The Gionee M7 is another full-screen display set for release this month. The Chinese smartphone company released an official poster a few days ago announcing that the near bezel-less device will launch on September 25.

While we already know what the front panel will look like, a new image which appears to be an official render has leaked showing us the rear of the Gionee M7.

The M7 does look like a well made device. It has a brushed metal back and the blue paint job combined with the gray antenna lines give it a premium look. As previously reported, the Gionee M7 has dual rear cameras that are slightly raised. On the right side of the cameras sits a secondary microphone and LED flash.

Due to the phone being near bezel-less, the M7 has its fingerprint scanner on the back. Volume rocker and power button can be seen on the right side, so its safe to assume the SIM tray is on the left. If you look closely at the bottom, you should see the speaker grille, USB port and 3.5mm audio jack.

The Gionee M7 is expected to launch with a 6-inch display and 6GB of RAM. It will also come with the new Helio P30 chipset from MediaTek and run Android 7.1.1 out of the box.

The Helio P30 is marketed as a chipset that brings premium wide-angle and telephoto dual camera photography to smartphones. So we expect the Gionee M7 to take advantage of the new Visual Processing Unit of the chip to provide an impressive camera performance.

READ MORE: Gionee SW17W08 Shows Up On GFXBench With 18:9 Display, 4GB RAM & Helio P25 SoC

The 16nm octa-core chip has 4 cores clocked at 2.3GHz and the other 4 cores at 1.5GHz. Its GPU is the Mali-G71 MP2 clocked at 950MHz. It also comes with a 4G LTE WorldMode modem which means it should work with every network in the world, including CDMAs.

(Source, via)

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MediaTek is shifting its focus to mid-range chipsets, a report on DigiTimes has revealed. The report tips MediaTek an unlikely to roll out mobile chips built on the more advanced and smaller 10nm and 7nm manufacturing process in 2018, quoting industry sources that the tech giant is now shifting its focus to the mid-range smartphone segment. 

The sources also hint that the Taiwanese fabless chip maker has shifted R&D resources away from flagship chips to the Helio P series mobile chips. The tech giant will be putting its high-end Helio X series on hold in the mean time. MediaTek has so far released three chips under the P series. The Helio P25 was first launched and was dubbed as premium and thereafter the Helio P23 and P30 joined the P25 a couple of months back.

We can’t confirm the authenticity of the information but if it is true, the lag in the race to develop advanced-node solutions could be a warning sign that Taiwan’s IC design industry growth could be constrained. Presently, there is a stiff competition to develop chips using more compact wafer. The latest mobile chips are built using 10nm technology with MediaTek having its own 10nm Helio X30 chip. But the race is on to develop chips using 7nm wafers with Qualcomm said to be working on the next-gen Snapdragon 845 chip using the 7nm manufacturing process. MediaTek may likely not be joining the race anytime soon if this news is anything to go by.

Read More: MediaTek Helio P23 & Helio P30 Now Official

MediaTek has seen a rapid decline in its mobile chip shipments since last year, recording an all-time low gross margin of 35.6%. The company is striving to improve its gross margin by 1-2pp every quarter over the next 2-3 quarters and anticipates its gross margin would return to the 37-39% level as early as the second half of 2018. According to MediaTek’s CEO, Rick Tsai, the Helio P-series mobile phone processors will be a major product focus of the company, and 12nm will be the main process technology MediaTek’s mobile chips will be made using during the first half of 2018.

(source)

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MediaTek has announced two new processors in the mid-range Helio P series and they are the Helio P23 and P30 chips. The two chips join the Helio P25 to form what MediaTek calls its “premium” mid-range lineup. The processors are expected to feature on the top mid-range models like the Moto G.

The Helio P23 and Helio P30 come with almost similar configuration except for a few differences like the clock speed on the GPS. Both processors use the Mali G71 MP2 but while the Helio P23 features a clock speed of 770MHz,  the Helio P30 has a clock speed of 950MHz. Another key difference is that the P30 is capable of handling dual 16-megapixel cameras or a single 25-megapixel camera but the Helio 23 can only handle dual 13-megapixel cameras or a single 24-megapixel camera.

 Aside these two differences, both the P23 and P30 feature an octa-core Cortex-A53 cores running at a frequency of 2.3GHz. The processors also pack MediaTek’s CorePilot 4.0 technology which brings on power aware scheduling, thermal management, and UX monitoring. With this technology, this allows the chipsets to work well in high-performance mode, and still offer a consistent user-experience. The Helio P23 and P30, as usual, is touted to bring an increase in performance and reliable connectivity and also provide better battery life. 

 

Read Also: OPPO & Vivo Could Go Back To MediaTek Chips In H2 2017

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The Helio P23 and P30 are the new members of the P-series which is targeted at smartphones with slim profiles. They, like the other chips in the series will offer improved battery efficiency without skipping on performance.

The details available say the Helio P23 will be an octa-core 16nm chip built by TSMC. It will support 2K displays, dual cameras, and have Cat. 7 LTE.

The Helio P30 will also be manufactured by TSMC but using a 12nm process. The P30 will be one of the 12nm chips expected to be released this year. It will have four Cortex-A72 cores clocked at 2.0GHz and four Cortex-A53 cores clocked at 1.5GHz. It will also support Cat. 10 LTE speeds.

READ MORE: Mediatek Says The Helio X30 Is For Gamers

Manufacturers such as Meizu, OPPO, Vivo and Gionee are said to have signed up for the Helio P23 already. When both chips are announced we may see more manufacturers pick it up for their mid-range phones. Some of these devices may even likely be released by the end of the year.

(Source, via)

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In its bid to grab a share of the market from Qualcomm, MediaTek is said to be working on a number of processors which are mostly mid-range chips. MediaTek gets most of its patronage from OEM in the budget and mid-range category as the company is nearly absent in the flagship category. Earlier on, the company was revealed to be working on an Helio P23 chip. The company is now said to also be working on an Helio P30 chip which would soon hit the market.

Media reports from Taiwan, MediaTek’s base, hints that the chip maker is planning to quickly push a god number of its chip into the market in order to continue to enjoy a good patronage and curtail the rise of the mid-range Snapdragon 630 and 660 chip announced by Qualcomm recently. The reports also quoted MediaTek’s chairman Xie Qingjiang as stating recently that the company would soon launch the P30 chip. The Helio P30 is said to be built on the 12nm TSMC manufacturing process. It is an octa-core processor composed of four Cortex-A72 cores clocked at 2GHz and four Cortex-A53 cores clocked at 1.5GHz. The processor is expected to support LPDDR4 memory standard and UFS 2.0 flash memory and up to 25MP camera sensor.

Read More: Mediatek’s Helio P23 Chip Targeted At OPPO, Vivo & Gionee Smartphones – Analyst

Furthermore, the MediaTek Helio P30 will come with support for Cat. 10 LTE band with a downlink rate of up to 600Mbps. There are rumors that the first OEM that would feature the Helio P30 is Meizu. This rumor is further buttressed by the supposed Meizu product schedule that leaked earlier this year. The schedule lists Meizu as launching the MX7 in September this year with an Helio P30 chip. The P30 is also said to have a unit price lower than that of the SD 630/ 660.

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When Meizu’s product roadmap leaked a few months ago, the MX7 was one of the products we saw on the list. We were able to deduce from the leaked info that the Meizu MX7 will launch in September and will be powered by a Helio P30 SoC.

September is still a good five months from now but an alleged live image of the Meizu MX7 just showed up online. Because it is still too early, we advice you to take this with a pinch of salt, although it is possible Meizu might have adjusted its calendar. But even at that, MediaTek still has not announced the Helio P30 processor yet. Heck! We are still even waiting for phones to show up with the Helio P25.

However, there is an explanation for the SoC. According to the source, the Meizu MX7 will launch with the Helio X30 or Snapdragon 660 SoC. These two processors are not yet present in any phone, but at least they have been officially announced.

The Meizu MX7 is expected to feature a 21MP rear camera and a 5MP sensor for selfies. The display will be 5.7-inches with a 2K resolution and it will have a USB Type-C port and 3.5mm audio jack.

READ MORE: Meizu May Split in Two Firms, Namely Meizu and Blue Charm

The design isn’t different from other Meizu phones but the side bezels are pretty thin. It has the signature mBack button at the bottom but also appears to be lacking a light sensor at the top.

(Source)

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For a while now, Meizu has been stuck with using MediaTek chip on its smartphones and of late, the Meizu Pro 6 Plus featured a Samsung Exynos 8890 flagship SoC. Unfortunately to the disappointment of not a few persons, Meizu has failed to pack Qualcomm’s chip on its latest gadgets.

A recent Qualcomm press release had stated among other things that China’s top ten phone brands have all got Qualcomm’s patent license. If you talk about the top ten brands in China, Meizu is definite among them.

More revealing is the recent leaked product schedule said to be Meizu’s lineup for 2017. The product schedule outlines the different Meizu smartphones that are likely to be released in 2017 and the month they would drop. According to the poster, Meizu should release the M5S in February using a MT6753, the Meizu Pro 7 uses a Helio X30 chip launching in June. In addition, the Meizu S using an Helio P25 chip is expected in July, while the MX7 with an Helio P30 chip will drop in September. October would see the Meizu Note 6 powered by an Helio P20 SoC.

One notable information outlined on the leaked calendar is the processor the devices would carry on launch date. That would not have gotten us excited if not for the Qualcomm chipset which is listed against a device whose name is obscured on the sheet, perhaps a Meizu M derivative. However, we could see what looks like a Snapdragon 626 chipset listed as featuring on the device.

Read More: Meizu M5S Gets 3C Certification, Sports 4GB RAM and an Octa-Core SoC

Well, don’t get too excited because even if the product schedule turns out to be true, you won’t be seeing the Snapdragon-powered Meizu flagship anytime soon. The device is listed for release in December 2017, one year from now.

source

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