MediaTek has bet big on 5G and slowly but steadily we are seeing the fruits of its investment in the new generation network technology. Today, MediaTek has announced the Dimensity 1000 5G, its brand new high-end smartphone chipset that will take on the likes of Snapdragon 855 and Kirin 990 5G. In case you are wondering, this is the same MediaTek MT6885Z 5G chipset revealed a few months back. AnTuTu confirms Dimensity 1000 is the MT6889. Today, the Taiwanese chipmaker has revealed its official name and specifications.

MediaTek has made it clear that they mean business with the Dimensity 1000 5G chipset. The processor features four high-end Cortex-A77 based BIG cores clocked at 2.6GHz and four Cortex-A55 power-efficient cores clocked at 2.0GHz. Interestingly, this is a dual cluster arrangement instead of the tri-cluster arrangements that we’ve been seeing on high-end processors like Kirin 990, Snapdragon 855 and even Exynos 990. The new MediaTek chip comes with the new Mali-G77 MP9 GPU, which is the same one found on the Exynos 990 with a couple of cores less.

5G is one of the biggest highlights of the MediaTek Dimensity 1000 chipset. It comes with an integrated Helio M70 5G modem that saves space and is efficient at the same time. It is the world’s fastest throughput SoC with 4.7Gbps downlink and 2.5Gbps uplink speeds and supports both standalone and non-standalone networks (Sa/NSA). It also comes with multi-mode support so it supports all networks from 5G to 2G. Note that the Dimensity 1000 5G is a sub-6GHz chip and does not support the mmWave 5G networks that are used on a wide scale in countries like the U.S.

The new MediaTek 5G chip is also the world’s first SoC to support dual 5G SIMs. So you can use two 5G SIM cards in a phone powered by this processor. Existing 5G chipsets only support 5G in one SIM card slot.

Editor’s Pick: MediaTek announces a partnership with Intel to bring 5G to laptops

MediaTek Dimensity 1000 5G is also AI heavy, all thanks to its 5-core APU. This includes two heavy cores, three medium cores, and one light core. MediaTek claims that this design improves the efficiency of AI-related tasks. For example, simple tasks like facial recognition might use just the light core while power-hungry AI apps such as the camera can use the heavy cores. In terms of performance figures, the new chip boasts of 4.5 TOPS (trillion operations per second).

MediaTek’s new 5G chip comes with a capable 5-core ISP as well. It supports single cameras up to 80MP and dual camera setups featuring a 32MP and 16MP sensors. Another big highlight of this new chip is its support for HDR video. In fact, the Dimensity 1000 5G is the world’s first SoC to support multi-frame HDR video. It is also the first chip to support Google AV1 format up to 4K resolution at 60fps. The chip supports QHD+ displays with a 90Hz refresh rate and FHD+ displays with up to 120Hz refresh rate. The Dimensity 1000 5G supports Wi-Fi 6, BL 5.1, and Voice over New Radio (VoNR).

The first smartphones with Dimensity 1000 5G chipset will launch in Q1 2020 in markets like China & other Asian countries. US & EU will get the new chip powered devices in the second half of 2020.

UP NEXT: MediaTek 5G chip prices have risen by 20% but companies are willing to pay the premium

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It looks like things are going to get even more interesting for 5G in the mobile market. The first half of the year was filled with new 5G flagship smartphone announcements but now, companies are going to focus on two major areas in 5G.

First, releasing an integrated 5G solution for mobile devices and second, getting 5G inside cheaper smartphones. Qualcomm will march ahead in full speed to make this possible as the chipmaker announced today at IFA 2019 that its future mid-range Snapdragon 600 and 700 series chipsets will feature integrated 5G modems.

This is a big deal for not just Qualcomm but for the entire mobile industry. Qualcomm chipsets power a majority of smartphones in the world today and if an affordable 5G chip is made available to manufacturers, we could see a tremendous boost in the adoption of this new technology. In fact, Qualcomm has revealed that it is already in talks with at least 12 different smartphone vendors like OPPO, Realme, Vivo, Redmi, Motorola, LG, and HMD Global (Nokia). It’s likely that the two upcoming HMD Global 5G phones will have this 700 series chipset inside.

⇒ READ MORE: 10 Things You Should Know about the Kirin 990 5G

These chips are already being samples and the first 5G integrated Snapdragon 700 series smartphones should roll out by the end of this year. As for smartphones with Snapdragon 600 series featuring 5G support, we’ll have to wait till the second half of 2020.

This announcement comes just hours after Huawei’s first integrated 5G chip, the Kirin 990 5G, was revealed. It is also worth adding that Samsung is already eyeing the mid-range 5G market with its new Exynos 980 chipset that features an integrated 5G modem. And guess what, Vivo is confirmed to use it.

With different types of 5G solutions coming our way in the coming months, it looks like the true 5G revolution has just begun.

UP NEXT: Honor President confirms Honor V30 5G, will run Kirin 990

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Like every year, Huawei announced its new flagship mobile platform, the Kirin 990 at IFA 2019. The new Kirin 990 will power the Huawei Mate 30 series which is going to go official on September 19 and will hit the shelves in October.

Will the new Huawei’s SoC surprise everyone with its high performance and efficiency or will it will lag behind Qualcomm, Samsung and Apple chipsets that will power the upcoming flagships?

The public opinion is already divided, but before building an opinion it is better to gather all the information. And there are a lot of factors influencing it. Here, you will find 10 important things to know about the new HiSilicon Kirin 990, many of which may end up surprising you.

Kirin 990 has an integrated 5G modem

Just like the newly-announced Exynos 980, the Kirin 990 is a chipset which integrates a 5G modem. And it will be the world’s first flagship chipset with an integrated 5G modem to hit the market. Until now, we have seen mobile processors with an external 5G modem in the shelves. To be accurate, Kirin 990 will come in two variants: one with 5G support which will include a Balong 5000 modem, and one LTE-only model. The 5G variant supports sub-6 GHz 5G networks on SA and NSA architectures and it will obviously be included in the most expensive versions of the upcoming Huawei’s flagships. The LTE-only variant should end up in less expensive flagships from the brand.

Kirin 990 is built with the best production process

Huawei’s Kirin 990 mobile platform is built at 7 nm+ with the most advanced production process out there: TSMC’s 7FF+ with EUV. Note that only the 5G version of the chip is built with this production process, while the 4G variant is built at 7 nm just like the old Kirin 980. An advanced production process allows chipsets to be compact, efficient and powerful. And that is exactly the case of the Kirin 990.

Thanks to this advanced manufacturing process, Kirin 990 5G is the world’s first chipset with more than 10.3 billion transistors, while the 4G version has about 8 billion transistors which is still a huge amount.

Kirin 990 should be better than Qualcomm Snapdragon 855

According to both Huawei and the first benchmarks, Kirin 990 will be slightly better than Qualcomm’s flagship option of this year: the Snapdragon 855. During the launch event at IFA 2019, Huawei showed the Geekbench results of both the chipsets and highlighted that Kirin 990 has 10 percent better single-core performance than Snapdragon 855 and 9 percent better multi-core performance. Huawei also claims that it has a 12 percent better big-core efficiency, 35 percent better middle-core efficiency, and 15 percent better little-core efficiency. Note that these terms indicate the three clusters which the Kirin 990 includes.

The 5G variant of the chipset has an octa-core architecture composed of 2x Cortex-A76 CPUs running at 2.86 GHz (big-cores), 2x Cortex-A76 (middle) clocked at 2.36 GHz and 4x Cortex-A55 (little) running at 1.95 GHz. The clock frequency of the middle and little cores is slightly lower for the 4G version of the SoC (2.09 and 1.86 GHz respectively).

World’s first chipset with ISP 5.0 (BM3D) for DSLR-quality noise reduction

If there is one feature which has been Huawei’s focus in the past few years, that’s photography. The Kirin 990 is able to provide DSLR-quality image noise reduction through a new filtering algorithm called BM3D (Block Match 3D) which significantly improves its noise reduction capability in images.

Support for 8K video recording

Kirin 990 even supports 8K video recording at 30 fps with HDR.  And it is able to improve noise reduction even in videos. The Kirin 990’s NPU is able to cooperate with the ISP in order to provide a better image quality on all levels, with tons of revolutionary features and technologies. That is why you will see a lot of improvements in photography and videography.

Same GPU as 980 but better graphics performance

Kirin 990 includes a Mali G76 MP16 GPU clocked at 700 MHz: it is the same GPU as the Kirin 980, yet it provides better performance because it integrates 16 cores: 6 more cores compared to the 10 cores found on the Kirin 980. Both the 4G and the 5G version will have this architecture for the GPU. While the Mali G76 has a slightly lower frequency, Huawei believes a wider GPU will improve the chipset performance even if the frequency and the voltage are lower.

⇒ Read More: Huawei’s Global Product Manager says HarmonyOS is coming to watches, laptops

A separate Kirin A1 co-processor for less intensive tasks

In order to improve the Kirin 990, Huawei has adopted a co-processor called Kirin A1 for Bluetooth, audio decoding and applications which do not require a lot of power. Thanks to this additional unit, the load on the chipset is reduced and the overall performance is indirectly improved.

Quad-core NPU for AI with DaVinci architecture

If we compare the Kirin 990 with its predecessor, the biggest difference we’ll notice is the NPU (Neural Processing Unit). An element which is often ignored by the average user, but is very important in everyday application. Huawei has used the new DaVinci architecture for the NPU of the Kirin 990, which was first seen on Kirin 810 launched earlier this year. The ‘Big’ Da Vinci cores support both INT8 and FP16 quantization of networks which offers better power solutions to ML inference problems. Further, Huawei has added a Tiny Core NPU that is a smaller and very power-efficient version of Da Vinci architecture connected over the AXI bus. It has lower performance but it can process a lot of tasks to save energy.

Kirin 990 is coming soon on Huawei Mate 30

As we said earlier in this article, Kirin 990 will be the world’s first chipset with an integrated 5G modem to hit the market. Indeed, it will debut in less than two weeks on the Huawei Mate 30 series. The new flagship line-up will be officially unveiled on September 19 and it will start hitting the shelves in October.

⇒ Read More: Huawei unveils Freebuds 3 with a new design and a Kirin A1 chip

There will be more affordable Honor smartphones with the chipset

If you are a Huawei fan you know that the company usually releases more affordable devices with its flagship chipsets, after its most important flagship phones. Usually, the first affordable high-end devices to come with Huawei’s flagship chipsets are released by its sub-brand Honor.

We know for sure that Honor’s first 5G flagship, the Honor V30 5G will feature this Kirin 990 5G. We won’t be surprised to see more smartphones with this chipset in the coming months.

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In recent years, Huawei’s Hisilicon has managed to make chips that go head to head with Qualcomm’s Snapdragon and Samsung’s Exynos flagship series. However, this year, the company aims to take lead in the chipmaking industry by launching two new SoCs in the market. In addition to the Kirin 985 that’s expected to launch alongside the new Mate 30 series, Huawei is said to release an integrated 5G chipset later in the year.

Nikkei Asian Review reports that Kirin 985 will adopt the new-generation EUV technology, making it one of the most advanced mobile processors in the industry. Followed by its release, the company is said to release its new mobile chipset with an integrated 5G modem sometime around October-December of 2019. If true, Huawei is likely to beat Qualcomm in releasing the world’s first integrated 5G chipset in the market. Qualcomm’s 5G integrated chip is said to release only in the first half of 2020.

The new 5G integrated mobile chipset could likely be featured in the special 5G edition of the Mate 30 series that will launch by the end of the year. Nikkei adds that Huawei has set an aggressive internal goal of selling 10 million 5G smartphones by the end of the year. A majority of these sales should be driven by its first 5G smartphone, the Mate 20 X 5G which is already selling in Europe and will go on sale in August in China. It is worth adding that Huawei had certified four 5G smartphones in China earlier this month. In comparison, other manufacturers have just one commercial 5G smartphone under their belt. This goes on to show Huawei’s aggressive stand for the 5G market.

Editor’s Pick: Huawei Mate 30 series could ditch periscope camera for large IMX600 sensor

Recently, Huawei executive, He Gang had said that the company decided to price the Mate 20 X 5G aggressively in China because it was hoping for quicker adoption of the new age cellular technology. The company wants more people to start using 5G and the Mate 20 X is a powerful smartphone for anyone to start their journey into the new world of 5G.

Nikkei Asian Review also adds that Huawei is looking to decrease its reliance on US companies in the coming years. It quotes one of its sources saying that the company’s “priority will be to figure out detailed backup plans and imagine a world without American suppliers”. So even if the Trump Administration decides to loosen up its policies with regards to Huawei, the company will still look to reduce its reliance on US companies.

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(Source)

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