Huawei is ready to release their new flagship smartphone, Hauwei Honor 6 on June 24th. While we;ve ever got the few rumors about those smartphone, is now we have a couple leaked picture of the new smartphone.

Before now, the figure of Huawei Honro 6 is still a mistery, but now the leaked picture is showing the detail of the upcoming Huawei Honor 6 design.

According to the leaked picture, the new Huawei Hoinor 6 will has metal frame, the overal design is look nice with rounder corner design, the phone has similar design with the Samsung Galaxy Core series.

The phone is packs with 5 inch screen size with narrow border, the front panel of the 80% of Huawei Honor 6 front panel is screen, the three standar Android soft button is located below the screen, while the power and volume button is located on the side of the body.

The interesting point, the phone is also comes with fingerprint scanner, the sensor is locaten on the rear body, below the rear camera. This area is also uses for navigate the menu similar with OPPO N1 smartphone.

As we mentioned on our recent article, the phone will be powered by Huawei Hass Kirin 920 octa core 1,3 GHz processor, this is the first smartphone that uses with Kirin 920 chipset. The phone is also has 5 inch screen size with 1080p resolution, coupled with 5 megapixel front-facing camera and 13 megapixel rear facing camera, sports with 3GB of RAM and the phone is ready to hit the market on June 24th, so let’s wait.

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We are now waiting for upcoming Huawei Ascend P7 smartphone, the technology blog AndroidHeadline has been unveiled the leaked picture of Ascend P7 smartphone, the phone is look nice with metal shell body and riunded design.

The upcoming Huawei Ascend P7 will becoming the large screen smartphone. According to rumors, it will be equipped with 5-inch full HD screen, with 2GB of RAM and 16GB of internal storage, equipped with Huawei Hass 910 processor that running at 1.6GHz clock-speed quad-core processor, sports with 8-megapixel front-facing camera and 13 megapixel rear facing camera.

The picture showing the phone with power utton on the side, along with simCard slot and memory card slot in the same side location, the Ascend P7 will support for dual SIM Card and dual standby support and may has unique camera button.

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Huawei has launch their own mobile processor Huawei Hass HiSilicon for their own smart-devices, and now we have the new information that the Huawei has HiSilicon Kirin920 processor.

The new HiSilicon Kirin920 HiSilicon Kirin 920 clocked at 1.8Ghz, which will be a 8 core ARM big.LITTLE based microchip. Its said to be manufactured in 28nm architecture and there are 2 Cortex A15 and A7 quad core processors humming inside this single processor to make it 8 core.This processor will working to handle GSM/WCDMA/TDS/TD-LTE/FDD-LTE five-mode baseband.

And now we also has the information about the Huawei Hass eight-core more detailed information, will be able to determine with a 4-core A7 chipset, that’s the quad-core A7, plus A15 plus big.LITTLE architecture.

The chipset is also support with  Mali 628Mp4 GPU, 28-nanometer process, dual-channel DDR3 memory, supports WQXGA (2,560 x 1,600) resolution and 32 megapixel pixels camera.

The first mobile device that ready to powered by Kirin Kirin920 processor will be available in September, and it’s seems the K3V3 will be ended production and Huawei is focus tho Kirin processor.

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While MediaTek has been starting to producing eight-core (octa-core) chipset, is now Huawei is also working the same octa-core chipset and planning to sports the Chinese OEM in early next year.

According to the source, Huawei is now ready to making the new Octa-core processor for their new Hisilicon K3V3processor which has octa-core capabilities.

Huawei has devised a way for the silicon to auto charge when running at a high temperature, and cools the component as well. This increases the standby time of the device.

This chip in resolving a major breakthrough mobile cooling, in order to allow K3V3 octal core CPU running at high frequencies while maintaining a low temperature, Huawei 2013 Institute Innovative design has been developed the thermal energy into electrical energy charging chip, when the cpu is higher than a certain value, thats automatically start charging the chip, to charge the battery, not only reduces the CPU temperature, but also to extend the phone’s battery life.

Earlier this year, Huawei CEO Richard Yu had said that the company would release an octa-core K3V3 processor, based on ARM’s Cortex A15 architecture, during the second half of this year. The chip will be clocked at 1.8GHz. The Mali GPU comes along for the ride, built using the 28nm process.

We most likely will see the octa-core K3V3 in the sequel to the Huawei Ascend Mate, once the largest screened smartphone in the industry with a 6.3 inch glass.

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