A new set of images posted on Elephone’s twitter page shows a phone with a bezel-less design similar to the Xiaomi Mi MIX. Now for those of you who have been following the manufacturer, the device definitely looks familiar. Yes, this device looks exactly like the Elephone S8 and it probably is.

The Elephone S8 has been in the news for over four months now but still hasn’t been released. These pictures are of a working prototype released to probably show that the phone has not been shelved.

Look at this! Have a Guess!(This is a prototype model) pic.twitter.com/jJofv2NtlX

— Elephone (@ElephoneMobile) April 11, 2017

Most of the specifications are still unknown but it is said to sport a 6” FHD display and a Helio X27 SoC. There is also a fingerprint scanner sitting on the lower bezel which is considerably larger than that of the Mi MIX. None of the images show the back of the device but previous reports say there is a dual camera setup at the back.

READ MORE: The Elephone P9000 is a 5.5-inch Device in A 5-inch Body

Elephone will need more than a tri-bezelless display and dual cameras to show that it can take on the Xiaomi Mi MIX. First, it will have to release this device and make sure it is available for purchase and also ships in time. It will also have to work on after sales support.

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LeEco finally launched its much-touted flagship smartphone with AI technology and it turns out the device is an upgraded version of last year’s Le Pro 3 flagship. The LeEco Le Pro 3 AI Edition as it is called, is a little different from the Le Pro 3 in design and the hardware is an entirely different ball game.

We bring you some fresh photos of the Le Pro 3 AI Edition so we can see how it differs from the Le Pro 3. The Le Pro 3 AI Edition is available in gold, rose gold, and black, so what we have here is the gold coloured variant. If you compare the Le Pro 3 and Le Pro 3 AI (both pictured above), the two flagships could be said to be similar in their front design. The display comes with the same near bezel-less design at the sides and that black borders just won’t go away. There is absolutely no physical home button at the front as it is a virtual affair.

Where there are marked differences in design is at the rear aspect where the Le Pro 3 AI Edition uses a fused antenna design located at the border edge just like is found on the iPhone 7 and OPPO R9S. The most prominent design feature is the design of the dual cameras making it look like the face of the cartoon character – Biscuit man. The Le Pro 3 came with a single rear camera but here we have a dual setup. The rear fingerprint sensor is still located under the camera as well as the LeEco logo at the extreme end.

We just can’t complete this without reminding you that the Le Pro 3 AI comes with artificial intelligence called Lele. Lele is a voice-activated intelligent assistant, so there is no special button to activate it. Also, instead of a Snapdragon 821 chipset, there are two models with Helio X23 and Helio X27 processor respectively. Both versions come with 4GB of RAM while the base version has a 32GB storage and the higher version a 64GB storage.

Related: Dual Camera LeEco Le Pro 3 AI Edition is Official: Helio X27 & ¥2399 ($350) Price

If you are disappointed by the choice of a MediaTek SoC on the new smartphones, perhaps their prices will cheer you up. The base version of the Le Pro 3 AI Edition is priced at 1799 Yuan (~$260) while the Helio X27-powered model goes up for 2399 Yuan ($350). The new smartphone is already up for pre-orders and will go on sale on April 14. There are more images of the LeEco Le Pro 3 AI Edition down below.

The post LeEco Le Pro 3 AI Edition With Dual Cameras: Hands-on pictures appeared first on Gizmochina.

Its been a long wait for LeEco’s dual camera flagship and today the Chinese manufacturer has taken the wraps of their new device. The new smartphone called the Le Pro 3 AI Edition features a bunch of new cool features, most notably its new AI Assistant.

The LeEco Le Pro 3 AI Edition is available in two variants. There is a base version with 4GB of RAM, 32GB of storage and a Helio X23 processor clocked at 2.3GHz. The high end version has the same RAM but doubles the ROM t0 64GB and is powered by Mediatek’s deca-core 2.6GHz Helio X27 chipset.

Le Pro 3 AI Edition
DIMENSIONS / WEIGHT	152.4 x 75.1 x 7.5mm 168 grams
DISPLAY	5.5-inch 1920 x 1080p 403 ppi 600nit Max Brightness
CPU	Standard: Helio X23@ 2.3GHz Eco Edition: Helio X27@2.6GHz
MEMORY	Standard: 4GB + 32GB Eco Edition: 4GB + 64GB
CAMERAS: REAR	13MP + 13MP (B/W + Color) Dual Cameras f/2.0, PDAF, dual LED flash, 4K/ 1080p @ 30 fps video recording 720p@120 fps slo-mo
CAMERA: FRONT	8MP 1.4um pixel f/2.2, 76.5 degree wide angle lens
BATTERY	4000mAh
OS	EMUI 5.9 (Android M)
CONNECTIVITY	2.4G / 5G Wi-Fi 802.11 ac Bluetooth 4.2 NFC Infrared Sensor Dual SIM (two Nano SIMs)
4G LTE Bands	FDD LTE: B1/ 3 / 7 TDD LTE: B38 / 39 / 40 / 41
PRICE / Release	Standard: 1799 Yuan ($260) Eco: 2399 Yuan ($350) APRIL 14 Release

Le Pro 3 AI Edition Dual Cameras

The Le Pro 3 AI Edition has two 13MP dual cameras on the rear that work in the RGB + monochrome format. Combined with what LeEco calls LE IMAGE AI Engine, users should be able to take clearer and sharper images under low light conditions. The camera app has also got a number of upgraded features. The cameras sit in a single housing along with the dual LED flash giving it a sort of smiley face akin to a Japanese forest spirit.

LeLe AI Assistant

LeEco’s AI assistant is called LeLe. While it may not sound fancy like Siri or Alexa, it does have some very interesting features. LeLe can be activated when the screen is off and will allow you carry out a number of functions by voice alone. It is integrated with all LeECo apps and also works with a number of third party applications too. If you are shopping, LeLe is smart enough to bring up payment options like AliPay. The interesting thing about LeLe is that it learns over time and gets better at what it does.

Le Pro 3 AI Edition Price

The base version of the Le Pro 3 AI Edition is priced at ¥1799 (~$260) while the Helio X27 model sells for ¥2399 ($350). Pre-orders begin at 1400hrs today before going on sale at 1000hrs on the 14th of April. The Le Pro 3 AI Edition is available in gold, rose gold, and black.

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Today, LeEco started sending out invitations an event on April 11. The event is expected to be the launch of a new phone with dual cameras and a powerful AI system.

The dual cameras on LeEco’s new device are expected to work in a monochrome + RGB format. This will allow the cameras take better pictures under low light conditions. For the AI system, LeEco’s new phone will be able to work via voice alone. Just by speaking a command, you will be able to carry out functions like making a call. That sounds basic but it is also said that the assistant learns over time, increases its level of integration with the phone and even includes 3rd party apps functionality.

READ MORE: Dual Camera LeEco LE X920 Leaks in Hands-On Video and Images

The rest of the specs for the device are unknown but sources say it will be powered by Mediatek’s Helio X27. Alongside a teaser image released today, there was also a video which can be checked out below.

The post LeEco Teaser Confirms Dual Camera Phone with Powerful AI Assistant appeared first on Gizmochina.

It appears LeEco has a new phone set to launch soon. The manufacturer’s official Weibo account released a teaser image hinting at a device that will offer improved performance but also consume less energy.

The teaser image is a red-circuit board with a text that loosely translates into “How to maintain a balance between high performance and low power consumption”. The accompanying text in the post also translates into the same meaning above.

Some sources say the new device will most likely be powered by the Helio X27 chip, a processor from Mediatek that offers great performance but also consumes low amounts of energy.

The Helio X27 was announced last year alongside the Helio X23 as upgrades to the Helio X25 and Helio X20 respectively. Both SoCs are deca-core chipsets and use a tri-cluster architecture. The Helio X27 is said to offer a 20% overall increase in performance compared to the Helio X25. So far, only two phones currently sports the processor and they are the UMi Z and Umi Z Pro.

READ MORE: LeEco to Focus on TV Business in India with Offline Marketing; Confirms It’s Not Quitting The Country

Apart from the Helio X27, some say LeEco will also take advantage of its AI technology to study owner habits to determine ways to better save power and increase performance.

The new phone is expected to be launched in April with an EUI update that brings new features including Artificial Intelligence. It is also expected to sport a large battery like the LePro 3 and have dual cameras that will use the RGB+ Monochrome format.

The post LeEco Teases New Phone That Will Balance Performance and Battery Life appeared first on Gizmochina.

The first time we came across the Helio X27 chip was in a yet-to-be released LeEco phone called the LeEco Dual 3. Now Mediatek has taken the covers of the processor and it’s now official. But even though it was first spotted on a LeEco phone, it appears Umi will be the first to launch a phone with the new processor in the form of their Umi Z.

It is no surprise that Umi will want to be the first manufacturer to release a phone with the new chip seeing as they did the same with the Helio P20 sporting Umi Plus E and according to sources Mediatek is more than happy with the success of the phone, so why not partner with them again on their next device?

Umi is calling the Umi Z their annual ultra-flagship device but apart from the fact that it might be the first device to feature the new chip, every other detail about the device is still unknown.

Judging from the upgrades the Helio X27 is offering over other chips, we expect the Umi Z to have a better battery life and probably sport dual cameras since it now has an upgraded Imagiq image signal processing processing solution. The new upgrade combines color and mono cameras depth-of-field applications into a single ISP aimed at both quality and functionality for photography.

READ MORE: Onyx Black Gets benchmarked, Scores Above 60,000 Points

The release of the Umi Z will be received with mixed feelings since it is coming on the heels of the recently launched Umi Plus E.

The post Umi Z Might Be The First Helio X27 Phone to Launch This Month appeared first on Gizmochina.

MediaTek has today announced two new high-end chips in its MTK series bringing with them some level of upgrades. The two System-on-chips are upgrades of the Helio X2o chip coming in as Helio X23 and X27.

According to MediaTek’s official website, the Helio X23 and X27 comes with  upgrades in thier overall performance, video shooting quality and low power consumption. Both the Helio X23 and X27 chip adopts the deca-core three cluster architecture made up of two 2 ARM Cortex-A72 cores, 4 ARM Cortex-A53 cores and another 4 ARM Cortex -A53 cores. It uses Pilot 3.0 heterogeneous computing technology which brings precision to task scheduling and core allocation and improvement in both processor performance and power consumption.

Thre Helio X27 chip will move to an increasd 2.6GHz frequency when compared with the high-end Helio X25.The GPU is also upgraded to 875MHz. The overall performance is also said to have increased by 20% above the X25. There are also improvements in the web browsing experience and application start-up speed.

 Further, the MediaTek Helio X23 and X27 chips are equipped with an upgraded version of the Imagiq image signal processor (ISP), which not only enhance full-pixel dual-core fast focus (Dual PD) function, but also integrates color (Color) and monochrome (Mono) Depth of field camera functions in order to achieve both quality and functionality during the shooting experience. The Imagiq upgraded version brings along picture clarity, saturation, exposure control, character performance and large aperture effects, etc. and significantly provides a colorful “lens” life for smart phone users.

Read More: Mediatek Announces Helio P15 SoC: To Succeed Helio P10

That’s not all, the MediaTek Helio X23 and X27 are both equipped with Envelope Tracking Module, which can dynamically adjust the output voltage according to the strength of the output signal of the power amplifier, thus greatly improving the efficiency of the power amplifier and reducing the power consumption and Heat. The new chips provide maximum power savings of about 15%. The chips also bring along a reduction in the screen power consumption by about 25%.

The post MediaTek Announces Two New High-End Chips – Helio X23 & X27 appeared first on Gizmochina.

LeEco has a new phone called the Dual 3 coming up in November. The phone is said to be the AI phone the company has been talking about and is also the same mystery phone spotted with a Mediatek Helio X27 chip.

Spy photos released on Weibo by @NeochaEDGE shows a screenshot of the phone’s information confirming the use of a Helio X27 chip clocked at 2.6GHz and a couple of pictures showing the phone in black. The chip is said to be born from an arrangement between Mediatek and LeEco, so there are chances you might not see it on any other phone.

The new chip has been custom made to offer the best performance when you use the AI technology and dual cameras bundled with the phone. The phone will have a voice assistant that can help recommend foods, locations, and provide solutions based on information gathered from the user.

The black version of the phone looks way better and will possibly be the most preferred version based on the fact that it does  a good job hiding the black borders found on the screen of LeEco phones.

READ MORE: LeEco Launches Le Pro 3 and Le S3 in the US

The screenshot also shows that the LeEco Dual 3 will run Android Marshmallow out of the box with EUI 5.8 overlay.

The post LeEco Dual 3: Helio X27 Confirmation appeared first on Gizmochina.

Yesterday we brought news of a mysterious LeEco smartphone leaked on Weibo sporting an unknown MediaTek Helio chip which leaked online. The device was shown running the CPU-Z software which shows details of the main devices on your phone or PC.

CPU-Z showed the LeEco phone as running a MediaTek Helio SoC (System On Chip) with a clock frequency of 2.59GHz. Other details on the display include the fact that the processor uses a 14 nanometer (14nm) process, deca-core three cluster design, four Cortex-A53 cores running at 1.55GHz, another four Cortex-A53 cores running at 1.55GHz, and two Cortex-A72 cores running at 2.59GHz. This CPU set up is inconsistent with MediaTek’s known Helio chipsets.

Now, the Weibo user, Black Digital claims that this is a new chip, the Helio X27. However, he says that 14nm manufacturing node as mentioned in the CPU-Z data is wrong and the chip is manufactured on a 20nm process.

At present,  the Helio X20 uses the TSMC 20nm process, and features two 2.0GHz Cortex-A72 cores, four 2.0GHz Cortex-A53 cores, four 1.5GHz Cortex-A53 cores, while the Helio X25 uses a 16nm process and comes with two 2.5GHz Cortex-A72 cores, four 2.0GHz Cortex-A53 cores, four 1.55GHz Cortex-A53 cores. The Helio X30 architecture is given as two 2.8GHz A73 cores, four 2.2GHz A53 cores , and four 2.0GHz A35 cores, built on the 10nm FinFET process.

Read More: 10000mAh Equipped Oukitel K10000S Coming Next Week

The thing is, the Helio X27 is a new chipset that MediaTek would probably announce soon, but until then, it is an alien SoC. It is non-existent at present so we can take this as an unauthentic information. As stated earlier, an inquiry has been made to LeEco and an official response is still being expected.

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