Huawei‘s next generation Kirin 970 chip details first emerged in leaks in January this year revealing some details. The leaks tout that the Kirin 970 chip will be built on a 10nm TSMC process and will come with an octa-core CPU as well as a Cat. 12 LTE band. Now, a fresh leak revealing more details of the Kirin 970 chip has emerged on China’s Weibo.

According to the leak source, the Hisilicon Kirin 970 chip will actually be manufactured using TSMC’s 10nm FinFET process. This is a leak from the previous generation of Kirin 960 which was manufactured on a 16nm manufacturing process. The processor is also listed to integrate an ARM Cortex A73 core which would likely be in an octa-core arrangement. The leakster seems to suggest that the Kirin 970 will be the first to come with the ARM Heimdallr MP GPU. Finally, the device will come with full network support, 5 carrier aggregation support as well as support for most of the global frequency band.

Read More: Kirin 970 10nm Production Said To Be On Time Despite Some Initial Problems

An earlier rumor had also tipped the Kirin 970 as packing an octa-core CPU comprised of four ARM Cortex-A73 cores, and four ARM Cortex-A53 cores. The next-gen flagship chipset is also revealed to have a maximum clock frequency of between 2.8GHz – 3.0GHz. The Kirin 970 will be equipped with Cat. 12 LTE baseband and would come as Huawei’s first chip to use the 10nm process. The chip is also expected to bring upgrades in power consumption, heat control and other aspects.

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Latest report from Taiwan has emerged to allay fears of a delay in the production of 10nm chip on which Huawei’s Kirin 970 will be built. The report also  hints that the Kirin 970 should enter volume production in the first quarter of next year as scheduled.

We had gotten wind earlier on that TSMC is having problems ramping up production of the 10nm chip a situation that could affect Smartphones scheduled to use the new process. Samsung was also reported to have been experiencing similar ramp-up problems with its 10nm process, prompting Qualcomm to revise its roadmap and scale back the new node technology so that only the Snapdragon 835 series would be made with the new chip. Even at that, early birds like the Samsung S8 and Xiaomi Mi 6 billed for release in February are rumored as doubtful for February launch.

Kirin 970 will be built on TSMC’s 10nm process and is detailed to pack an octa-core CPU comprised of four ARM Cortex-A73 cores, and four ARM Cortex-A53 cores. The next gen flagship chipset is also revealed to have a maximum clock frequency of between 2.8GHz – 3.0GHz. In addition, the Kirin 970 will be equipped with Cat. 12 LTE baseband and would come as Huawei’s first chip to use the 10nm process.

TSMC is the world’s largest contract chipmaker that services a very broad range of customers including Apple. The company is also producing the Apple A11 chip that would be inside the iPhone 8 and that also, it says, is right on schedule with volume production expected to begin in the second quarter of 2017.

Read More: Samsung Galaxy S8 & Xiaomi Mi 6 Could Be Delayed Over Chip Supply Shortage

With the Kirin 970 entering production in the first quarter of 2017, is there a possibility that it could be inside the Huawei P10 expected in Q1 next year? We  don’t know about that right now.

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