MediaTek announced its next generation flagship processor – Helio X30, in September this year and it was unveiled as the world’s first mobile phone processor using TSMC 10nm process. The Helio X30 was also heralded as the first to have a tri-cluster hybrid architectural design.

The Helio X30 was also revealed to come with specification that includs two 2.8GHz Cortex-A73 cores, four 2.3GHz Cortex-A53 cores, four 2.0GHz Cortex-A35 as well as incorporating a quad-core PowerVR 7XTP GPU. The chip also supports four groups of 16-bit LPDDR4X-1866 memory of up to 8GB, UFS 2.1 storage, 28MP camera, Cat. 10 LTE baseband capable of 450Mbps download speed and more.

In addition, the Helio X30 is said to have a higher energy efficiency, greatly improved than its predecessors. Although we had seen a supposed benchmark score of the X30 that was disappointing, the flagship chip is reputed to be as powerful as the Snapdragon 820 or SD 821.

Read Also: 10nm BattleChip: Snapdragon 835 vs Helio X30 vs Kirin 970

According to Taiwan’s Economic Daily, the X30 is scheduled for production in the first quarter of next year and would have power management IC from a subsidiary of Richtek. It is also reported that the first smartphone models packing the Helio X30 chip would hit the market in the second quarter of 2017. This is likely going to be either a Meizu, OPPO or Vivo smartphone, according to previous rumors.

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So, let’s see what Mediatek could have in store for us for 2016. According to the analyst, the Helio X30 chip will come with the same deca-core architecture as the X20 and X25 chips. It will be built on the 10nm manufacturing node from TSMC. But the cores will be slightly different. The chip will be a combination of the new ARM Artemis cores, Cortex A53 and Cortex A35 cores. However, the source didn’t reveal the exact number of each cores. For GPU, MediaTek Helio X30 could use PowerVR graphics which would be a good upgrade from the Mali chips. The chip would also support 8GB RAM modules revealed the source. Other possible specs include upgraded video and audio features. Finally, he revealed that the chip should score around 160,000 on the AnTuTu benchmark.

Adding to this information, Black Digital released more details on Weibo. He said that the Helio X30 should also come with quad channel LPDDR4 RAM with support for up to 8GB memory. Plus, the storage would be super fast as the chip would support UFS 2.1 standard.

Helio X20 and X25 chips were left out from the pack of Samsung, Qualcomm and even Huawei flagship chips because they supported UFS 2.0. On the other hand, MTK chips only supported eMMC storage standard, which was clearly a let down. Looks like MTK is going to fix this issue with the new generation Helio X30.

Like mentioned above, this is not the first time we are hearing about the Helio X30. Lots of details were leaked about a month ago, and you can check out the info from our previous coverage.

The post Helio X30 Chip Details Leaks Out:10nm Process, UFS 2.1 & Deca-Core Design appeared first on Gizmochina.