Huawei Kirin 990 5G is the current flagship chipset in the market which is powering the high-end smartphones coming from Huawei and Honor. Now, the company is working on its successor and some key details about the upcoming chipsets have surfaced online.

A new leak from the investment plan of TSMC (Taiwan Semiconductor Manufacturing Company) confirms that the upcoming flagship chipset from Huawei is named Kirin 1000. It is also revealed that the chipset will be manufactured by TSMC using its 5nm process.

It is said that this flagship processor will be powering the Huawei Mate 40 series of smartphones which are set to get launched in the second half of this year. While the exact launch date is not yet known, the phones are expected to go official in September.

Further, it has also been leaked that the next year’s flagship chipset is named Kirin 1100 and is expected to be based on 5NM+ technology, which is an improved version of the 5NM. There’s no certainty about the launch plans for Huawei HiSilicon Kirin 1100 but it should be launched along with Mate 50 series next year.

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The Huawei Kirin 1000 will feature ARM Cortex-A77 cores instead of the Cortex-A76 cores present in the Kirin 990. The A77 brings a 20 percent improvement in performance and with the switch to a smaller node size, that improvement in performance should be higher. The company had began trial production of this processor last year.

Last month, the Chinese giant launched Huawei Kirin 985 chipset which is positioned between the flagship Kirin 990 and mid-range Kirin 820 chipset, and will be aimed at device priced under 3000 Yuan.

It comes with an integrated 5G modem alongside the new Mali-G77 GPU. It has dual-core NPU which has been specifically designed for improvements on “processing power, communication capabilities, thermal and structural design.” The processor has reportedly crossed the 380,000 mark on AnTuTu benchmark ratings.

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