The past few days have seen chip manufacturers announce new processors. Starting with Mediatek announcing the Helio P15, to Qualcomm launching the Snapdragon 653, 626, and 427 chipsets, and Huawei announcing the Kirin 960 earlier today. Our focus is however on the Huawei Kirin 960. Huawei has released a detailed specification list of the new processor.

The Huawei Kirin 960 SoC is an octa-core processor made up of four A73 chips clocked at 2.4GHz and four A53 low-power chips clocked at 1.8GHz for its CPU. Its GPU is a Mali G-71 MP8 which offers about 180 percent increase in performance over the Kirin 950 and a 20% reduction in power consumption. It also supports Vulkan 1.0.  The new chip is built on 16nm FinFET Plus process and supports UFS 2.1 storage and LPDDR4 RAM.

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For connectivity, it comes with Cat. 12 and Cat. 13 modems offering download speeds of up to 600mbps and upload speeds of up to 150mbps. Huawei has also added CDMA support. Radio frequency is between 330MHz and 3.8GHz allowing for a wide range of band support. The Huawei Kirin 960 chip also adds VoLTE and VoWiFi call support.

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A new image of Huawei’s upcoming Mate 9 has been leaked online, revealing a different camera setup from what was previously leaked.

This new image shows a dual camera setup with a single piece of glass covering both lens. The phone’s LED flash is also circular unlike the first leaked image. Another difference is the lack of laser focus which was present on the previously leaked image. The only feature common to both images is the position of the fingerprint scanner.

The leak also says the Mate 9 may likely launch with Huawei’s Kirin 960 processor. The Kirin 960 is an octa-core chip that uses the big.LITTLE architecture which will be made up of 4 Cortex A-73 cores and 4 Cortex A-53 cores. The Kirin 960 will have LTE Cat. 12 and support CDMA networks, making it the second kirin chip other than the Kirin 650 to have full network support. Its GPU will be the latest Mali-G71.

Other details mentioned says the Mate 9 will feature a 6” 2K display, 4GB of RAM, and 64GB of built-in storage. It is said to launch with EMUI 5.0 which is based on Android 7.0 Nougat.

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There is still no news on the pixels of the cameras and how they’ll work. We also have no idea of how much it will cost but the leak says date of launch may be October.

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Huawei has come a long way as a smartphone chipmaker. The company’s new Kirin 950 and 955 chipsets are good enough to compete with MediaTek’s top end flagship SoCs. Naturally, we could expect the upcoming Kirin 960 chipset to be even more powerful and today, we have got some details about the chip from the noted analyst from China, Pan Jiutang.

He reveals today that Kirin 960 may not be a huge upgrade as compared to the current generation Kirin 955, but still there are some things that are going to change like the Cores inside. Huawei will reportedly stick with TSMC’s 16nm process for the Kirin 960, but the high-end Cortex A72 cores inside will be replaced by its successor, Artemis cores. So, the Kirin 960 will be a combination of Artemis cores and Cortex A53 cores in an octa-core architecture.

In terms of GPU, the company is said to upgrade to an octa-core one, much-needed upgrade from the current quad-core Mali-T880 MP4 GPU found in the Kirin 950. Finally, the chip is said to come with support for Cat. 12 LTE networks and CDMA networks, becoming the first true full netcom chip from the company. These specs would also make the most powerful chip from the company till date!

It is still early to know whether this information will turn out to be true, but the analyst is usually right with his predictions. We can expect official details sometime in the second half of the year.

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