As one of the world’s largest smartphone markets, China with its population of over 1 billion reflects several of the future trends that we may see in the smartphone industry, with one of them being the brand of the SoC (System on a Chip) used in our smartphones.

As we are almost halfway into 2022, data analytics firm, CINNO Research, has recently published a report on the Top 5 Smartphone SoC Vendors in the China market for Q1 2022, and it seems that MediaTek is the popular SoC brand used in smartphones for the quarter.

According to the report (via ITHome), smartphone SoC shipments in Q1 2022 were 74.39 million units, down 14.4% year-on-year, and down 0.7% quarter-on-quarter. And the top 5 vendors for the smartphone SoC vendors are MediaTek in the first place, Qualcomm in second, Apple in third, with Huawei’s HiSilicon and UNISOC in fourth and fifth respectively.

Let’s start from top to bottom, MediaTek saw 30.7 million smartphone chipsets shipped out in Q1 2022, which was higher than its 25 million shipments from last quarter, and 30.1 million shipments from Q1 2022. The rise in smartphone SoC shipments MediaTek can be mainly attributed to the semiconductor firm’s strategy and chipset catalogue that it had offered in the last 6 months, which included the brand’s popular Dimensity 920 5G chipset found on the Redmi Note 11 Pro+, Realme 9 Pro+ and Xiaomi 11i Hypercharge.

For Qualcomm, the brand remained relatively stable at second with 26.7 million smartphone SoC shipments in Q1 2022, higher than the 23.6 million figure from last quarter, but lower than the 27.9 million shipments from Q1 of last year. Coupled with the ongoing chip shortage, Qualcomm had earlier announced that it will gradually shift its focus to flagship chipsets instead of entry-level and mid-range chipsets due to flagship chipsets providing higher profit margins. However, the one caveat of this strategy is losing market share in mid-range and entry-level markets, which leads to lower shipments overall but higher revenues for the company.

Apple on the other hand, had only shipped 12 million smartphone SoCs in Q1 2022, down 15.8% from its 18.4 million figure from Q4 2021. As the iPhone nears the end of its release cycle, shipments are also expected to go down as well, because consumers are already expecting a new iPhone release soon, and therefore would hold off buying the current model and wait for the next iteration instead.

Huawei’s HiSilicon continues its gradual exit from the China smartphone SoC market as the firm had only shipped out 2.5 million units this quarter, down from 13.8 million in Q1 2021. As stocks for HiSilicon Kirin are not replenished due to the still ongoing supply sanctions against the company, the brand is expected to drop out of the top 5 as late as next year or as soon as the next quarter.

Squeezing just into the Top 5 is the rapidly growing UNISOC semiconductor company. UNISOC saw shipments of 1.9 million smartphones SoCs in Q1 2022, up 1760% from 0.1 million in Q1 2021. The main cause for the exponential growth behind UNISOC is the entry-level smartphone market. As the bigger players like Qualcomm and Apple’s main focus area is in the high-end, UNISOC aims to tackle the low end with its relatively much more affordable chipsets sold off to Realme, Motorola and Samsung to sell in their sub 100 dollar device market.

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• Redmi K50 Standard Review: Dimensity 8100 — probably the Best Chip of the year

(Via)

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With the recent launches of the Realme GT Neo 3 and Redmi K50 series, it seems that MediaTek is gunning for the top spot among the flagship Android SoC market with its Dimensity 8100, Dimensity 9000 processors.

However, it seems that MediaTek still has one more flagship Dimensity SoC up its sleeve for 2022 Android devices. MediaTek has officially announced its latest addition to the Dimensity flagship family — the MediaTek Dimensity 1300. 

The MediaTek Dimensity 1300 is the official successor to last year’s flagship MediaTek Dimensity 1200 chip as the Dimensity 1300 builds upon the successes that the Dimensity 1200 has achieved last year while providing some minor tweaks and improvements. The MediaTek Dimensity 1300 slots in at a higher price bracket than its Dimensity 800 and 900 series counterparts, and a lower price bracket than its higher-end siblings, the Dimensity 8100 and Dimensity 9000. 

The Dimensity 1300 features an octa-core setup, with 4 Cortex-A78 cores (1 Ultra A78 Core, running up to 3GHz, and 3 A78 Super Cores, up to 2.6GHz) and 4 Cortex-A55 efficiency cores, scaling up to 2GHz. The Dimensity 1300 runs on TSMC’s 6nm process and has support for 64-bit applications. Powering the graphics onboard is the ARM Mali-G77 MC9 CPU which is just as powerful as last year’s Dimensity 1200 GPU.

Moving onto the upgrades, the Dimensity 1300 has an improved ISP over last year as it now supports up to 200MP sensors, and hardware-accelerated AV1 decoding for faster 4K streaming. But that’s not all, the ISP also provide improvements to low-light shots as its artificial intelligence utilises real-time 3-exposure fusion for the best shot. 

Other technical specifications of the MediaTek Dimensity 1300 are also what you expect from a flagship Android SoC: Support for 16GB of 4266Mbps LPDDR4x RAM, UFS 3.1 Support, Support for 2520 x 1080 168Hz displays, and support for 5G on Dual SIMs.

The MediaTek Dimensity 1300 chipset is expected to debut in markets soon in the upcoming OnePlus Nord 2T and Redmi Note 12 series slated to launch in Q2 2022. For more news on the latest Chinese devices, stay tuned to Gizmochina for your daily source of Chinese tech news.

RELATED:

• OnePlus Nord 2T specifications revealed: Dimensity 1300, 50MP cameras, and more
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• Redmi K50 Standard Review: Dimensity 8100 — probably the Best Chip of the year

(Source, Via)

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Earlier it was announced that MediaTek had already led the Android smartphone SoC market in 2021 with a 46% share, exceeding its rival Qualcomm, which had a 35% share in the market in 2021. One might think this spell the end of Qualcomm’s dominance in the Android smartphone space. 

However, a follow-up report to the research has been published by Counterpoint Research. The report details the price brackets where Qualcomm, MediaTek, Exynos, HiSilicon and UNISOC are leading in the race for the Android chip supplier with the largest market share.

A closer examination of the report reveals that most of the market share growth for MediaTek in 2021 came from the low-mid tier wholesale price segment (sub-$299), driven by strong demand for the Dimensity 700, 800 and Helio series chipsets. Qualcomm on the other hand dominated the mid-range and premium flagship market with around 50% market share across all price brackets above $300, except for the $700-$799 price bracket, in which Samsung had a lead with 46% market share in the bracket.

But the question remains, why has Qualcomm shifted away from the low-end markets and how did MediaTek manage to win the low-end market after Qualcomm’s gradual exit?

The report mentions that the reason behind these changes of trends in the market is because of the global chip shortage. With Qualcomm unable to secure its chip supply from both TSMC and Samsung, the company instead prioritized focus on ramping up supply for its 700 and 800 series Snapdragon chipsets, driving higher revenue and profitability. 

However, with Qualcomm not providing much value-to-money in its 400 and 600 series Snapdragon chipsets in 2021, phone manufacturers decided to switch over to its competitor, MediaTek instead for their lower-end budget devices. MediaTek managed to put out capable and affordable 5G chipsets to the market in 2021 with their Dimensity 700 to 1200 series, which could provide performance on par and sometimes exceed competing processors in the same price bracket. And with the reveal of its Dimensity 8000 and 9000 series chipsets in 2022, it is expected that MediaTek could take the stake of the higher-end premium Android market as well in this coming year.

The report also shares some details about Samsung’s Exynos, Huawei’s HiSilicon Kirin and UNISOC chipsets in the industry in 2021. Besides the Samsung Galaxy S21 series equipped with Exynos, most of Samsung’s A, M and F series of smartphones were not equipped with Exynos. In the low-mid segment ($100-$299), its share decreased from 17% to 7%, and in the mid-high segment, its share decreased from 13% in 2020 to 6% in 2021.

UNISOC showed exciting growth in 2021 in smartphones priced less than $200. In 2020, UNISOC chipsets only catered to phones priced under $100. However, in 2021, realme, Motorola and Samsung have launched phones with the Tiger series SoC, citing better performance in the chipsets compared to its similarly priced competitors in the market.

Last but not least, HiSilicon’s SoCs had a 16% share in phones costing $500 and above in 2021, which was a decline from the 30% share in the previous year, due to the US trade ban. It is running on the inventory it added before the ban. By the end of 2022, HiSilicon’s market share is expected to continue to drop as its inventory gets depleted. Huawei has already started using Qualcomm SoCs in its new launches, but they are limited to 4G.

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• Redmi K50 vs Redmi K50 Pro: Specs Comparison
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• Qualcomm & MediaTek battle for the chip market throne in the US

(Via)

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MediaTek has just announced that it has become the leading chip supplier for Android smartphones in the US. This announcement arrives along with the company’s plans for the future of its 5G chips.

This marks a major shift as Qualcomm, an American chipmaker, has been the dominant supplier for semiconductors in the smartphone market. According to an IDC report (Via PCMag), the fourth quarter of last year saw the Taiwanese company acquire a market share of 51 percent in the US for Android smartphone chips. The report adds that the company’s stellar performance can be attributed to its strong sales in smartphones that can cost under 400 US Dollars. This segment was previously dominated by Qualcomm.

On the other hand, MediaTek also announced that it has received millimeter wave certification “with a major US operator” (rumored to be Verizon) and will soon offer mid range millimeter wave smartphones in the US by the second half of this year. Notably, Verizon only offers millimeter wave for its 5G smartphones. So, the company’s new 5G chips would enable best selling mid range devices to also be included into Verizon’s list.

Furthermore, the company has also recently announced the Dimensity 8000 and Dimensity 8100 series of processors that target the mid range segment, as opposed to the Dimensity 9000, which is for premium phones. So, it remains to be seen if its new chips helps increase its market share and widen the gap between MediaTek and Qualcomm.

RELATED:

• MediaTek Dimensity 8000, 8100, 1300 chips announced with support for up to 200MP cameras
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• MediaTek Dimensity 8100 launch date officially announced, chip is in Snapdragon 888’s league
• Qualcomm made significant shipment gains even as MediaTek led SoC market in 2021
• MediaTek expected to have 39% share in smartphone chip market in Q1 2022, Qualcomm gets 29%

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Earlier today (25th November 2021), a vulnerability was spotted in the AI and audio processing components in recently launched MediaTek chipsets. This vulnerability would’ve allowed apps to eavesdrop on users.

According to an AndroidPolice report, Check Point Research had discovered the vulnerability, which allows “local privilege escalation attack” from a third party application. To put things simply, an app loaded with the right code could possibly have gained access to AI and audio related information that it otherwise wouldn’t have had access to. Fortunately, the Taiwanese chipmaker fixed the issue before it was exploited. The company has even fixed every related vulnerabilities as of October 2021.

While the process to exploit this vulnerability was quite complicated, the issue would’ve given any apps to pass specific commands to the audio interface. This would’ve been a major issue considering MediaTek had a notable 43 percent market share in the smartphone process market as of the second quarter of this year. In other words, the company was the number one brand for smartphone chips in terms of shipments. So, the vulnerability could’ve been disastrous for the company. Although, the issue has reportedly been fixed back in October, so it is recommended that MediaTek users update their devices to the latest patches just to be on the safer side.

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• MediaTek aims for premium Chromebook market with its Kompanio 1200 chip in 2022

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While MediaTek and Qualcomm have been known rivals in the smartphone chipset market for many years now, the latter had always been the leader in the segment. But now, MediaTek has finally become the largest smartphone SoC maker this year.

According to the Taiwanese chip maker’s CEO Rick Tsai, “We are now the largest smartphone SoC maker globally. We continue to gain share across all regions of the world.” The senior official made that statement in a recent investor conference in Taiwan. The company appears to have seen great growth, which was enabled it to expand outside of its previous dependence on Chinese customers. The CEO added that the brand’s Android smartphone market share in North America alone will cross 25 percent this year.

For those unaware, MediaTek sells chips to almost every smartphone OEM across the globe, with its Dimensity lineup of 5G processors even being offered to the flagship segment as well. The growth of the company can be attributed to its strong performance in the 5G segment that allowed it to become the market leader, rather than being a “fast follower in the phone business,” as per EETimesAsia.

In the third quarter of 2021, the smartphone SoC’s accounted for 56 percent of its revenue. This was a sizeable increase of 72 percent from the same period last year, with the robust rise being attributed to the growth of 5Gand its market share gains. Tsai also believes that MediaTek can further grow in the 5G segment through its proprietary design architecture, low power design expertise, and 4nm process technology from TSMC.

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• MediaTek Dimensity 2000 will be 20% more power efficient than Snapdragon 898: Report

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A new report has revealed the global application processor market for smartphones in the second quarter of this year. This report reveals that MediaTek has managed to retain its top spot with a sizeable 38 percent market share.

According to a CounterPoint Research report, the Taiwanese chipmaking giant continued to lead the global AP market in this quarter, with its Dimensity 700 series dominating the 5G market. On the other hand, the Helio P35 and Helio G80 were quite popular in the 4G LTE segment. This report also marks the sizeable growth of MediaTek in recent times as the company’s latest Dimensity chipsets have become increasingly more popular across both mid range and entry level smartphones.

Meanwhile, its rival Qualcomm arrived second with a market share of 32 percent. The company saw a notable market share due to its processor’s popularity in the high end 5G market. Furthermore, Apple managed to capture the third spot with 15 percent market share thanks to the strong demand for its iPhone 12 and continued sales momentum. Samsung and UNISOC took the fourth and fifth spot with a 7 percent and 5 percent respectively. The latter saw a strong first half performance as it gained design wins with Honor and Realme in the 4G LTE smartphone market.

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• Leak reveals the Honor X20 will be powered by a different MediaTek chipset
• Blackview BL5000 rugged gaming smartphone launched with MediaTek 700 SoC and 6.39 inch display
• MediaTek launches Dimensity 5G Open Resource Architecture allowing phone makers to tweak performance

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MediaTek has announced two new processors today in Taiwan. The Dimensity 920 and Dimensity 810 chipsets are both 6nm octa-core processors with better performance and efficiency than their predecessors.

Dr. JC Hsu, the Corporate VP and GM of MediaTek’s Wireless Communications Business Unit, said that the new chipsets are designed to “provide device makers and smartphone users with the latest innovations at more accessible price points for the mainstream market.” The chipsets bring a boost in performance, display intelligence, and image brilliance.

Dimensity 920

The Dimensity 920 is a 6nm chip with four Cortex-A78 cores clocked at 2.5GHz and four Cortex-A55 Cores clocked at 2.0GHz. The GPU is the Mali-G68 which MediaTek claims has all of the technologies of the bigger G78 but is optimized for power-efficiency, thus extending battery life even further for gamers. According to the press release, the Dimensity 920 offers up to 9% faster gaming performance over the Dimensity 900.

The chipset can be paired with LPDDR5 and LPDDR4X memory and UFS 3.1 and UFS 2.2 storage. The Dimenity 900 also has Smart Adaptive Display support which allows it automatically adjust the refresh rate according to the game or UI action detected. The spec sheet also mentions it has a 4K video capture hardware engine and it can support up to four concurrent cameras and up to 108MP sensors.

For connectivity, the Dimensity 920 has Wi-Fi 6, Bluetooth 5.2, and 5G Call and Data Concurrency 3.0 that allows for 5G gaming on SIM 1 while receiving a call on SIM 2.

Dimensity 810

The 6nm Dimensity 810 sits below the 7nm Dimensity 820. It also has 8 cores made up of four Cortex-A76 cores clocked at 2.4GHz and four Cortex-A55 cores clocked at 2.0GHz. MediaTek claims that it brings a 20% increase in performance compared to the previous generation. The GPU is the Mali-G57 MC2.

The chipset supports 120Hz FHD+ displays, LPDDR4x RAM, UFS 2.2 (2-lane) storage, and up to 64MP cameras. The chipset also has high-end AI-camera features such as AI-Bokeh and AI-Color in collaboration with Arcsoft.

There is only Wi-Fi 5 and Bluetooth is version 5.1 and the peak download speed is 2.77Gbps for the modem,

The Dimensity 810 will appear in an OPPO phone soon according to a leak from last week. There is also a new Realme V-series phone coming soon that has been reported to be powered by the chipset.

RELATED:

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During its regular earnings call with investors recently, MediaTek had revealed its plans for later this year. A highlighting announcement during this conference was the arrival of the company’s latest 5G chipset that will be based on the 4nm process from TSMC.

The Taiwanese chip maker will be launching the next generation SoC as early as the first quarter of next year with production starting by the end of this year. The news arrives from Bryan Ma, Vice President at IDC, a known research agency. The official believes that the upcoming chipset will be shipped with smartphones that are priced over 4,000 Yuan (roughly 615 US Dollars).

As of right now, the Dimensity 1200 processor is the company’s top end chipset, which was also built by the world’s largest contract chipmaker as well. This chip was based on the 6nm EUV process technology and is found in handsets that house this chip as a more affordable alternative to the Snapdragon 888 SoC from Qualcomm. The latter is based on the 5nm process from Samsung.

Recent rumors have suggested that the American semiconductor giant will be launching its next generation Snapdragon 895 SoC in early December 2021, with the chip also being based on the 4nm process. So, the upcoming 4nm MediaTek Dimensity processor and Snapdragon 895 could possibly compete to be the world’s first 4nm processor in the world. This is all the information we have to go on for now, so stay tuned for more updates.

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• Blackview BL5000 rugged gaming smartphone launched with MediaTek 700 SoC and 6.39 inch display

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MediaTek has finally announced not one but two Dimensity 5G chipsets. These are the successors to the last year’s Dimensity 1000+ chipset. They feature the updated ARM Cortex-A78 core and are built on the newer TSMC’s 6nm process.

MediaTek announced two new chipsets- Dimensity 1100 and Dimensity 1200 5G. These smartphone chipsets are built on the TSMC’s 6nm compared to 7nm on Dimensity 1000+. Also, you get the boosted clock speed of up to 3GHz on the Dimensity 1200. MediaTek says that the chipsets feature updated AI, Camera, Connectivity, and GPU capabilities.

Dimensity 1100- CPU, GPU, Memory Specs

• Process– TSMC 6nm
• CPU cores– ARM Cortex-A
  • 4x Cortex-A78 Power cores clocked up to 2.6GHz.
  • 4x Cortex-A55 Efficiency cores clocked up to 2.0GHz.
• GPU: ARM Mali G77 MC9 nine-core GPU
• Memory–
  • RAM–  4xLPDDR4x at 2133MHz
  • Storage– 2-lane UFS 3.1

Dimensity 1200- CPU, GPU, Memory Specs

• Process– TSMC 6nm
• CPU– ARM Cortex-A
  • 1x Ultra-Core Cortex-A78 clocked up to 3.0GHz
  • 3x Cortex-A78 Super Cores clocked up to 2.6GHz
  • 4x Cortex-A55 power-efficiency cores clocked up to  2.0GHz
• GPU– ARM Mali G77 MC9 nine-core GPU
• Memory
  • RAM–  4xLPDDR4x at 2133MHz
  • Storage– 2-lane UFS 3.1

Both the chipsets have common features like MediaTek APU 3.0 for AI computing(APU on 1200 chipset has 10% more performance), MediaTek HyperEngine 3.0 gaming tech support, 5G call and data concurrency, multi-touch boost, ray tracing in games and AR apps, and super hotspot power savings.

EDITOR’S PICK: MediaTek announces large bonuses for employees after seeing a bump in sales

Important Features of Dimensity 1100, 1200 5G chipsets 

• Connectivity– Both the Dimensity 1100 and 1200 have an integrated 5G modem inside. They also have the company’s special UltraSave tech to tackle huge power constraints of 5G. Additionally, the chipsets support SA/NSA 5G(sub-6GHz, 5G+5G Dual-SIM), 2CC carrier aggregation across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS).
  • It must be noted that Dimensity 1200 chipset has got  TÜV Rheinland certification for its 5G performance covering 72 real-world scenarios.
  • Other connectivity features include the latest Wi-Fi 6, GNSS L1+L5(navigation), Bluetooth 5.2,
• Camera Features– Out of the two, MediaTek says that Dimensity 1200 supports up to 200MP single camera. You also get the five-core HDR-ISP(Image Signal Processor) with 4K HDR video capture support. The Dimensity 1100, on the other hand only has up to 108MP single camera support.
  • Both the chipsets have common features like 32MP+16MP dual camera support.
  • This, coupled with improved AI performance means, you get AI-Panorama Night Shot, Multi-Person Bokeh, noise reduction, HDR camera features.
• Display, Audio & Video playback support- The Dimensity 1100 and 1200 supports up to QHD display at 90Hz refresh rate. However, for FHD+, the D1200 has up to 168Hz whereas the D1100 is limited to a 144Hz refresh rate.
  • For video playback, they support HDR10+, hardware-accelerated AV1 encoding.
  • For Audio, you get ultra-low latency true wireless stereo audio, LC3 encoding for High-quality Audio, Lower latency streaming for TWS earbuds(power-efficiency).

OEM Adoption

MediaTek says that OEMs like Xiaomi, Vivo, OPPO and realme, showed support for including the new chipsets in their devices by end of Q1 2021.

Among these, Redmi and realme have already confirmed that the devices powering Dimensity 1200 chipset will hit markets very soon and Redmi’s device is expected to be the company’s first Gaming phone while realme could include it on realme X9 Pro.

UP NEXT: Realme X9 image reveals slim design, may lack 3.5mm audio jack

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A few days back, MediaTek scheduled an event for January 20 to unveil its latest flagship mobile chipset. This silicon is expected to be the 6nm Dimensity series SoC, which the company teased back in November 2020. Now, ahead of its official announcement, Redmi’s GM has confirmed a smartphone powered by this chip.

Recently, Lu Weibing, the General Manager of Redmi, confirmed the arrival of the Redmi K40 series powered by Qualcomm Snapdragon 888. Listing some key specs, he also revealed that the brand’s latest flagship smartphone series will debut in February.

Earlier today, he surprised his followers on Weibo by confirming another high-end Redmi smartphone powered by the upcoming 6nm MediaTek Dimensity SoC. His post notes that Redmi K30 Ultra featuring MediaTek Dimensity 1000+ has now reached its end of life. Therefore, a new device featuring the latest Dimensity chip will replace it in 2021.

Since he does not mention the specific time period for the launch of this handset, we believe it may only debut in the second half of the year just like the Redmi K30 Ultra. Hence, it is safe to assume that the upcoming Redmi K40 and Redmi K40 Pro will be powered by a Qualcomm Snapdragon 700 series chip and Snapdragon 888 SoC.

Anyway, there’s still a chance for a third device featuring this new MediaTek chip in the Redmi K40 series that is set to launch next month.

That said, according to a leak, the forthcoming flagship Dimensity chip will bear the model number MT6893. It will be an octa-core processor built on a 6nm fabrication process. Its CPU will consist of 1 x ARM Cortex-A78 clocked at 3.0GHz, 3 x ARM Cortex-A78 clocked at 2.6GHz, and 4 x ARM Cortex-A55 clocked at 2.0GHz. As for GPU, it will come with ARM Mali-G77 MC9.

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MediaTek is now the third largest customer of the world’s largest contract chipmaker, TSMC (Taiwan Semiconductor Manufacturing Company). The news arrives as the company sees a surge in demand for its mobile chipsets.

According to a ChinaTimes report, MediaTek has jumped to the third spot after seeing an increase in orders from major smartphone manufacturers like Oppo, Vivo, and Xiaomi. These orders mainly comprised of its latest 5G enabled processors that have seen a growth in popularity in the industry. Furthermore, it is expected that the shipments of MediaTek chips will reach around 80 to 90 million units within the first half of this year.

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This figure is around the same as the total annual shipment for 2020, marking a rise of 1.6 to 1.8 times in terms of annual shipments. At the moment, the company’s flagship 6nm 5G chipset, the Dimensity 1200 series, has reportedly begun, as per the report. Similarly, TSMC’s 7nm and 6nm processes are also projected to output 111,000 wafers in the first quarter of 2021. During this time, Apple would fully shift to the 5nm process for its Mac based and iPhone processors. The Cupertino based giant is also expected to use TSMC’s 5nm process for its upcoming graphics processing units as well in the future.

MediaTek is currently benefitting from the rise in popularity of 5G networking that has penetrated various industries. This includes the smartphone market, the PC industry, and even the wireless networking and the Internet of Things (IoT) field. Additionally, with Honor becoming independent from its former parent company Huawei, the chipmaker is also assessing on supplying the company with its 5G chips.

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Qualcomm‘s next-generation Snapdragon 888 chipset was announced this month and is expected to feature on flagship models in January 2021. MediaTek is also expected to unveil its next-generation flagship SoC soon. The company’s CEO Rick Tsai has now disclosed that the next-gen MediaTek chip will be released in Q1 2021.

MediaTek is Taiwan’s biggest semiconductor supplier used in smartphones. The company’s chief executive Rick Tsai disclosed this in a speech entitled “Accelerating the Digital Economy post the COVID-19 pandemic” at the IEEE Global Communications Conference in Taipei yesterday. He unveiled plans to launch its new flagship 5G chip by February.

The announcement is an indication that the Taiwanese chipmaker is becoming more confident about the rollout of its new 5G chip designed for premium smartphones. Two months back, MediaTek gave a vague schedule, saying that new phones powered by its new Dimensity 5G chip would enter mass production early next year.

MediaTek expects replacement demand to take off next year as shipments of 5G handsets worldwide are expected to double from more than 200 million units this year. The growth momentum of 5G phones is projected to continue into 2023 with the 5G penetration rate expected to climb to about 60 percent from 49 percent in 2022. This year, the 5G smartphone penetration rate is expected to reach 18 percent, according to Tsai.

The CEO also disclosed that the company’s strategy is to build a comprehensive product portfolio for smartphones with different price points. He also confirmed plans by the chipmaker to roll out a new 5G processor for entry-level smartphones.

MediaTek’s flagship Dimensity 1000 SoC as well as the Dimensity 800 chip have been utilized by a number of OEMs on their flagships.

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(source)

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MediaTek has been launching new 5G chipsets for smartphones under its Dimensity lineup at regular intervals. Now, the company has announced a new chipset for 5G smartphones — MediaTek Dimensity 1000C in the United States.

This newly launched chipset will be powering the LG Velvet smartphone in the U.S. on T-Mobile’s nationwide 5G network. The company says that the chipset delivers advanced AI capabilities, enhanced display features, fast connectivity, and improved multimedia capabilities for a premium user experience.

The Dimensity 1000C is manufactured using a 7nm process node and features four Arm-Cortex-A77 CPU cores and four power-efficient Arm Cortex-A55 cores operating up to 2GHz, with a large, low-latency communal cache that improves performance and power-efficiency even further.

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The company adds that it has ensured avid gamers have powerful graphics at their fingertips. There’s also the MediaTek AI processing unit (APU 3.0) that combines three different types of AI processors for AI-camera, AI-assistant, and in-app and OS-enhancements for superior experiences.

It also comes with support for AV1 HDR on Netflix and AV1 video streaming on YouTube. MediaTek says that it is working with Twitch to bring AV1 video streaming to mobile. Along with Dual Display and Dual Voice Wake Up support, it also has advanced camera support.

With this launch, Dimensity 1000C has become the third variant in the series which already has Dimensity 1000 and 1000+ SoCs. Apart from Dimensity 1000, MediaTek also has Dimensity 800 and Dimensity 700 series 5G chipsets.

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MediaTek is expecting sizeable revenue growth for the third quarter of this year. According to a DigiTimes report, the revenue will reach NT$82.5 – NT$87.9 billion (roughly $2.75 – $2.79 billion). This marks a 22 to 30 percent sequential growth, which is well beyond market expectations.

The growth estimation arrives as the company expected high demand and healthy sales for its Dimensity lineup of 5G chips. MediaTek also expects that its gross margin to be around 41.5 to 44.5 percent for the third quarter, which is roughly the same as the second quarter. Furthermore, the Taiwanese chipmakers revenue for the first half grew by 12.4 percent while net profits surged by 33.33 percent year on year.

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MediaTek surpassed its original financial guidance for the first half of 2020 and is expected to post a minimum annual revenue increase of 15 percent and double its growth projection during this year, according to industry sources. The company’s CEO stated that the 5G handset market will reach 170 to 200 million units in shipments by the end of 2020, which will be supplemented by upcoming MediaTek 5G chips in the latter half of 2020

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With 5G being the new trend in the smartphone industry, more and more OEMs are adopting the newer and faster bandwidth for their handset offerings from different segments. Despite this, 4G LTE enabled smartphones are still more popular and see higher sales and, due to supply constraints, many 4G chips from MediaTek to be out of stock until the end of 2020.

According to a UDN report, MediaTek’s supply for many of its 4G mobile chip has run dry and the restock will arrive only by 2021. The lack of supply is also indicative of the chipmaker’s focus on 5G chips, which has become popular in the current market in 2020. At the moment, the company has yet to comment on this matter but it is already known that its Dimensity chips have seen a rise in orders in the past quarter.

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TrendForce, a known research based firm, also pointed out that the inclusion of Apple into the 5G market will boost the reach of 5G smartphones in multiple markets. Previously, we had even reported on another analysis from TrendForce that projected that Apple and Huawei will be the market leaders of the 5G market in 2020, especially in the second half of 2020. Ever since Huawei lost TSMC for chip supply, 5G Dimensity chips from MediaTek have also seen increased orders.

Although, while 5G chips have become increasingly more popular, 4G handsets are still preferred by consumers and have dominance in the market. One of the reasons for the shortage stems from the company’s supply chain, coupled with a lack of power management ICs. Thus, the supply for low end MediaTek chips are in short supply till the end of this year.

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With the market demand for 5G handset soaring, the need for chips that support the newer and faster bandwidth has also increased. MediaTek is one such supplier of 5G chips with a new report suggesting its budget Dimensity 600 SoC which may launch within this quarter.

At the moment, finer details regarding the Dimensity 600 processor is still unavailable. However, industry sources close to the matter have said that it will be very competitive. This aggressiveness might be in relation to its pricing as it is expected to be placed below the Dimensity 800 series, which was already targetted towards mid range handsets.

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According to the report, the known chipmaker is expecting the new chips to see the most number of 5G related shipments in the fourth quarter of 2020, with the first smartphones with the latest chips launching sometime in the third quarter. Unfortunately, this is still unconfirmed so take it with a pinch of salt and we will be providing more updates as more information is available. So stay tuned.

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(Via)

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While MediaTek has launched its own 5G chips, the company had yet to include support for high frequency mmWave bands. Previously, it was reported that MediaTek would launch its new chips with the newer and faster bandwidth in the second half of 2020, but it seems that it has now been delayed and will only be seen by the second half of 2021.

According to a new report, MediaTek has postponed the plan to launch 5G chips with the mmWave bands and will only start mass production of these chips in the second half of 2021. These new processors are likely to belong to the company’s current lineup of Dimensity chip, and would probably be a high end chipset. Furthermore, we can also expect improvements in performance as well, in terms of CPU and GPU, and not just networking.

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The new chips may be based on the 5nm process and feature the ARM Cortec A78/X1 architecture with Mali G78 GPU. Thus, MediaTek might offer a refresh of the Dimensity 1000+ chips or a brand new name altogether. Unfortunately, these are just speculations and the report is also through industry sources and not official as of yet. So take it with a pinch of salt and stay tuned for more updates.

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(Source,Via)

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New MediaTek processors are coming. The Taiwanese semiconductor company has announced that it has an online event scheduled for early next month, and there are reports new processors are expected to be unveiled.

The event will be held on May 7 between the hours of 14:30 and 15:30. The poster doesn’t reveal much but has a text that roughly translates to “5G for All”. However, details of what to expect have surfaced from the Chinese leaker that goes by Digital Chat Station on Weibo.

More Powerful versions of the Dimensity 800 and Dimensity 1000

In a Weibo post, he said in addition to the already announced Dimensity 1000L (MT6885z), the Dimensity 800 (MT6873v), and the Dimensity 1000 (MT6889) which is yet to appear in a phone; there are also versions of the Dimensity 1000 and Dimensity 800 with higher clockspeeds in production.

The Dimensity 800 has a clockspeed of 2.0GHz for its Cortex-A76 cores and Cortex-A55 cores. This new version may push the clockspeed of the performance cores to 2.2GHz or 2.3GHz.

On the other hand, the Dimensity 1000 has its Cortex-A77 cores clocked at 2.6GHz along with four Cortex-A55 cores at 2.2GHz. MediaTek may decide to increase the clockspeed of the performance cores or actually adopt a tri-cluster arrangement where one of the performance cores is separated and given a higher clockspeed.

These more powerful versions of the Dimensity 800 and Dimensity 1000 will most likely arrive with new names when they are announced.

Dimensity 2000

The leaker also revealed there is an entry-level processor called the MT6853 in production. However, the one you should be excited about is the Dimensity 2000 which should be its most powerful chipset ever. There are no details about the chipset but we are excited nonetheless.

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(Source)

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The Dimensity 800 is one of the three chipsets with an integrated 5G modem MediaTek announced in the past few months, the other two being the Dimensity 1000L and the Dimensity 1000. The processor is designed for affordable 5G phones that don’t put a hole in the pocket. However, it is yet to appear in a phone though there are unconfirmed reports that it will surface in a Redmi phone first which may be the Redmi Note 9 Pro for China. So how powerful is the Dimensity 800 and is there a Snapdragon processor that matches it in performance?

Dimensity 800 specs

The Dimensity 800 is a 7nm processor just like the Dimensity 1000 and Dimensity 1000L. It has eight CPU cores arranged in the big.LITTLE configuration. So you get four Cortex A76 cores clocked at 2.0GHz and four Cortex-A55 cores clocked at 2.0GHz too.

For the GPU, it comes with Arm’s Mali-G57 MP4, but MediaTek has failed to disclose the clock speed. However, it is based on the Valhall architecture as the Mali-G77 used in premium chipsets.

Dimensity 800 vs Snapdragon 720G, Snapdragon 730, and Snapdragon 730G

Based on the CPU configuration of the Dimensity 800, we are looking at a chipset that beats the Snapdragon 720G, Snapdragon 730, and Snapdragon 730G in performance and efficiency.

All three Qualcomm chipsets are 8nm processors, unlike the Dimensity 800 which is a 7nm chip. MediaTek’s chipset also has the upper hand in terms of raw performance as it features four Cortex-A76 performance-based cores as against the aforementioned Qualcomm processors which have just two performance cores.

Dimensity 800 vs Snapdragon 765 and Snapdragon 765G

The Snapdragon chipsets that seem to match the Dimensity 800 in terms of performance are the Snapdragon 765 and Snapdragon 765G.

Just like the Dimensity 800, these two processors are 7nm chipsets and also have integrated 5G modems. However, their CPU configuration is a bit different. Rather than a 4+4 CPU core arrangement, the Snapdragon 765 and Snapdragon 765G use a 1+1+6 core arrangement. Technically, it is a 2+6 core arrangement as there are two Kryo 475 (based on Cortex-A76) cores and six Kryo 475 silver (based on Cortex-A55) cores. However, one of the Kryo 475 cores is clocked higher than the other.

• Snapdragon 765 – 1x 2.3GHz Kryo 475 Prime + 1x 2.2GHz Kryo 475 Gold + 6x 1.8GHz Kryo 475 Silver
• Snapdragon 765G – 1x 2.4GHz Kryo 475 Prime + 1x 2.2GHz Kryo 475 Gold + 6x 1.8GHz Kryo 475 Silver

The Snapdragon 765 duo both have higher clocked performance cores compared to those of the Dimensity 800 but let us not forget that the MediaTek chipset still has more performance cores and its efficiency cores are also clocked higher. It will be difficult to say which chipset is better overall until the are benchmark results comparing them together.

With respect to GPU, we might see the Dimensity 800 offer a close performance to the Snapdragon 765 and Snapdragon 765G Adreno 620’s GPU but we don’t expect it to be better. The Mali-G57 is built on the same architecture as the Mali-G77 inside the Dimensity 1000L and we already know the Mali-G77 is a more powerful GPU than the Adreno 620 thanks to this Master Lu comparison of the OPPO Reno3 5G and the Reno3 Pro 5G.

Conclusion

The Dimensity 800 is a pretty impressive chipset on paper and we look forward to seeing it in a commercially-available smartphone soon so we can experience its real-world performance. The chipset should be a game-changer as it is expected to bring 5G to devices priced under $300 which is the budget for a significant percentage of phone buyers.

It is also important to commend MediaTek’s new mid-range offerings but there are still several folks who have reservations about their processors. Hopefully, that changes as time goes on.

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AnTuTu also published its ranking of the top 10 most-powerful midrange model. What makes this ranking interesting is the rich lend of mid-range SoCs that power the models ranked among the top 10.

Top of the pack is the OPPO Reno3 powered by a MediaTek Dimensity 1000L processor. The device pulled an average score of 397965 points. OPPO first launched Dimensity 1000L at the end of the year 2019 onboard the Reno3 series. The Dimensity 1000L is built with a 7nm process, has built-in eight cores, and uses the Cortex-A77 architecture, while the GPU uses the G77 architecture. The SoC also comes with built-in 5G baseband and supports NSA / SA dual-mode 5G.

The Reno3 5G is followed by the Vivo X30 Pro 5G (8GB+128GB) with an average score of 326851. The X30 Pro is fired up by a Samsung Exynos 980 chipset. The Snapdragon 765-powered Redmi K30 5G completes the top 3.

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The OPPO Reno3 Pro 5G comes in at number 4 and it is powered by the same Snapdragon 765G chipset. Honor 9X Pro, Huawei Nova 6 SE and Honor 20S all powered by the Kirin 810 chipset rank as the 5th, 6th and 7th most powerful with slight differences in their AnTuTu average score.

The Redmi Note 8 Pro powered by a MediaTek Helio G90T SoC is at the 8th spot while the Redmi K30 4G running a Snapdragon 730G is ranked at number 9 with an average score of 275323 points. The Redmi K30 4G recently made an appearance as POCO X2 in India. Finally, the OPPO Reno2 equally appeared on the list, averaging 267809 points.

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(source)

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