Reliable tipster Digital Chat Station has shared fresh insights into the roadmap of next-generation flagship smartphones, building on an earlier post that discussed launch timelines for upcoming Dimensity-powered devices. In that earlier update, he suggested that at least either Oppo or Vivo could launch an iterative flagship as early as September. He also hinted that delaying ultra-premium models until April may not align well with faster chipset refresh cycles, especially for so-called “Ultra” variants.

The tipster contrasted this with Xiaomi’s established rhythm, where standard and Pro models typically arrive around September, followed by Ultra models towards the end of the year. He suggested that other brands may benefit from adopting a similar staggered launch strategy to better match chipset evolution.

Rumored chipsets for Pro Max and Ultra flagships

In his newer Weibo posts, DCS claims that if Oppo and Vivo move forward with Pro Max-branded models, these devices are likely to feature MediaTek’s upcoming Dimensity 9600 series chip built on TSMC’s N2P (2nm) process. He describes this as a full-performance flagship platform, indicating that Pro Max models may prioritize sustained performance and scale.

At the same time, he suggests that Qualcomm’s next Snapdragon 8 Elite Gen 6 Pro, identified internally as SM8975, may be reserved exclusively for Ultra-branded premium, imaging-focused flagships rather than mainstream Pro or Pro Max devices. In replies, DCS further notes that both the Snapdragon 8 Elite Gen 6 and its Pro variant are expected to be manufactured on a 2nm process by TSMC, but with clear segmentation between standard iterative flagships and top-tier models.

He also reiterates that multiple brands under the OV and “H” umbrella are planning Pro Max variants for their next flagship cycles, adding that one brand, abbreviated as “MH” has already introduced such a model in the current generation. Here, “H” appears to be Honor and “MH” seems to be Huawei, which has already launched the Huawei Mate 80 Pro Max.

While none of this has been officially confirmed, the posts collectively point towards tighter launch schedules, clearer flagship tiering, and more aggressive adoption of next-generation silicon across major Chinese smartphone brands.

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Both Oppo and Vivo are expected to launch their Ultra flagship phones from their current lineups in late Q1 or early Q2 2026. Once those devices arrive, we will have to wait for the next major chipset refresh before a new wave of flagships can debut.

This year, Qualcomm set the pace early by announcing the Snapdragon 8 Elite Gen 5 in early September. This allowed Xiaomi to unveil the Xiaomi 17 series in the same month.

MediaTek, however, debuted its Dimensity 9500 late in September. As a result, phones powered by that chip, including the Oppo Find X9 and Vivo X300 series, only arrived in October.

A new report now suggests MediaTek is preparing to change that timeline.

Dimensity 9600 early refresh makes Oppo and Vivo prepare their next flagship 

According to the leak, the chipmaker is planning to launch its next flagship Dimensity processor in September only. As a result, at least one brand from Oppo and Vivo could launch their new-gen flagship powered by the Dimensity 9600 in the same month.

Word for this comes from tipster Digital Chat Station, who also claims that the current-generation Oppo Find X9 Ultra and Vivo X300 Ultra will launch in April.

Xiaomi, however, will not make any changes to its launch timeline. The company is expected to unveil the standard and Pro versions of the Xiaomi 18 (name is speculative) in September, followed by the Xiaomi 18 Ultra in December. 

Xiaomi’s release of the 17 series early in September worked in its favor. September is also when Apple usually launches new iPhones. 

Xiaomi going head-to-head with the iPhone 17 series by offering more competitive features helped the company win the battle in its home market. 

Both the Xiaomi 17 Pro and 17 Pro Max have individually crossed the one-million-unit sales mark in China alone. Meanwhile, the iPhone has reportedly failed to make it to that list.

Vivo and Oppo bring their own set of hardware and software benefits, so it’s not much of a surprise if they want to go all-in on the competition. MediaTek’s earlier refresh for the Dimensity 9600 could give them exactly that opportunity.

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In a fresh leak, tipster Digital Chat Station (DCS) is back with more details on Qualcomm’s next-gen flagship chip. Earlier this week, rumors suggested the Snapdragon 8 Elite Gen 6 could launch in two variants: a standard model and a Pro version. Now, DCS claims to have more specifics.

The tipster revealed that the Snapdragon 8 Elite Gen 6 will carry the model number SM8950, while the Gen 6 Pro will be designated SM8975. Both chips are rumored to be built on TSMC’s N2P, or 2nm, manufacturing process.

The hierarchy could be 8 Elige Gen 6, Dimensity 9600, and 8 Elite Gen 6 Pro

Meanwhile, DCS claims that MediaTek’s Dimensity 9600 slots in between the two Qualcomm chips. This technically means it will perform better than the vanilla 8 Elite Gen 6, but might not match the performance level of Pro.

However, unlike Qualcomm, MediaTek doesn’t appear to be planning multiple versions of its flagship just yet and is reportedly sticking with the trusted ARM CPU and architecture. 

DCS also confirmed in the comments that the Dimensity 9600 will likely use the same 2nm TSMC process as Qualcomm’s upcoming chips.

It’s still unclear exactly what performance configuration the Dimensity 9600 will have to bridge the gap between the two Snapdragon models. For the Qualcomm chips, earlier reports suggest both will feature the company’s third-generation custom CPU architecture in a 2+3+3 core layout.

The main difference between the two Snapdragon variants seems to be in GPU performance, with only the Pro model expected to support LPDDR6 memory.

A separate report also hints that the advanced manufacturing process and faster memory could push up production costs, potentially making flagship phones even more expensive by 2027.

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(Source)

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MediaTek has officially confirmed the date for its upcoming flagship chip reveal. The company’s Weibo post announced a launch event scheduled for September 22 at 14:00pm (local time). The upcoming Dimensity 9500 is set to power premium smartphones from Vivo and Oppo, and later on from other brands.

Dimensity 9500 specifications and performance

As per reports, the Dimensity 9500 will adopt a 1+3+4 CPU configuration made up of one Travis core clocked at 4.21GHz, three Alto cores at 3.50GHz, and four Gelas cores at 2.7GHz. Both Travis and Alto belong to Arm’s new X9 line, while Gelas are part of the updated A7 series.

The chip will also feature a Mali-G1 Ultra MC12 GPU built on a new architecture, promising over 40 percent efficiency gains and more than 40 percent improvement in ray tracing capabilities. Early figures suggest that ray-traced gaming could exceed 100 frames per second, signalling a significant upgrade for mobile gaming.

The platform includes 16MB of L3 cache, 10MB SLC, SME instruction set support, and NPU 9.0 with an expected 100 TOPS of AI performance. Memory support extends to LPDDR5x at 10667Mbps along with UFS 4.1 storage for faster data handling.

Vivo’s X300 series will be the first to introduce the Dimensity 9500 to the market. Last week, Vivo’s product manager revealed benchmark results for the X300 Pro satellite communication variant, which crossed the 4 million mark on AnTuTu, making it the first Android device to achieve this milestone. However, the Oppo Find X9 Pro satellite communication version’s AnTuTu score, which was confirmed today, has even surpassed that of the X300 Pro satellite version.

Rumours are rife that the Vivo X300 series will debut on Oct. 13, whereas the Oppo Find X9 lineup may break cover on Oct. 21 in China.

MediaTek Dimensity 9600 could be a 2nm chip

Interestingly, MediaTek also disclosed progress on its 2nm flagship SoC, expected to enter mass production by the second half of 2026, likely as the Dimensity 9600.

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MediaTek has officially confirmed that it’s working on a 2 nm chip, expected to tape-out later this year. The announcement, made during the company’s keynote at Computex 2025, positions the Taiwanese chipmaker as a serious contender in the next big semiconductor transition after 3 nm.

With several smartphone chips already using 3 nm nodes, attention is now turning to the next leap in performance and efficiency. Apple is typically first to adopt leading-edge nodes from TSMC, but uncertainty surrounds its plans to adopt the 2nm node for upcoming iPhones. If Apple sticks with the refined 3 nm N3P node for its A20 chip due to production timing or cost concerns, MediaTek could become the first to bring a 2 nm smartphone SoC to market.

MediaTek confirms it’s 2 nm chip will tape-out in September 2025

At Computex, MediaTek said its 2 nm chip will tape-out in September 2025. In semiconductor development, tape-out refers to the final design being sent for manufacturing preparation. This timeline aligns with TSMC’s own plans — the foundry is expected to begin high-volume manufacturing for its N2 process in the second half of 2026.

While MediaTek didn’t confirm the name of the chip, it’s expected to be the Dimensity 9600 — the company’s next-gen flagship processor. There are no official details about the SoC yet, and it will likely remain under wraps for a while, given that it’s still over a year away from mass production.

Historically, MediaTek’s chips have been seen as cost-effective alternatives to Qualcomm’s flagship offerings. However, that may change with the Dimensity 9600. According to reports, TSMC’s N2 wafers are notoriously expensive. A rumored 10% price hike could push production costs even higher — potentially making the Dimensity 9600 one of MediaTek’s most premium and expensive offerings to date.

If all goes to plan, MediaTek’s 2 nm chip could arrive in late 2026, ushering in a new generation of high-performance Android smartphones.

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Source: MediaTek at Computex 2025

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