Extreme Ultraviolet (EUV) lithography is a critical technology for manufacturing semiconductor chips smaller than 7 nanometers. For years, Dutch company ASML has maintained a global monopoly on EUV machines using the laser-produced plasma (LPP) method. However, since 2019, US-led sanctions have barred ASML from selling advanced EUV equipment to China, tightening restrictions further in 2024 to include EUV masks, etching machines, and other components.

China’s Innovative Approach to EUV

Chinese scientists are now pioneering alternative methods to bypass these sanctions. A breakthrough in EUV light generation has come from adopting the laser-induced discharge plasma (LDP) method, an innovative approach that avoids reliance on LPP technology. The LDP process involves vaporizing tin with lasers and using high-voltage discharge to generate plasma, which produces EUV light. This method is simpler, more cost-effective, and energy-efficient, though challenges remain in optimizing power output.

A significant milestone was achieved by the Harbin Institute of Technology under Professor Zhao Yongpeng, whose team developed a compact and efficient EUV light source using LDP technology. This innovation aligns with photolithography requirements and earned top recognition at the Harbin Provincial Innovation Achievement Competition.

Chinese Institutes make a Breakthrough

In January 2024, the Harbin Institute collaborated with the Shanghai Institute of Optics and Fine Mechanics to enhance EUV light focusing and control. Other institutions, such as Tsinghua University and Guangdong Bay Area Aerospace Information Research Institute, are advancing related technologies, including power optimization and future light sources.

Meanwhile, Shanghai Micro Electronics Equipment (SMEE) filed a patent in 2023 for EUV radiation generators, signaling progress toward domestic lithography equipment. However, SMEE lags behind global leaders like ASML, as it cannot yet mass-produce machines for chips below 28 nm.

Recent Progress and Strategic Investments

China is backing its chip-making ambitions with serious money, increasing its investment from $19 billion in 2014 to $41 billion in 2023. This investment is starting to pay off. SMIC, China’s biggest chipmaker, has already made 7nm chips for Huawei’s Mate 60 Pro smartphone. Another breakthrough is coming from SMEE, which plans to start making 28nm chip-making machines in early 2025. While this is behind the 3nm chips that global leaders can make, it’s still an important step forward.

These 28nm chips are useful in many products like cars and factory equipment, helping China rely less on foreign suppliers. This progress, along with China’s work on EUV technology, shows how the country is pushing ahead despite international restrictions.

Challenges faced by China in Chip Production

China’s semiconductor industry faces hurdles, including dependency on imported components and US-imposed restrictions. Despite this, the country’s multi-pronged approach, including technological innovation, collaboration, and strategic investment, demonstrates its resolve to overcome these barriers and achieve self-reliance in advanced chipmaking.

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South Korean companies have apparently made big strides in the EUV (extreme ultraviolet) lithography technology. The number of patents from Korean firms have grown significantly and may even be a concern to the world’s largest contract chipmaker, TSMC.

A recent report from BusinessKorea had stated that South Korean companies are strengthening its patent applications for EUV technology. For those unaware, EUV is an advanced semiconductor manufacturing process that is used to produce logic chips and memory. The report found that the number of EUV related patent application have steadily been rising and have already surpassed foreign companies for the first time.

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In other words, the patent applications would soon serve as a powerful tool for South Korean companies that plan on further developing EUV technology and products in the future. The report also found that just six major companies accounted for over 59 percent of the total patent applications. This includes Carl Zeiss (18 percent), Samsung Electronics (15 percent), ASML (11 percent), S&S Tech (8 percent), TSMC (6 percent), and, SK Hynix (1 percent).

Furthermore, an analysis of the process technology field revealed that Samsung accounts for 39 percent of the patent applications while TSMC accounted for 15 percent. This meant that the two firms collectively held more than half of the total applications. Although, other South Korea based firms are also growing their patent portfolios as well.

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Samsung, the known South Korean consumer electronics maker, is also a leading figure in producing memory chips. Now, the company has recently been showcasing its latest mobile RAM chips, which have been built using the extreme ultraviolet lithography technology.

According to an Engadget report, Samsung has started the production of its new 16GB LPDDR5 mobile RAM that is the first to be made using EUV. For those unaware, this technique utilizes lasers and light sensitive chemicals to etch the silicon. This development is a breakthrough in Samsung’s memory production capabilities, which not only gives it an edge over its rivals but also clears a “major developmental hurdle.”

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In other words, the advancement opens up growth for the memory industry as a whole. Looking at some of its improvements, the new memory chips arrive with a 16 percent faster bandwidth than the previous 12GB RAMs seen before. The improved memory bandwidth now reaches up to 6.4Gbps while its size is also 30 percent smaller. This is a big deal in the mobile RAM market since shrinking parts allow smartphone manufacturers to make their devices even slimmer or offer more internal space for other components like battery.

At the moment, Samsung is gearing up to offer this new RAM stick in flagship smartphones. We will likely see upcoming generation of premium grade handsets from the South Korean tech giant featuring these chips. The company will likely pitch it to its rivals as well. Notably, Samsung is also hoping to bring these new chips into the automobile industry, which will likely improve the infotainment systems in cars.

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Samsung has been hard at work to catch up to the world’s largest contract chipmaker, TSMC. The South Korean tech giant has taken numerous steps to boost production, but it seems like the company is still struggling to improve yields of 5nm chips.

At the moment, TSMC (Taiwan Semiconductor Manufacturing Company) is mass producing 5nm chips for various companies, including Apple with its A14 chips. On the other hand, Samsung Foundry is reportedly facing issues in a similar department with low yields of its 5nm EUV (Extreme Ultraviolet) process. The company had first announced this processes’ development back in 2019, but due to the Coronavirus pandemic, it seems the company is still struggling to boost yields.

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According to a report from DigiTimes, the company had recently acquired orders from Qualcomm for the mass production of its upcoming flagship Snapdragon 875G and Snapdragon 735G chips. However, the recent difficulties being faced by the company might end up affecting the launch of the upcoming Qualcomm chips which will be found in smartphones in 2021.

Notably, Samsung had previously announced that it would be starting mass production of 5nm chips by the end of Q2 2020. Although, it is still unknown if the company managed to begin mass production as of yet. While several rumors and reports had pointed at the Galaxy Note 20 series featuring the first 5nm chips (Exynos 992), the recent news might be behind its supposed cancellation.

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Samsung, the South Korean tech giant, has just announced that it has started the mass production of 6nm and 7nm EUV (Extreme Ultraviolet) chipsets. These are the latest from the company and are being manufactured in Samsung’s newly built V1 facility, a first of its kind dedicated production line for synthesizing chips.

For those unaware, Samsung Electronics is a diverse group with its business operations ranging apart from just home appliances and consumer grade electronic products like smartphones. One of its most successful and impactful business is its chipset production, with the company being a market leader in this field. According to the official announcement, the company will be delivering its 6nm and 7nm EUV chips to its various customers in the first quarter of 2020.

Samsung’s V1 facility which is located in Hwaseong, South Korea, is a specialized facility with state of the art technology is responsible for the production. The company has even future proofed the facility as it is even capable of production of chipsets as small as 3nm in the near future. Notably, the 5nm process has already been depleted by Samsung, who is now moving over to 4nm chips.

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Furthermore, the overall investment that the Samsung facility will receive by the end of this year is estimated to be around 6 billion US Dollars. This will also cause the production capacity of the production line to grow to a size nearly triple that of last year. Similarly, its other manufacturing facilities like S1, S3 are also capable of synthesizing such sub-10nm wafers, which are currently in high demand.

According to Samsung, the EUV lithography process, which is the technology behind it, is crucial to creating more complex patterns on the wafers. Additionally, the chips made from this advanced process will serve various different purposed like 5G networking, artificial intelligence and a lot more. As of right now, the company has six production lines like this which are already taking in orders from industry giants like Qualcomm, Baidu, NVIDIA, and even Intel.

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(Via)

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Samsung’s semi-conductor and foundry business is one of its most profitable ventures. However, it didn’t get into the 7nm race early, leading to Taiwan’s TSMC getting the upper hand.

Samsung wants to play catch up and has announced the building of a new foundry which will use Extreme Ultra Violet (EUV) process for production of 7nm chips.

The new foundry will be located in Hwaseong, Gyeonggi Province, South Korea, and will begin mass production next year.

In a related news, Samsung today announced that its partnership with Qualcomm will be expanded thanks to the new EUV process technology which will be used to manufacture Qualcomm’s 5G mobile chipsets next year.

The EUV process brings a number of advantages for chip production and performance. First, the chip is smaller than previous generation ones which means device manufacturers will be able to design much slimmer devices or increase battery capacities due to the additional space.

Samsung says the process technology also reduces the complexity associated with production and has a greater yield than 10nm FinFET process. Chips produced using the process will also have a 10% increase in performance and a 35% reduction in power consumption.

TSMC on the other hand will still use FinFET for its own 7nm chips. However, its early foray into 7nm production means that it will handle production of Qualcomm’s Snapdragon 855 chip.

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By the time Samsung begins its own 7nm production, it should be ready to manufacture the Snapdragon 865 or whatever Qualcomm decides to call the chipset for 2020.

(Sources: 1, 2)

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