We are set to see yet another Qualcomm’s latest Snapdragon 821 powered smartphone in September, if words of industry’s analyst Pan Jiutang is anything to go by. The renowned analyst has hinted that the LeEco Le 2s Pro with Snapdragon 821 chipset will be launched on September 6. Already, Apple’s iPhone 7 and 7 Plus flagships have got a September 7 release, so the flagship LeEco may likely be released just in time to take on the iPhone 7.  Don’t forget also that LeEco is planning to enter the US market this fall, so a September 6 release date sounds logical and strategic.

According to Pan Jiutang, the LeEco Le 2s Pro with Snapdragon 821 processor would be available not only in China but also in other countries, perhaps the US as well. The leading industry analyst also gave the specs of the device to include that it would rock an all-metal body with a 5.5-inch JDI display having 1080 pixel resolution. Also, there’s a 4GB RAM and 32GB of internal storage as well as a fingerprint sensor on the back.

Read More: LeEco Le 2s Pro Scores High on Antutu, Confirms Snapdragon 821 Processor

Furthermore, Mr. Jiutang also revealed that the Le 2s Pro flagship would likely carry a 2,000 Yuan ($300) price tag. The analyst also disclosed that the Xiaomi Mi 5s will likely be released in mid to late September and also that other smartphone makers like Huawei would release new smartphones this September.

The post LeEco Le 2s Pro Will Likely Launch on September 6 With SD821 Chipset: Analyst appeared first on Gizmochina.

The upcoming LeEco Le 2s smartphone has again featured in a new leak online. This time around the leaked images were those of the back cover of the device in pure black.

The leaked images shows the Le 2s in all black design said to be made of metal all round. The back casing also shows the openings for the main camera sensor fused with that for the LED flash sitting and there is another opening for the fingerprint sensor which would be located just underneath the rear camera.

The LeEco Le 2S was earlier rumored to feature a loop antenna design, with a render of the device sporting same getting exposed on XDA Forum. Even in an all black coating, the antenna band is still very visible running across the bottom edge of the back casing just as seen on the XDA Forum leak.

Related: LeEco Exec hints at a large yet thin battery on the LeEco Le 2s

LeEco’s next flagship, spotted on GFXBench with model number X720 is rumored to have a September 7th launch date. If that turns out to be true, it would put to rest the stunning rumors we have been getting regarding the device sporting a monstrous 8GB RAM and having a version with Qualcomm’s latest yet-to-be-featured Snapdragon 821 chipset. We wouldn’t know the entire truth until the device pops.

The post All black LeEco Le 2s Back Cover leaks, confirms looped antenna design appeared first on Gizmochina.