MediaTek announced its next generation flagship processor – Helio X30, in September this year and it was unveiled as the world’s first mobile phone processor using TSMC 10nm process. The Helio X30 was also heralded as the first to have a tri-cluster hybrid architectural design.

The Helio X30 was also revealed to come with specification that includs two 2.8GHz Cortex-A73 cores, four 2.3GHz Cortex-A53 cores, four 2.0GHz Cortex-A35 as well as incorporating a quad-core PowerVR 7XTP GPU. The chip also supports four groups of 16-bit LPDDR4X-1866 memory of up to 8GB, UFS 2.1 storage, 28MP camera, Cat. 10 LTE baseband capable of 450Mbps download speed and more.

In addition, the Helio X30 is said to have a higher energy efficiency, greatly improved than its predecessors. Although we had seen a supposed benchmark score of the X30 that was disappointing, the flagship chip is reputed to be as powerful as the Snapdragon 820 or SD 821.

Read Also: 10nm BattleChip: Snapdragon 835 vs Helio X30 vs Kirin 970

According to Taiwan’s Economic Daily, the X30 is scheduled for production in the first quarter of next year and would have power management IC from a subsidiary of Richtek. It is also reported that the first smartphone models packing the Helio X30 chip would hit the market in the second quarter of 2017. This is likely going to be either a Meizu, OPPO or Vivo smartphone, according to previous rumors.

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MediaTek announced its next generation Helio X30 flagship chip about four months back but since then nothing has been heard about the processor built on a 10nM manufacturing process. But presently, a pictorial data said to be the Geekbench posting of the MediaTek Helio X30 has surfaced.

The Helio X30 is said to come with a deca-core design and perhaps for the purpose of the test and the machine is it infused into, the chip was clocked at 1.59GHz while providing the interface is Android Nougat 7.0 and there is a 6GB RAM backing the processor.

We are not so sure, though, that this is actually MediaTek’s X30 chip onboard the device as it only managed to pull a single core test score of 1504 points. On the multi-core test, it recorded a score of 4666 points. Now, that is way lower than the scores posted by its contemporaries, talking about the Qualcomm Snapdagon 821 and Huawei’s latest HiSilicon Kirin 960.

If actually, it is indeed an Helio X30 chip onboard, then this isn’t its normal level. When MediaTek announced the flagship chip few months back its configuration include being a deca-core chipset and having the same tri-cluster design in series like Helio X20 and Helio X25. The X30 is manufactured using TSMC’s 10nm FinFET process and talking about cores, there are 4 Cortex-A73 cores clocked at 2.8GHz, which is claimed to maul down heaviest of tasks, 4 Cortex A-53 cores clocked at 2.2GHz, and 2 Cortex A-35 cores clocked at 2GHz. Compared to the Helio X20 is comes with up to 53% improvement in power consumption and 43% performance improvement.

Read More: Mediatek Helio X30: New Leak Reveals Powerful Deca-Core Setup With PowerVR GPU

In addition, the Helio X30 is touted to support camera sensors up to 40MP and video capture up to 24MP. Further, Helio X30 will support up to 8GB of RAM further supporting LPDDR4 (Package-On-Package) POP 1600MHz channels. It is further equipped with PowerVR 7XT quad-core GPU. This graphic engine will highly enhance the graphic performance and will be perfect for VR as well. The Helio X30 will also support LTE CAT 12.

The chipset isn’t expected to ship until sometime next year and we can expect some devices to show up powered by this chipset in the second half of 2017.  Perhaps when that happens, we’ll get to see the true fire power of the Helio X30 but for now, we’ll take this alleged Geekbench posting with a pinch of salt.

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Chip-maker MediaTek has confirmed some of the specifications of its expected high-power Helio X30 chipset  which has been making the headlines of late. In an interview with Sun Chanhxu, MediaTek COO Zhu Shangzu threw more light on the Helio X30.

Zhu Shangzu expressed his optimism that this year’s X-series and P-series will significantly improve the consumer perception of the MTK brand, hence the quest to manufacture high-end flagship capable chipsets that could see them being featured in flagship phones.

Also, on the specifications, Zhu Shangzu confirmed that the Helio X30 will be manufactured by TSMC using 10nm manufacturing process. The processor will also provide support for 3 baseband carrier aggregation, Cat. 10 – Cat. 12 network baseband. Also, MediaTek shelved the ARM Mali GPU on this one and instead opted for a PowerVR GPU which the MediaTek says provides better performance and more efficient power consumption.

In summary, the Helio X30 would rank as the latest among MediaTek’s second generation of deca-core processors which consist of a dual-core 2.8GHz A73 next-gen architecture code-named Artemis, 4 x A53(2.2GHz) cores and 4 x A35 (2GHz) cores.

Related: Mediatek Helio X30: New Leak Reveals Powerful Deca-Core Setup With PowerVR GPU

In the aspect of memory, the Helio X30  will support four channels LPDDR4 RAM, up to 8GB RAM storage modules, and support for UFS 2.1 technical standards.

We won’t be seeing the Helio X30-powered smartphones very soon as MediaTek has scheduled November for mass production of the Helio P20, its latest addition in the lower P-Series and also MediaTek’s first chip using 16nm process announced in February. Thus considering the available time frame, the  Helio X30 isn’t expected to feature in smartphones until sometime around the middle of next year.

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So, let’s see what Mediatek could have in store for us for 2016. According to the analyst, the Helio X30 chip will come with the same deca-core architecture as the X20 and X25 chips. It will be built on the 10nm manufacturing node from TSMC. But the cores will be slightly different. The chip will be a combination of the new ARM Artemis cores, Cortex A53 and Cortex A35 cores. However, the source didn’t reveal the exact number of each cores. For GPU, MediaTek Helio X30 could use PowerVR graphics which would be a good upgrade from the Mali chips. The chip would also support 8GB RAM modules revealed the source. Other possible specs include upgraded video and audio features. Finally, he revealed that the chip should score around 160,000 on the AnTuTu benchmark.

Adding to this information, Black Digital released more details on Weibo. He said that the Helio X30 should also come with quad channel LPDDR4 RAM with support for up to 8GB memory. Plus, the storage would be super fast as the chip would support UFS 2.1 standard.

Helio X20 and X25 chips were left out from the pack of Samsung, Qualcomm and even Huawei flagship chips because they supported UFS 2.0. On the other hand, MTK chips only supported eMMC storage standard, which was clearly a let down. Looks like MTK is going to fix this issue with the new generation Helio X30.

Like mentioned above, this is not the first time we are hearing about the Helio X30. Lots of details were leaked about a month ago, and you can check out the info from our previous coverage.

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Mediatek has come a long way from being a local Chinese chipmaker. Last year, the company upped its game with its new range of 64-bit chips and managed to take on the US-based Qualcomm to some extent. The company’s advantage has always been its low cost pricing, which has driven the adoption of MTK chips inside low-cost smartphones.

However, when it comes to the high-end segment, Mediatek still has a long way to go. The initial benchmark results of the Helio X20 chip, the world’s first deca-core processor show that its targeted at the upper mid-range market, scoring about 85K on AnTuTu. On the other hand, the top-end Snapdragon 820 chip can score as much as 133K on the same benchmarking test.

So, even this year, Mediatek has not really caught up with Qualcomm’s Snapdragon in the high-end segment. But the company seems to have high hopes for its upcoming Helio X30 chipset, which is said to take on the big guns in the industry next year. Zhu Shangzu, the COO of Mediatek, recent said that the Helio X30 chip is going to be a power house which can take on premium chipmakers like Qualcomm and Samsung.

The company will reportedly continue with its deca-core architecture built on the 16nm process on its upcoming top-end chip. The possible architecture of the Helio X30 could be 2 x 1GHz Cortex A53 + 2 x 1.5GHz Cortex A53 + 2 x 2GHz Cortex A72 and 4 X 2.5GHz Cortex A72 cores. We still don’t know what GPU will be inside the new chip, but we sure hope that it’s powerful enough to take on the GPUs used in Samsung and Qualcomm SoCs. So, let’s hope that company does not continue with its tradition of using powerful CPU’s but crappy GPUs inside its high-end lineup.

We still have no word on the release date of the chip, but considering that Mediatek announced the Helio X20 quite early last year, we may see an announcement of the X30 sometime in the next few months.

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Mediatek reshuffled its lineup earlier this year, by launching a brand new SoC series for the high-end segment called as the Helio series. We have already seen the Helio X10 chipset which powers a lot of mid-range and high-end devices and we will soon meet the Helio X20, the world’s first deca-core smartphone CPU.

But it looks like even before the mass release of the Helio X20 CPU, details about its next generation version, the Helio X30 chip has leaked out. According to the latest report, the Helio X30 will feature a similar cluster design as the X20, but with new CPU cores.

According to this new leak, the Helio X30 chip will feature quad Cortex A72 cores clocked at 2.5GHz, dual Cortex A72 cores clocked at 2.0GHz, dual Cortex A53 Cores clocked at 1.5GHz and dual Cortex A35 Cores clocked at 1.0 GHz. So, end of the day, the upcoming chip is also expected to feature deca-core setup like X20.

This comes at a time when we are increasingly seeing chip makers reduce the cores on their SoCs. For example, Qualcomm has reduced the number of cores from eight-cores in Snapdragon 810 to quad-cores in the latest Snapdragon 820 chip. Even Apple’s A9X chip is just a dual-core SoC. But looks like Mediatek will continue using its special cluster design for its upcoming chips.

We have not yet seen the Helio X20 chip in action yet. Its the world’s first chip with a tri-cluster design and it will be interesting to see how well it performs in real life. Whether the use of three different cores, totaling to 10 cores helps it beat rivals like Exynos is something we will have to wait and watch.

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