colors, especially with skin tones, to bring more natural hues.

Digital Chat Station shared some of these details back in May as well. Apart from the camera specs, the Find X9 series is rumored to be powered by the Dimensity 9500 SoC, while the Ultra variant could pack the Snapdragon 8 Elite 2 processor. This is all the information we have at the moment, so stick around for more.

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Qualcomm is expected to unveil its next flagship chip, the Snapdragon 8 Elite 2, by September this year. This chipset will face competition from MediaTek’s Dimensity 9500, which may debut around the same time. Today, reliable tipster Digital Chat Station released a Weibo post to share the key specifications of the D9500 chip.

Dimensity 9500 specifications leaked

According to the tipster, the Dimensity 9500 will be built on TSMC’s advanced N3P process and will feature a completely new large-core CPU setup. The CPU configuration includes one Travis core, three Alto cores, and four Gelas cores. Travis and Alto are said to be based on ARM’s latest Cortex-X9 series, supporting SME instruction sets, while Gelas represents a new generation of A7 series large cores. This marks a shift from the previous Dimensity 9400, which relied on Cortex-X4 cores.

The chip also includes 16MB of L3 cache and 10MB of SLC cache. Memory support extends to quad-channel LPDDR5x RAM with speeds up to 10,667Mbps, alongside four-lane UFS 4.1 storage compatibility. The GPU, known as Immortalis-Drage, is designed with a new microarchitecture to significantly improve ray tracing capabilities while lowering power consumption. Additionally, the NPU 9.0 is expected to deliver AI processing power of up to 100TOPS.

While the Dimensity 9400 achieved commendable scores—around 2840000 points on AnTuTu benchmarks—the Dimensity 9500 is expected to take things much further. According to industry insiders, the new chip’s benchmark scores could exceed 4,000,000 mark on AnTuTu. Rumors are rife that the Vivo X300 series and the Oppo Find X9 lineup will be the first devices to feature the Dimensity 9500 chip.

The tipster also revealed the existence of a new Dimensity 8-series chip dubbed the Dimensity 8450. However, he did not share any information about its specifications.

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We are still months out from the official launch of Qualcomm’s Snapdragon 8 Elite 2 and MediaTek’s next-gen Dimensity 9500. But that hasn’t stopped the leaks from flowing and us from following them.

The latest scoop comes, once again, from China’s ever-reliable tipster Digital Chat Station. This time, it’s an AnTuTu benchmark score for MediaTek’s upcoming chip. 

According to the leak, the Dimensity 9500 has hit over 400,000 points in its most recent benchmark run. That puts it roughly 17% ahead of the best score we’ve seen so far from the Snapdragon 8 Elite.

Of course, we’re still a ways off from launch, so these numbers will likely change as final optimizations roll in.

DCS also reports that MediaTek will increase the L3 cache on the 9500 from 12MB to 16 MB. This should help reduce memory latency and speed up app switching. It’s a meaningful upgrade that could lead to smoother multitasking across the board.

Beyond this…

Oh, and in case you’re wondering about the silicon future beyond this chip, DCS says the next-gen processors from Apple, Qualcomm, and MediaTek will all be built on TSMC’s 2nm process. 

We are talking about the likely Apple A20, Snapdragon 8 Elite 3, and Dimensity 9600, to be clear. The upgrade in fabrication process naturally means gains in power efficiency and performance. 

However, it is also costly to make SoCs on the smaller node, and incidentally, DCS indicates that the flagship phones of 2026 may become more expensive.

As for the Dimensity 9500 itself, it’s still expected to be fabbed on TSMC’s 3nm N3E node. The chip will reportedly feature two Cortex-X930 “Travis” cores and six Cortex-A730 “Gelas” cores, with the prime cores reaching speeds up to 4GHz, a 10% boost over the Dimensity 9400.

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MediaTek has officially confirmed that the Dimensity 9400+ will launch on April 11. It’s a minor refresh of last year’s Dimensity 9400, but the real upgrade is coming with the Dimensity 9500. And if a new leak is accurate, we may already know what to expect from MediaTek’s next flagship chip.

A now-deleted post from tipster Digital Chat Station suggests that the Dimensity 9500 will be built on TSMC’s N3P process and feature an all-big-core ARM CPU design.

Dimensity 9500 Specifications

The core configuration reportedly includes one Travis core, three Alto cores, and four Gelas cores, while the GPU is said to be the Immortalis Drage.

According to the leak, Travis and Alto are part of ARM’s upcoming X9 generation and support Scalable Matrix Extension (SME) which should deliver improved multi-thread performance.

Meanwhile, Gelas is believed to be ARM’s next-gen A7 series core. Based on the leak, the Dimensity 9500 will have a 1+3+4 CPU setup with:

• 1x Cortex-X930
• 3x Cortex-X930 (lower clocked)
• 4x Cortex-A730

That’s a shift from a previous leak which suggested a 2+6 CPU structure for 9500 consisting of two Travis cores and six Gelas cores. It was “early specifications” for the chip though, so it looks like MediaTek’s plans have evolved since then.

The Dimensity 9500 is expected to launch in mid-2025 which will give it a head start over over Qualcomm’s next flagship chip. The Snapdragon 8 Elite 2 is rumored to debut in October 2024.

Interestingly, a leak from earlier today suggests that MediaTek is also working on a second all-big-core Dimensity chip. Allegedly called the Dimensity 9450, it will reportedly share the same 3nm process from TSMC. However, details about it are relatively scarce at the moment.

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MediaTek unveiled the Dimensity 9400 chip in October 2024. Speculations are rife that the Taiwanese chipmaker is now working on the Dimensity 9500, which may debut in the last quarter of this year. A recent Weibo post by reliable leaker Digital Chat Station has revealed early details about the D9500 chip.

Dimensity 9500 could be the most powerful Android SoC

The Weibo post by DCS reveals that the engineering samples of MediaTek’s next-generation chipset are ready. According to the leak, the chip features an eight-core design with a 1+3+4 architecture and has a target AnTuTu benchmark score of around 3.5 million points. While the tipster has not explicitly mentioned the chipset’s name, he appears to be referring to MediaTek’s next flagship processor—the Dimensity 9500.

Previously, the tipster claimed that the Dimensity 9500 would feature two Cortex-X930 “Travis” cores. However, he now states that it includes only one Travis core, which is expected to exceed 4GHz. In terms of single-core performance, the Dimensity 9500 could rival Apple’s M4 chip, thanks to factors like the inclusion of ARM’s Scalable Matrix Extension (SME) and TSMC’s enhanced 3nm ‘N3P’ process.

The tipster has previously claimed that while it is not officially confirmed, smartphones powered by the Dimensity 9500 and Qualcomm’s upcoming Snapdragon 8 Elite 2 are expected to debut in October. Some manufacturers may even push for an early release by late September, aiming to have their devices available before November 1st.

Major brands such as Vivo and Oppo are expected to be the first adopters of the Dimensity 9500, integrating the chipset into upcoming flagship series like the Vivo X300 and Oppo Find X8. Some reports have claimed that the Honor Magic 9 series will also feature the Dimensity 9500 chip.

In related news, MediaTek is gearing up to launch the Dimensity 9400 Plus chip next month. This chip, which clocks at 3.73GHz and is an overclocked version of the existing D9400 chip, will power multiple devices, such as the Oppo Find X8s, Find X8s+, Vivo X200S, Realme GT 7, iQOO Neo 10S, OnePlus Ace 5S, and Redmi K80 Ultra.

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Apple‘s dominance in single-core performance may be coming to an end, if rumors about the upcoming Snapdragon 8 Elite 2 and Dimensity 9500 chipsets are true. 

These next-generation processors from Qualcomm and MediaTek could be on par with Apple’s M4 chip in terms of single-core performance, thanks to a combination of factors including the use of ARM’s Scalable Matrix Extension (SME) and production on TSMC’s improved 3nm ‘N3P’ process.

Apple has held the crown for single-core performance in smartphone chipsets for several generations. While Qualcomm and MediaTek have managed to close the gap in multi-core performance, Apple’s chips have consistently excelled in single-core tasks. This has given Apple devices an edge in responsiveness and handling intensive single-threaded workloads.

However, things could be changing with the rumored Snapdragon 8 Elite Gen 2 and Dimensity 9500. 

Snapdragon 8 Elite 2 and Dimensity 9500 Specs

According to a tipster on Weibo, both chipsets will support ARM’s SME, which is an instruction set that allows processors to tackle complex workloads more efficiently. This could significantly improve single-core performance, potentially bringing Qualcomm and MediaTek in line with Apple’s M4 chip.

In addition to SME support, both chipsets are rumored to be manufactured on TSMC’s 3nm N3P process. This will likely improve both performance and efficiency. Interestingly, Apple’s rumored A19 chip is also expected to use the same 3nm process.

The Snapdragon 8 Elite 2 is also rumored to have performance cores clocked at up to 5.00GHz, while the Dimensity 9500’s cores are said to reach 4.00GHz.

These claims remain speculative for now, as we can only confirm actual performance once these chipsets launch and undergo benchmarking. Even then, benchmark scores often fail to fully reflect real-world performance.

Still, the rumors are intriguing. Qualcomm and MediaTek have consistently narrowed the performance gap with Apple, and these next-generation chipsets might finally achieve parity. For Android users, this could mean more high-performance smartphone options.

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MediaTek is gearing up to compete with Qualcomm in the high-performance chipset market with the Dimensity 9500. Following a recent leak about the Qualcomm Snapdragon 8 Elite 2, new details have emerged about MediaTek’s plans for next-generation smartphones.

As per details shared by Digital Chat Station, the Dimensity 9500 features a 2+6 CPU configuration, replacing the all-big-core architecture of its predecessors. It includes two Cortex-X930 “Travis” cores and six Cortex-A730 “Gelas” cores. This design mirrors Qualcomm’s Snapdragon 8 Elite, focusing on a balance between performance and efficiency.

The chip’s prime cores are expected to reach a clock speed of 4GHz, a 10% increase over the Dimensity 9400’s 3.62GHz. As for the GPU, the Dimensity 9500, built on TSMC’s N3P 3nm process, will emphasize better power efficiency and thermal management. It will include ARM’s Scalable Matrix Extension (SME) to boost multi-threaded performance, making it ideal for AI and gaming applications.

The Dimensity 9500 is expected to launch in mid-2025, well ahead of its Qualcomm rival, with the Snapdragon 8 Elite 2 reportedly set for release in October 2024. Whether the improved performance of the Dimensity 9500 will come at a higher price remains uncertain. The Dimensity 9400 is approximately 19% cheaper than the Snapdragon 8 Elite processor. With reports suggesting the 8 Elite 2 could be even pricier than its predecessor, MediaTek has an opportunity to attract new customers if it can keep the Dimensity 9500’s pricing competitive.

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(Source)

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The dust hasn’t even settled on Qualcomm‘s current flagship chip, the Snapdragon 8 Elite, but rumors are already circulating about its successor. The Snapdragon 8 Elite offers a notable performance boost over its predecessor, thanks to the switch to Oryon cores. Now, a new leak suggests Qualcomm might aim even higher with the Snapdragon 8 Elite 2.

According to leaker Jukanlosreve, citing sources in Korea, both the Snapdragon 8 Elite 2 and MediaTek’s upcoming Dimensity 9500 could hit single-core scores around 4,000 on Geekbench 6.

For context, the Snapdragon 8 Elite currently scores about 3,200 on the same benchmark. So if the leak happens to be true, it would be a 25% performance increase for the 8 Elite 2—a solid upgrade, particularly given the 8 Elite’s already impressive performance.

Performance at what cost?

However, Qualcomm has a history of balancing raw performance with thermal management, and the 8 Elite is no exception. While it pushes the limits in terms of speed, it also tends to run hotter than its predecessors due to its 4.32 GHz clock speed. 

Therefore, a key question for the 8 Elite 2 will be how Qualcomm will manage these anticipated performance gains while controlling temperatures.

Earlier rumors suggested the Snapdragon 8 Elite 2 might be manufactured by both TSMC and Samsung, but another leak by Jukanlosreve claims that TSMC will be the sole manufacturer of Qualcomm’s upcoming flagship SoC.

TSMC’s N3P process is said to offer improved performance and better power efficiency than the N3 node used in the 8 Elite. Whether these improvements will mitigate the thermal issues that could accompany a performance jump remains uncertain.

It’s still early days, and these are just leaks. With the current generation still fresh on the market, it’s likely to be some time before more concrete details emerge. We’ll keep you updated as new information becomes available.

(Source, Via)

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