As the chip packaging industry gets more advanced, so do the aspirations of Intel. The company aims to make a chip with a trillion transistors by 2030. The chips should double the number of transistors every year in accordance with Moore’s law, which Fairchild Semiconductor and Intel developed. But it got worse over time, and the rate of doubling transistors slowed down to three years.

Well, a big performance upgrade seems on the way for Intel chipsets, as Intel CEO Pat Glesinger confirms that Intel could surpass Moore Law’s pace by 2031. Instead, he talked about pushing the “Super Moore’s Law” concept or “Moore’s Law 2.0” for increased transistor counts. TSMC and Samsung Foundry are going to play an exceptional role in bringing Intel’s new chips built on a 2nm node. Even Qualcomm is switching to TSMC and Samsung Foundry.

Gelsinger said during his talk, “I think we’ve been declaring the death of Moore’s Law for about three to four decades.” And while that might be true, he did admit that “we’re no longer in the golden era of Moore’s Law, it’s much, much harder now, so we’re probably doubling effectively closer to every three years now, so we’ve definitely seen a slowing.”

Following the advancements, Intel could achieve the magic number of 1 trillion transistors on a chip by 2030. This is not the first time that some Intel officials have mentioned such a big development. Even Ann Kelleher, who is executive vice president and general manager at Interl’s Technology Development, revealed, “As Moore’s Law has been progressing, traditional scaling has been slowing down.”

There are a couple of different technologies that could help Intel achieve a trillion-dollar mark on a chip. The company aims to do advanced packaging and heterogeneous integration to pack more transistors into a chip. Additionally, the company plans to use the RibbonFET that Samsung uses for 3nm production. It covers all four sides, which reduces current leakage. There is another way via PowerVIA Power Delivery, which moves the power supply lines to the rear of the chip, improving performance.

However, the advancements would cost Intel a lot. Talking about the same, Gelsinger said, “Seven or eight years ago a modern fab would have cost about $10 billion,” he said. “Now, it costs about $20 billion, so you’ve seen a distinct change in the economics.”

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Xiaomi‘s Mijia brand has launched another innovative smart product, this time it is the 90 Minutes Ultra Smart running shoes. The Smart running shoes or sports foot wear comes with a built-in Intel Curie chip which is very small in size, about the size of a button but enough to store vital fitness data in real time.

The footwear is developed in China by the Shanghai Runmi Technology Co. Ltd and is said to be designed for professional athletes. It uses a foam-like material on the body which cushions the effect of the runner is suppose to feel when his or her foot hit the ground. The sole of the shoes also has a design with arch support balance sheet, anti-skid wear and other design. The Smart sports footwear also comes with air cushion and an antibacterial removable insole.

Perhaps the most important feature on the footwear is the ability of the intelligent Intel chip to detect movement and store data such as distance covered, speed, calories lost etc. The chip can detect when the user of the sports shoes is running, walking or climbing. The chip can stay up to 60 days without need for a charge.

The Xiaomi 90 Minutes Ultra Smart sports footwear comes in black and surf blue color options designed specifically for the male folks and black and pink for the females. There is a blue special edition with luminous material that makes the runner visible to motorist and other road users at night. 

The Smart wearable comes with a 299 Yuan ($43) price tag and is already up for funding on Mi Home. The smart footwear would ship on 15th of April.

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