Honor is reportedly preparing to unveil its second-generation clamshell foldable, the Magic V2 Flip (or Magic V Flip 2), in China this month. While the company has not confirmed the device’s name or launch date, well-known tipster Digital Chat Station has shared fresh information about its outer display.

Full-size outer display tipped

According to the leak, the Honor Magic V2 Flip will feature an uninterrupted, full-size secondary screen on the outside. This LTPO panel is expected to support a high refresh rate, high resolution, and increased brightness.

The cover screen will incorporate a punch-hole camera cutout within the active area, allowing it to display Always-On Display clocks, live information, and dynamic notifications without visual breaks. Reports also indicate that Honor has opted for a uniform camera ring design, replacing the uneven layout of the first-generation model.

Honor Magic V2 Flip specifications (rumored)

Previous leaks suggest the Honor Magic V2 Flip’s outer panel will measure around 4 inches, paired with a 6.8-inch foldable OLED LTPO screen inside. For photography, it may include a 50-megapixel main camera with a 1/1.5-inch sensor.

Under the hood, the phone is expected to be powered by the Snapdragon 8s Gen 4 chipset, coupled with a 5,500mAh battery.  It may support 80W wired and 50W wireless charging. It is expected to run on Android 15 with a layer of MagicOS 9.0 on top.

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Honor is gearing up to launch its next clamshell-style foldable phone, the Magic V2 Flip, in August in China. A recent leak from reliable tipster Digital Chat Station has revealed key specifications of the upcoming device, including its standout feature — a battery capacity that could set a new benchmark for flip phones. In the lead-up to its launch, the device has received certification from China’s CMIIT and 3C authorities.

Magic V2 Flip passes CMIIT and 3C certifications in China

A new Honor device carrying the model number CLE-AN00 has appeared on both MIIT and 3C certification platforms in China. The CMIIT listing’s source code reveals the presence of a 5,370mAh rated battery, which strongly suggests it is the Magic V2 Flip. Meanwhile, the 3C certification confirms support for 80W wired charging, although actual charging speeds may be limited to 66W.

Honor Magic V2 Flip specifications (rumored)

The Honor Magic V2 Flip is expected to feature a 6.8-inch foldable OLED LTPO display with FHD+ resolution, along with a 4-inch LTPO cover display on the outside. It is said to be powered by a Snapdragon 8-series chipset, although not the flagship Snapdragon 8 Elite. It remains unclear whether it will use the Snapdragon 8s Gen 4 or a different variant.

In terms of photography, the device is expected to feature a 50-megapixel main camera with OIS support and a 1/1.5-inch sensor. Once launched, it will go up against rivals like the Xiaomi Mix Flip 2 and Samsung Galaxy Z Flip 7, both equipped with the Snapdragon 8 Elite series chipsets.

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Honor is preparing to launch several new smartphones in the Chinese market, including the Honor 400 series, Honor GT Pro, and new foldable devices such as the Magic V4 and Magic V2 Flip. Recently, tipster Digital Chat Station shared details about the Magic V4 in a Weibo post. Now, he has returned with another leak, revealing new information not only about the Magic V4 but also, for the first time, about the Magic V2 Flip.

Honor Magic V2 Flip

According to DCS, the Honor Magic V2 Flip will feature a customized LTPO panel and be powered by the Snapdragon 8 Gen 3 chipset. However, the leak does not disclose other specifications of the device. For reference, last year’s Honor Magic V Flip came with a 6.8-inch foldable LTPO OLED display and was equipped with the Snapdragon 8+ Gen 1 chipset.

Honor Magic V4

The leak further reveals that the Honor Magic V4 will feature a customized LTPO internal foldable display measuring approximately 8 inches. For security, it will be equipped with a side-mounted fingerprint sensor.

Under the hood, the device will be powered by the Snapdragon 8 Elite chipset. In China, it will compete with the Oppo Find N5, which is expected to feature a 7-core version of the Snapdragon 8 Elite. However, unlike the Find N5, the Magic V4 will likely ship with the standard 8-core version of the chip.

In terms of cameras, the Magic V4 will sport a 50-megapixel flagship-level primary sensor along with a telephoto camera. While it is expected to retain a periscope telephoto lens like its predecessor, the leak suggests that it will not be a flagship-grade.

One of the key areas of improvement for this generation is thickness reduction. The Magic V4 is expected to be thinner than the Magic V3, which had a 9.2mm thickness when folded.

Additionally, the leak hints that Honor is moving swiftly with its launch schedule, with both foldable devices expected to debut around June.

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The post Honor Magic V2 Flip’s first details out, June launch expected appeared first on Gizmochina.