Huawei‘s Hisilicon Kirin 970 next-generation chip has been the subject of a couple of rumours concerning the configuration, production and release. The chip is said to utilise the TSCM 10nm manufacturing process and was said to have experienced some problems in the 10nm wafers production that could have slowed down its arrival time but that was averted. Since then, it has been one rumour or the other about the configuration with no authentic word on the release time frame. 

Well-known industry analyst Pan Jiutang has now released some more details of the next-gen Huawei chip, stating that the chip would be come with enhanced GPU, apparently over that of Kirin 960 SoC.The Kirin 960 chip uses a Mali-G71 MP8 which when compared to rival Qualcomm Snapdragon 835 and Samsung Exynos 8895, the Kirin 960 in the GPU performance is slightly behind. Thus, there is the need for some enhancements in order to be on par with the latest flagship chips around.

The analyst also affirmed that it would be built on a 10nm process and also stated that Huawei will begin mass production of smartphones which would use the next-gen chip. He didn’t state the smartphone but he was likely referring to the Huawei Mate 10 which is widely acclaimed as the model that would use the new chip in line with recent Huawei tradition. The Huawei Mate 10 is expected to be released sometime in the second quarter of the year.

Read More: Fresh Kirin 970 & Snapdragon 845 Details & Launch Dates Leaked

Earlier rumours further tip the Kirin 970 to pack an octa-core CPU comprised of four ARM Cortex-A73 cores, and four ARM Cortex-A53 cores. There are talks of higher Cortex-A75 cores onboard the SoC. The next-gen flagship chipset is also revealed to have a maximum clock frequency of between 2.8GHz – 3.0GHz. In addition, the Kirin 970 will be equipped with Cat. 12 LTE baseband and would come as Huawei’s first chip to use the 10nm process.

(source)

The post Kirin 970 Details Revealed: Q3 Release, Enhanced GPU, Debut on Mate 10 appeared first on Gizmochina.

Smartphone chip makers are always on the move, improving their chipset with more powerful offering and reduced size in the face of demands for smartphones that consume less power and are are capable of seamlessly fast performance. Huawei recently released the Kirin 960 flagship processor that benchmark tests have shown to be superior in performance to its present contemporaries, yet the company is rumored to be working on a Kirin 970 chipset.

According to latest media reports in Taiwan, the next generation Kirin 970 will be Huawei’s first to be built on the TSMC 10nm process. The Kirin 970 is said to likely still be on an octa-core architecture but will integrate a baseband with support for Cat. 12 global LTE. The present Kirin 960 chip is composed of a quad-core Cortex-A73 chip, another quad-core Cortex-A53 chip and an octa-core Mali-G71 GPU. The Kirin 960 was however built on TSMC 16nm process and it comes with a wonderful CPU performance but the GPU cannot perform at full capacity.  So a switch to the 10nm process is said to greatly reduce the heat and allow full extraction of the GPU performance.

Read More: Full Details of Huawei Kirin 960 System-on-Chip

In building the Kirin 970 on the 10nm process, Huawei is following the trend, catching up with would-be early starters like Qualcomm which just announced the Snapdragon 835 processor built on Samsung’s 10nm manufacturing process and to debut in the first quarter of next year on the Galaxy S8. MediaTek is also out with its Helio X30 chip built on TSMC 10nm process and to debut in the first quarter of next year also. MediaTek is also billed to release an Helio X35 chip within the first half of 2017 which would upgrade to provide Cat. 12 LTE band support.

The post Huawei Kirin 970 Rumored to Feature TSCM 10nm Process, Cat. 12 LTE Support appeared first on Gizmochina.