Hisense is set to announce a new mid-range phone according to reports from local Chinese media. The phone which will arrive as the Hisense F30S is a mid-range phone with a design we have seen from other manufacturers, but the chipset under its hood isn’t so common and is the highlight of the phone.

Thanks to official renders, we are able to get an early look at the device before it is announced.

The Hisense F30S will have a display with a waterdrop notch and curved corners. It also has a fairly thick bottom bezel. On the back of the phone are two cameras stacked vertically at the top left corner. Both sensors share the same housing while an LED flash and the words “AI Camera” are positioned under the setup. The phone has two openings at the bottom for the speaker. There isn’t a fingerprint scanner on the back and neither is there one under the display.

The Hisense F30S will come in three color variants with two of them having a gradient finish.

Coming to the chipset, it has been reported that the phone will be powered by the Tiger T310 processor. This is a chipset by Unisoc (formerly Spreadtrum) that was announced in April. It is a quad-core entry-level processor but a unique one at that.

Unlike other quad-core processors that have the same cores in a cluster, the Tiger T310 has 1 x Cortex-A75 core paired with 3 x Cortex-A55 cores in a single cluster. It is able to do this as a result of Arm’s DynamIQ Architecture which replaces its big.LITTLE architecture and allows you to combine a big and LITTLE core in the same cluster. This is the first quad-core LTE chipset in the world based on the DynamIQ architecture.

One of the key advantages of this architecture is that there can be an increase in performance without an increase in power consumption. When it comes to benchmarks, Unisoc says the 12nm TSMC-built Tiger T310 has a 120% improvement in performance over other quad-core processors in single-core tests and a 20% improvement in performance in multi-core tests.

For the Tiger T310, the Cortex-A75 core is clocked at 2.0GHz while the Cortex-A55 cores are clocked at 1.8GHz.

The Hisense F30S is the same device that was seen on TENAA earlier this month as the Hisense HLTE217T. Its specs are a 6.2-inch HD+ display, 3GB/4GB/6GB of RAM and 32GB/64GB/128GB of expandable storage. Its selfie camera is an 8MP sensor while the ones on the rear are 13MP and 2MP sensors. The phone will pack a 3900mAh battery and weigh 169 grams.

The release date for the Hisense F30S and its price are still unknown but we may have to wait till the launch to find out about the latter.

(Source)

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