In a few months, MediaTek will launch Dimensity 9600 chips, which will power the next-generation of flagship smartphones. Alongside the Dimensity 9600, the chipmaker is also expected to unveil the Dimensity 9600 Pro as the company’s first Pro-branded mobile processor with huge upgrades.

While we’re still months away from the official launch, which is likely to happen in September, leaks have already spilled enough details about the upcoming Dimensity flagships to show us what’s to come.

[Note: MediaTek hasn’t officially revealed any details about the upcoming Dimensity 9600 and Dimensity 9600 Pro, so all the details in the post are purely based on leaks and rumors.]

MediaTek Dimensity 9600 series: Spec sheet

MediaTek Dimensity 9600 series: Everything you need to know

MediaTek will split its next-gen tier into a standard Dimensity 9600 and a high-performance Dimensity 9600 Pro. Not just MediaTek but Qualcomm will introduce a “Pro” version of its upcoming Snapdragon 8 Elite Gen 6 chip around the same time later this year.

The battle is going to be more intense this year as the Dimensity 9600 Pro reportedly brings major performance upgrades and will closely compete with the best from Apple and Qualcomm.

Process node and CPU architecture

The Dimensity 9600 Pro will reportedly utilize TSMC’s advanced 2nm (N2P) node. This could offer a 10–15% performance boost and a 25–30% improvement in power efficiency compared to the previous generation. However, uncertainty remains regarding whether the standard Dimensity 9600 will use the same node.

TSMC’s factories are unable to meet the unprecedented demand for high-performance chips, and so, securing a supply of advanced nodes is a big battle in itself. And to keep the cost in check, the standard Dimensity 9600 may use the 3nm node, or it could be a lower-binned 2nm chip.

Besides an advanced node, the Dimensity 9600 Pro is reportedly getting a major CPU architecture upgrade. Instead of a traditional ‘1+3+4’ design, the Pro chip may use a ‘2+3+3’ configuration, featuring two Ultra cores with a 5.0 GHz peak frequency. The standard Dimensity 9600 may also use the new configuration, but will likely have a lower peak frequency.

The Ultra cores are rumored to be Arm’s next-gen Cortex C2-Ultra codenamed “Canyon”. The three performance cores are codenamed “Gelas-B” and the three balanced performance cores are codenamed “Gelas”.

GPU and gaming capabilities

The Dimensity 9600 chips are reportedly getting huge graphics advancements, designed to rival or beat top-tier chips from rivals. Both variants are said to feature Arm’s next-generation “Magni” GPU architecture, but the Pro chip may have higher core counts.

Furthermore, the chip could feature integrated dedicated hardware blocks directly into the silicon to offload heavy gaming tasks. According to leakster Digital Chat Station, the chip can artificially insert frames into games at a hardware level, allowing a game running at 60 FPS to be smoothly scaled to 120 FPS or higher. The Magni GPU is also said to have native resolution upscaling rather than relying purely on software tricks.

The chips reportedly feature upgraded ray tracing performance, resulting in more realistic lighting, shadows, and reflections in modern titles. Furthermore, the Dimensity 9600 Pro is said to support LPDDR6 RAM and UFS 5.0 storage, which should greatly improve data transfer speeds, resulting in faster game launches and faster loading of gaming assets.

AI and NPU capabilities

MediaTek is said to have greatly improved the AI capabilities on the Dimensity 9600 chips. The same chip is also expected to power OpenAI’s first AI-first smartphone.

The Dimensity chips may utilize a dual-NPU design for layered computing and a Neural Shader Scheduler (NSS) that dynamically analyzes machine learning tasks and divides the compute fluidity between the GPU and NPU based on real-time efficiency.

The processor may feature integrated hardware support for Arm’s Scalable Matrix Extension 2 (SME2), which would significantly accelerate matrix math to achieve faster AI responses with better power efficiency.

Benchmark numbers

Tipster Digital Chat Station has shared early Geekbench 6 estimates based on engineering samples. While they do not represent the final figures, they do give an idea of where things might land.

According to the leak, the Dimensity 9600 Pro could deliver a single-core score of 4200–4300 on Geekbench 6, and multi-core performance could be around 12000–12500. For context, the estimated Geekbench scores for the previous generation were 4000 for single-core and 11000 for multi-core, as shared by the tipster. These figures suggest a steady, incremental generational leap for the Dimensity 9600 Pro, rather than a dramatic shift.

Upcoming devices with the Dimensity 9600 series chips

Here’s a list of upcoming phones expected to be powered by the upcoming Dimensity chips:

• Vivo X500 (Dimensity 9600)
• Vivo X500 Pro (Dimensity 9600 Pro)
• Oppo Find X10 (Dimensity 9600)
• Oppo Find X10 Pro (Dimensity 9600 Pro)

The first smartphone could launch as early as September 2026.

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MediaTek is reportedly working on the Dimensity 9600, which is said to be the company’s first-generation 2nm chipset. A new leak, courtesy of reliable tipster Digital Chat Station, suggests that the upcoming chip could deliver a significant performance upgrade and may even surpass Apple’s chips in certain areas. Here’s a look at what the tipster revealed.

Dimensity 9600’s performance tipped

According to the leak, the 2nm Dimensity 9600 chip could arrive with a 2+3+3 all-big-core CPU architecture aimed at delivering single-core performance close to Apple’s chips, while multi-core performance may surpass them. However, the tipster did not specify whether the comparison was being made against the upcoming Apple A20 Pro or the existing A19 Pro.

The tipster also claims that the chipset could bring a major improvement in CME/SME capabilities, potentially doubling compared to the previous generation, while cache changes are said to remain limited.

On the graphics side, the Dimensity 9600 is tipped to feature a larger next-generation “Magin” GPU compared to rival 2nm chipsets. It is also expected to support native-level frame interpolation and super-resolution technologies, alongside improvements in ray tracing and overall rendering efficiency.

The tipster added that devices powered by the Dimensity 9600 series chipset are reportedly being targeted for a September debut. Most likely, he could be indirectly referring to the Vivo X500 Pro series, which is expected to break cover during the same month.

The Oppo Find X10 Pro and Find X10 Pro Max are also said to feature the Dimensity 9600 series chipset. However, it remains unclear whether the lineup will debut in September or continue with an October launch timeline like the previous generation.

Speaking of September, Qualcomm is also expected to unveil the Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro in the same month. The Xiaomi 18 series, which is tipped to feature the said chipsets, is also expected to debut around the same time.

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MediaTek is reportedly working on the Dimensity 9600 series of flagship chipsets. Recent reports have revealed that the brand may unveil 2nm chips, namely the Dimensity 9600 and 9600 Pro, later this year. Today, tipster Digital Chat Station released a Weibo post to reveal the performance leap the D9600 series will offer.

Dimensity 9600 Pro performance details tipped

According to DCS, the Dimensity 9600 and 9600 Pro may introduce a dual ultra-core CPU setup, marking a notable change from previous designs. The chip is said to reach peak clock speeds close to 5GHz, which places it in a new league for smartphone processors.

The architecture is expected to follow a 2+3+3 core configuration, with two ultra-large cores leading performance-heavy tasks. This approach could bring desktop-level processing capabilities to mobile devices. The chipset is also believed to be based on TSMC’s advanced N2P process, which may result in a 25 to 30 percent drop in power consumption, but this is yet to be verified, claims the tipster.

Earlier reports suggest that MediaTek could segment the lineup into multiple tiers. The standard version may be based on an enhanced Dimensity 9500+, while the Pro and Pro Max variants are likely to adopt the newer 2nm-class architecture. This layered strategy could allow brands to target different price segments while maintaining flagship-grade performance.

The Dimensity 9600 series is also expected to benefit from MediaTek’s involvement in developing advanced AI chips, including work related to Google’s TPU platform. This could translate into better on-device AI capabilities and improved power efficiency in real-world usage.

Leaks indicate that the Vivo X500 series and the Oppo Find X10 lineup may adopt the Dimensity 9600 series, particularly in their Pro Max models. Meanwhile, competing Snapdragon 8 Elite Gen 6 series chipsets from Qualcomm are expected to be reserved for select ultra-premium devices, setting up an interesting battle in the flagship segment.

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Just as rumors begin to swirl around Qualcomm’s Snapdragon 8 Elite Gen 6, a new leak from tipster Digital Chat Station is shedding light on what MediaTek has in store next.

According to recent reports, the Dimensity 9600 will be built on TSMC’s 2nm N2P process. But the more interesting shift could be in its CPU design. The chip is rumored to adopt a new 2+3+3 layout, two “prime” cores paired with six high-performance cores.

If true, this would be the first time MediaTek’s Dimensity 9 series will move to a dual prime-core configuration. For context, Dimensity 9500 has one ARM C1-Ultra (4.21GHz) for peak performance, three ARM C1-Premium (3.5GHz) for sustained power, and four ARM C1-Pro (2.7GHz) for efficiency. 

Digital Chat Station says the dual prime-core setup in Dimensity 9600 is internally referred to as “Canyon.”

Even its competitor has a similar setup

On paper, this setup should make the Dimensity 9600 better equipped to handle demanding workloads, especially as AI tasks continue to grow more complex. Paired with the new process node, the chip is expected to deliver a noticeable jump over its predecessor.

As for graphics, the Dimensity 9600 is said to include a new GPU with neural network shader technology that should improve coordination between the GPU and NPU. Better collaboration between these components could reduce power draw while maintaining smoother performance.

Meanwhile, its competition isn’t standing still. The Snapdragon 8 Elite Gen 6 is also rumored to adopt a similar 2+3+3 CPU layout. Not to forget, Qualcomm’s solution relies on its in-house Oryon cores, while the Dimensity 9600 will feature ARM’s upcoming Cortex-C2 series cores. 

This sets up a familiar situation where both companies are chasing similar architectural goals, even if their execution differs.

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Reliable tipster Digital Chat Station has shared fresh insights into the roadmap of next-generation flagship smartphones, building on an earlier post that discussed launch timelines for upcoming Dimensity-powered devices. In that earlier update, he suggested that at least either Oppo or Vivo could launch an iterative flagship as early as September. He also hinted that delaying ultra-premium models until April may not align well with faster chipset refresh cycles, especially for so-called “Ultra” variants.

The tipster contrasted this with Xiaomi’s established rhythm, where standard and Pro models typically arrive around September, followed by Ultra models towards the end of the year. He suggested that other brands may benefit from adopting a similar staggered launch strategy to better match chipset evolution.

Rumored chipsets for Pro Max and Ultra flagships

In his newer Weibo posts, DCS claims that if Oppo and Vivo move forward with Pro Max-branded models, these devices are likely to feature MediaTek’s upcoming Dimensity 9600 series chip built on TSMC’s N2P (2nm) process. He describes this as a full-performance flagship platform, indicating that Pro Max models may prioritize sustained performance and scale.

At the same time, he suggests that Qualcomm’s next Snapdragon 8 Elite Gen 6 Pro, identified internally as SM8975, may be reserved exclusively for Ultra-branded premium, imaging-focused flagships rather than mainstream Pro or Pro Max devices. In replies, DCS further notes that both the Snapdragon 8 Elite Gen 6 and its Pro variant are expected to be manufactured on a 2nm process by TSMC, but with clear segmentation between standard iterative flagships and top-tier models.

He also reiterates that multiple brands under the OV and “H” umbrella are planning Pro Max variants for their next flagship cycles, adding that one brand, abbreviated as “MH” has already introduced such a model in the current generation. Here, “H” appears to be Honor and “MH” seems to be Huawei, which has already launched the Huawei Mate 80 Pro Max.

While none of this has been officially confirmed, the posts collectively point towards tighter launch schedules, clearer flagship tiering, and more aggressive adoption of next-generation silicon across major Chinese smartphone brands.

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Both Oppo and Vivo are expected to launch their Ultra flagship phones from their current lineups in late Q1 or early Q2 2026. Once those devices arrive, we will have to wait for the next major chipset refresh before a new wave of flagships can debut.

This year, Qualcomm set the pace early by announcing the Snapdragon 8 Elite Gen 5 in early September. This allowed Xiaomi to unveil the Xiaomi 17 series in the same month.

MediaTek, however, debuted its Dimensity 9500 late in September. As a result, phones powered by that chip, including the Oppo Find X9 and Vivo X300 series, only arrived in October.

A new report now suggests MediaTek is preparing to change that timeline.

Dimensity 9600 early refresh makes Oppo and Vivo prepare their next flagship 

According to the leak, the chipmaker is planning to launch its next flagship Dimensity processor in September only. As a result, at least one brand from Oppo and Vivo could launch their new-gen flagship powered by the Dimensity 9600 in the same month.

Word for this comes from tipster Digital Chat Station, who also claims that the current-generation Oppo Find X9 Ultra and Vivo X300 Ultra will launch in April.

Xiaomi, however, will not make any changes to its launch timeline. The company is expected to unveil the standard and Pro versions of the Xiaomi 18 (name is speculative) in September, followed by the Xiaomi 18 Ultra in December. 

Xiaomi’s release of the 17 series early in September worked in its favor. September is also when Apple usually launches new iPhones. 

Xiaomi going head-to-head with the iPhone 17 series by offering more competitive features helped the company win the battle in its home market. 

Both the Xiaomi 17 Pro and 17 Pro Max have individually crossed the one-million-unit sales mark in China alone. Meanwhile, the iPhone has reportedly failed to make it to that list.

Vivo and Oppo bring their own set of hardware and software benefits, so it’s not much of a surprise if they want to go all-in on the competition. MediaTek’s earlier refresh for the Dimensity 9600 could give them exactly that opportunity.

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In a fresh leak, tipster Digital Chat Station (DCS) is back with more details on Qualcomm’s next-gen flagship chip. Earlier this week, rumors suggested the Snapdragon 8 Elite Gen 6 could launch in two variants: a standard model and a Pro version. Now, DCS claims to have more specifics.

The tipster revealed that the Snapdragon 8 Elite Gen 6 will carry the model number SM8950, while the Gen 6 Pro will be designated SM8975. Both chips are rumored to be built on TSMC’s N2P, or 2nm, manufacturing process.

The hierarchy could be 8 Elige Gen 6, Dimensity 9600, and 8 Elite Gen 6 Pro

Meanwhile, DCS claims that MediaTek’s Dimensity 9600 slots in between the two Qualcomm chips. This technically means it will perform better than the vanilla 8 Elite Gen 6, but might not match the performance level of Pro.

However, unlike Qualcomm, MediaTek doesn’t appear to be planning multiple versions of its flagship just yet and is reportedly sticking with the trusted ARM CPU and architecture. 

DCS also confirmed in the comments that the Dimensity 9600 will likely use the same 2nm TSMC process as Qualcomm’s upcoming chips.

It’s still unclear exactly what performance configuration the Dimensity 9600 will have to bridge the gap between the two Snapdragon models. For the Qualcomm chips, earlier reports suggest both will feature the company’s third-generation custom CPU architecture in a 2+3+3 core layout.

The main difference between the two Snapdragon variants seems to be in GPU performance, with only the Pro model expected to support LPDDR6 memory.

A separate report also hints that the advanced manufacturing process and faster memory could push up production costs, potentially making flagship phones even more expensive by 2027.

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(Source)

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MediaTek has officially confirmed the date for its upcoming flagship chip reveal. The company’s Weibo post announced a launch event scheduled for September 22 at 14:00pm (local time). The upcoming Dimensity 9500 is set to power premium smartphones from Vivo and Oppo, and later on from other brands.

Dimensity 9500 specifications and performance

As per reports, the Dimensity 9500 will adopt a 1+3+4 CPU configuration made up of one Travis core clocked at 4.21GHz, three Alto cores at 3.50GHz, and four Gelas cores at 2.7GHz. Both Travis and Alto belong to Arm’s new X9 line, while Gelas are part of the updated A7 series.

The chip will also feature a Mali-G1 Ultra MC12 GPU built on a new architecture, promising over 40 percent efficiency gains and more than 40 percent improvement in ray tracing capabilities. Early figures suggest that ray-traced gaming could exceed 100 frames per second, signalling a significant upgrade for mobile gaming.

The platform includes 16MB of L3 cache, 10MB SLC, SME instruction set support, and NPU 9.0 with an expected 100 TOPS of AI performance. Memory support extends to LPDDR5x at 10667Mbps along with UFS 4.1 storage for faster data handling.

Vivo’s X300 series will be the first to introduce the Dimensity 9500 to the market. Last week, Vivo’s product manager revealed benchmark results for the X300 Pro satellite communication variant, which crossed the 4 million mark on AnTuTu, making it the first Android device to achieve this milestone. However, the Oppo Find X9 Pro satellite communication version’s AnTuTu score, which was confirmed today, has even surpassed that of the X300 Pro satellite version.

Rumours are rife that the Vivo X300 series will debut on Oct. 13, whereas the Oppo Find X9 lineup may break cover on Oct. 21 in China.

MediaTek Dimensity 9600 could be a 2nm chip

Interestingly, MediaTek also disclosed progress on its 2nm flagship SoC, expected to enter mass production by the second half of 2026, likely as the Dimensity 9600.

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MediaTek has officially confirmed that it’s working on a 2 nm chip, expected to tape-out later this year. The announcement, made during the company’s keynote at Computex 2025, positions the Taiwanese chipmaker as a serious contender in the next big semiconductor transition after 3 nm.

With several smartphone chips already using 3 nm nodes, attention is now turning to the next leap in performance and efficiency. Apple is typically first to adopt leading-edge nodes from TSMC, but uncertainty surrounds its plans to adopt the 2nm node for upcoming iPhones. If Apple sticks with the refined 3 nm N3P node for its A20 chip due to production timing or cost concerns, MediaTek could become the first to bring a 2 nm smartphone SoC to market.

MediaTek confirms it’s 2 nm chip will tape-out in September 2025

At Computex, MediaTek said its 2 nm chip will tape-out in September 2025. In semiconductor development, tape-out refers to the final design being sent for manufacturing preparation. This timeline aligns with TSMC’s own plans — the foundry is expected to begin high-volume manufacturing for its N2 process in the second half of 2026.

While MediaTek didn’t confirm the name of the chip, it’s expected to be the Dimensity 9600 — the company’s next-gen flagship processor. There are no official details about the SoC yet, and it will likely remain under wraps for a while, given that it’s still over a year away from mass production.

Historically, MediaTek’s chips have been seen as cost-effective alternatives to Qualcomm’s flagship offerings. However, that may change with the Dimensity 9600. According to reports, TSMC’s N2 wafers are notoriously expensive. A rumored 10% price hike could push production costs even higher — potentially making the Dimensity 9600 one of MediaTek’s most premium and expensive offerings to date.

If all goes to plan, MediaTek’s 2 nm chip could arrive in late 2026, ushering in a new generation of high-performance Android smartphones.

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Source: MediaTek at Computex 2025

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