Its been more than a month since LeEco announced the world’s first Snapdragon 820 powered smartphone, Le Max Pro. However, until now, the company has not yet revealed when the phone will go on sale. We all have been waiting to hear the news, and the new teaser from the company did come as a relief to some extent. The new teaser is probably for the international launch of the Le Max PRo and the subsequent release of the device.

However, if you can’t wait for the official announcement, here’s some interesting rumor. Now, it is being said that the Le Max Pro could be made available for sale globally on February 23, a day before the Xiaomi Mi 5 officially launches.

The rumor comes via the famous leakster from China, Upleaks. Apparently, he had revealed a set of numbers on his weibo page yesterday: “223,120,036,991,000”. At that time, it didn’t make any sense. However, thanks to one weibo user, it looks like these numbers actually make a lot of sense.

So, these numbers could mean that the Le Max Pro will go on sale on 2/23 i.e. February 23 at 12:00 PM, for a price tag of 3699 Yuan ($567) and only 1000 limited units will be made available for sale on that day. While we are not entirely sure whether this will turn out to be true, since LeEco is yet to make these details official, it would actually make sense for LeEco to make the phone available for purchase a day before Mi 5 releases. It would then beat Xiaomi not only by becoming the first manufacturer to announce a SD820 device but also the first maker to release the device in the market.

The phone features powerful specs, including a 6.33-inch 2K display, 4GB RAM, 21MP rear camera, SD820, ultrasonic fingerprint sensor, USB Type-C and 3400mAh battery. For these specs, would you be ready to shell out $567?

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We have been hearing for months that LeTV will release the first Snapdragon 820 powered smartphone. And these rumors were bang on target as Qualcomm and LeTV announced the first Snapdragon 820 powered smartphone in the world, the LeTV Le Max Pro earlier today. We already know a lot about the device, thanks to the previous leaks, but now, we have some official details to add to it.

One thing to note here is that, despite the announcement this early, neither LeTV nor Qualcomm has revealed when the phone is going to be released. The only thing we know right now is that the phone will be available for purchase sometime in the first half of 2016. That’s a pretty vague time frame, so we will have to wait for more availability details.

Even in the specs department, there are many details that are yet to be announced. But what we know is that the phone will also be the first commercial handset to feature Qualcomm’s Ultrasonic Fingerprint Sensor called as Sense ID. Once again, the feature was rumored to debut with the Le Max Pro, so no surprises here. Qualcomm explains that the new Sense ID is much more reliable and secure than existing capacitive based fingerprint sensors. The main highlight of Sense ID is the use of an ultrasonic scanner to create extremely detailed 3D fingerprint maps. Plus, it works even under plastic, metal and other materials. This is why the sensor on the Le Max Pro works although it’s located under 400 micrometers of metal.

Another highlighted feature of the Le Max Pro is the support for the latest Wi-Fi 802.11 ad standard which is much faster than previous generations, since it adds a new frequency band, 60GHz. The phone is also officially confirmed to feature fast 4G LTE and Qualcomm’s Quick Charge 2.0. From what we can see, the phone looks the same as its predecessor, the Le Max featuring an all metal body.

As for the other specs, we will probably get to know more at the CES event. According to rumors, the phone features a 6.3-inch 2K display with 4GB LPDDR4 RAM, 64GB storage, 21MP rear camera, and 3400mAh battery. AnTuTu performance is said to be impressive, scoring nearly 130K in the test.

Hopefully, we will get more information about the handset in the next couple of days. Stay tuned for more details.

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