A new Hisense smartphone with model number HNR553T has received certification from the TENAA agency of China. The listing has revealed the entire specifications and images of the device. According to WHY LAB, the handset will be heading to China with the Hisense F70 moniker.

Hisense F70 specifications

The Hisense F70 has a 6.81-inch LCD panel that offers a Full HD+ resolution of 1080 x 2400 pixels. The TENAA images of the phone have a waterdrop notch display. It has a front camera of 8-megapixel for capturing selfies and video calls.

The rectangle-shaped camera module has a 48-megapixel primary camera. It is coupled with an 8-megapixel secondary lens, and a pair of 2-megapixel sensors, which may help in capturing macro images and depth shots.

The device is powered by an unknown 2.2GHz octa-core processor. According to the tipster, it is equipped with a Unisoc T760 chipset, LPDDR4x RAM, and UFS 3.1 storage. The TENAA listing states that the device will arrive with 4 GB / 6 GB / 8 GB / 12 GB of RAM and 64 GB / 128 GB / 256 GB / 512 GB of internal storage.

The Hisense F70 will come with a 5,000mAh battery (4,860mAh rated battery). The 3C certification of the device has revealed that it may carry support for 18W fast charging. The handset measures 170 x 78.8 x 8.35mm and weighs 214 grams. There is no word on the launch date of the device.

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