The MediaTek Dimensity 9000 chip will cost nearly twice its predecessor – the MediaTek Dimensity 1200 – and devices equipped with it will hence likely be pricier than usual. However, it will still be cheaper than Qualcomm’s upcoming Snapdragon 8 Gen1 processor, expected to be announced this week during Tech Summit.

The info comes from industry insider Digital Chat Station who has also revealed that the Dimensity 9000 will begin shipping from Q1 2022. It will be joined by the Dimensity 7000 upper-mid-range chip not long after, which is expected to put an end to the dominance of the Snapdragon 870 chip in the market.

The Dimensity 9000 chip will be MediaTek’s new flagship when it goes live and will be superseding the Dimensity 1200 from this year. It will be built on the 4nm fabrication process, which should improve performance while also being more power-efficient. The new sub-6GHz 5G chipset is the first in the smartphone world to use a Cortex-X2 core clocked at up to 3.05Ghz and is the world’s-first smartphone chip to include Bluetooth 5.3.

There’s a 1+3+4 setup for the cores, with a single Cortex-X2 “ultra core” joined by a cluster of 3X Cortex-A710 “super cores” clocked at up to 2.85Ghz. The two are complemented by a cluster of 4 efficiency Cortex A510 cores clocked at 1.8Ghz. The chipset supports LPDDR5x RAM speeds of up to 7500Mbps and has 14MB of cache.

The Dimensity 9000 is expected to arrive on the market in February and the upcoming Redmi K50 series may be one of the first to feature it.

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Xiaomi is all set to announce its new devices at a launch event tomorrow in China. The company will be launching the Mi MIX 4, Mi Pad 5, a stylus, next-generation OLED Smart TV, a high-end smart speaker, and more.

With all these devices in the pipeline, there’s another device the Chinese company is gearing up to launch. Xiaomi is preparing to launch a new model under its current-generation Mi 11 series flagship lineup, dubbed Xiaomi Mi 11T.

Ahead of its official launch, the Mi 11T smartphone has been certified in Indonesia. The phone, which carries model number 21081111RG, is said to come powered by the MediaTek Dimensity processor.

However, at this time, the exact model of the chipset is not known. Given that it’s a flagship-grade smartphone, we expect the device to come powered by the MediaTek Dimensity 1200 SoC.

It’s noteworthy that this will be the first smartphone from Xiaomi in the Mi 11 lineup to come packed with a MediaTek chipset. All the devices launched so far in this series come powered by the Qualcomm Snapdragon processor.

Similar to its predecessor, this upcoming smartphone is expected to come in two different models — Mi 11T and Mi 11T Pro. Recently, the tipster Digital Chat Station claimed that the Mi 11T and Mi 11T Pro will feature a 120Hz OLED display instead of the 144Hz LCD screen found in the Mi 10T series.

As of now, there’s not much known about these new upcoming smartphones but we expect the devices to get launched in the coming weeks. The company is also working on Mi 11 Lite NE model for the Indian market.

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• Xiaomi’s upcoming Smart Speaker teased to offer concert hall-like experience
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• Samsung continues lead of the global TV market in the first half of 2021 while TCL dethrones Xiaomi in China

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MediaTek has a pretty successful lineup of 5G chipsets under its Dimensity lineup. The Dimensity 1200 is the top-end offering for the Taiwanese company and now it will become visibly different from each other, thanks to the new Dimensity 5G Open Resource Architecture launched by the company.

At the virtual event of the Mobile World Congress, MediaTek announced this new platform which provides brands with more flexibility to customize key 5G mobile device features to address different market segments.

It gives smartphone brands closer-to-metal access to customize features for cameras, displays, graphics, artificial intelligence (AI) processing units (APUs), sensors, and connectivity sub-systems within the Dimensity 1200 chipset.

Usually, the phone makers go through the firmware offered by the chipset provider, and sometimes they don’t even finetune that. Also, MediaTek chipsets are often used by lower-cost manufacturers with smaller development teams, which means that the companies are more likely to just take MediaTek’s default firmware.

The Taiwanese company has said that the devices powered by MediaTek’s Dimensity 5G Open Resource Architecture customized chipsets will hit the global market in July 2021.

Recently, MediaTek became the number-one global chipset provider by volume, thanks to its demand for low-end phones. Leading the segment in the presence of Qualcomm, Samsung, and Huawei is a tough job and with the launch of this new initiative, the company is showing that it is ready for the high-end segment.

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Xiaomi has confirmed that the company is all set to launch a new smartphone in the Redmi K40 lineup which will be a gaming-centric device. Ahead of the launch of the Redmi K40 Game Enhanced Edition on 27th April in China, more details keep surfacing online.

The company recently confirmed in a teaser poster that the phone will come powered by the MediaTek Dimensity 1200 chipset. The processor is made using the 6nm node and packs one Cortex A78 core running at 3GHz, three Cortex A78 cores at 2.6GHz, and four Cortex-A55 cores at 2GHz.

In another teaser, Redmi has revealed the AnTuTu score of this upcoming smartphone, shedding light on the performance. It claims that the device has scored 724,495 points in AnTuTu benchmarking. This means that on paper, the device is more powerful than the Snapdragon 870-powered OnePlus 9R and Vivo X60 Pro.

So far, it has been revealed that the Redmi K40 Game Enhanced Edition will come with a 120Hz or 144Hz refresh rate that also supports a 300Hz touch sampling rate. The device is also said to have pop-up shoulder triggers. The display will likely have a 6.67-inch AMOLED Full HD+ screen with a resolution of 2400 x 1080 pixels.

The phone is expected to feature a 64-megapixel primary Sony IMX686 camera sensor on the backside. It is likely to be running MIUI 12.5 custom skin out-of-the-box, based on the Android 11 operating system.

There are also reports indicating that the company could also launch the Redmi K40 Game “Standard Edition” along with the Enhanced Edition. To know for sure, we will have to wait for the official launch event next week.

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HONOR X series of smartphones used to compete with the Redmi Note series. But unfortunately, with the Huawei ban, last year’s HONOR X10 did not make it to the global markets. Now, as we are approaching the anniversary of its launch, details about its successor HONOR X20 have started popping up.

According to a leakster (@馬然熊猫) on Weibo, the upcoming HONOR X20 will be powered by a MediaTek Dimensity 1200 SoC. This piece of information comes from the same person who recently tipped the key specs of the vivo X70 series and the alleged vivo NEX 5.

Unfortunately, he did not say anything else about this forthcoming handset. According to a previous report, the HONOR X20 will be a mid-range phone like its predecessors.

For those unaware, last year, HONOR made changes to the X series branding. The number in the name is now preceded by X. Also, the HONOR X10, which is still being sold in China is the first device in the series with 5G connectivity.  

The highlights of this handset include a pop-up selfie camera like its forerunner HONOR 9X, HiSilcion Kirin 820 SoC, 9 5G bands, and a 40MP Sony IMX600y RYYB sensor.

If the upcoming HONOR X20 is indeed powered by a MediaTek Dimensity 1200 chipset, then it could be one of the cheapest phones with this SoC. It will likely compete with the recently launched realme GT Neo and the upcoming Redmi gaming smartphone.

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• HONOR NTN certified by FCC as a 4G smartphone without carrier aggregation

(Via)

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Realme recently launched its flagship smartphone Realme GT 5G in China a few weeks ago and now the company is gearing up to launch a new variant of the same. Xu Qi, Vice President of Realme and President of Global Marketing for the company has revealed more details about the upcoming smartphone.

Xu Qi has confirmed that the Realme GT Neo smartphone will be officially launched by the company on 31st March. He also adds that the device will bring a brand new design. Further, it has also been confirmed that the phone will be powered by the MediaTek Dimensity 1200 chipset.

The poster shared by the company reveals that the upcoming smartphone will come with a rectangular camera module on the back, with the words “DARE TO LEAP” on the shell.

The MediaTek Dimensity 1200 SoC is a 6nm chipset that includes Cortex-A78 prime core working at 3.0GHz, three Cortex-A78 cores clocking at 2.6GHz, and quad Cortex-A55 cores ticking at 2GHz, along with Mali-G77 MC9 graphics.

Recently, a Realme smartphone with model number RMX3116 appeared on TENAA which features a 6.55-inch display. The phone will be powered by dual 2,200mAh batteries and come with support for 65W fast charging. It is also said that the phone will be running the Android 11 operating system out-of-the-box.

For those who are unaware, the Realme GT features a 6.43-inch AMOLED punch-hole display that offers a Full HD+ resolution and a 120Hz refresh rate. It is equipped with the Snapdragon 888 chipset, LPPDR5 RAM, UFS 3.1 storage, and a 4,500mAh battery with 65W fast charging support. It has a front camera of 16-megapixel and the rear camera module has a 64-megapixel Sony IMX682 main camera, a 13-megapixel ultrawide lens, and a 2-megapixel macro lens.

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MediaTek has finally announced not one but two Dimensity 5G chipsets. These are the successors to the last year’s Dimensity 1000+ chipset. They feature the updated ARM Cortex-A78 core and are built on the newer TSMC’s 6nm process.

MediaTek announced two new chipsets- Dimensity 1100 and Dimensity 1200 5G. These smartphone chipsets are built on the TSMC’s 6nm compared to 7nm on Dimensity 1000+. Also, you get the boosted clock speed of up to 3GHz on the Dimensity 1200. MediaTek says that the chipsets feature updated AI, Camera, Connectivity, and GPU capabilities.

Dimensity 1100- CPU, GPU, Memory Specs

• Process– TSMC 6nm
• CPU cores– ARM Cortex-A
  • 4x Cortex-A78 Power cores clocked up to 2.6GHz.
  • 4x Cortex-A55 Efficiency cores clocked up to 2.0GHz.
• GPU: ARM Mali G77 MC9 nine-core GPU
• Memory–
  • RAM–  4xLPDDR4x at 2133MHz
  • Storage– 2-lane UFS 3.1

Dimensity 1200- CPU, GPU, Memory Specs

• Process– TSMC 6nm
• CPU– ARM Cortex-A
  • 1x Ultra-Core Cortex-A78 clocked up to 3.0GHz
  • 3x Cortex-A78 Super Cores clocked up to 2.6GHz
  • 4x Cortex-A55 power-efficiency cores clocked up to  2.0GHz
• GPU– ARM Mali G77 MC9 nine-core GPU
• Memory
  • RAM–  4xLPDDR4x at 2133MHz
  • Storage– 2-lane UFS 3.1

Both the chipsets have common features like MediaTek APU 3.0 for AI computing(APU on 1200 chipset has 10% more performance), MediaTek HyperEngine 3.0 gaming tech support, 5G call and data concurrency, multi-touch boost, ray tracing in games and AR apps, and super hotspot power savings.

EDITOR’S PICK: MediaTek announces large bonuses for employees after seeing a bump in sales

Important Features of Dimensity 1100, 1200 5G chipsets 

• Connectivity– Both the Dimensity 1100 and 1200 have an integrated 5G modem inside. They also have the company’s special UltraSave tech to tackle huge power constraints of 5G. Additionally, the chipsets support SA/NSA 5G(sub-6GHz, 5G+5G Dual-SIM), 2CC carrier aggregation across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS).
  • It must be noted that Dimensity 1200 chipset has got  TÜV Rheinland certification for its 5G performance covering 72 real-world scenarios.
  • Other connectivity features include the latest Wi-Fi 6, GNSS L1+L5(navigation), Bluetooth 5.2,
• Camera Features– Out of the two, MediaTek says that Dimensity 1200 supports up to 200MP single camera. You also get the five-core HDR-ISP(Image Signal Processor) with 4K HDR video capture support. The Dimensity 1100, on the other hand only has up to 108MP single camera support.
  • Both the chipsets have common features like 32MP+16MP dual camera support.
  • This, coupled with improved AI performance means, you get AI-Panorama Night Shot, Multi-Person Bokeh, noise reduction, HDR camera features.
• Display, Audio & Video playback support- The Dimensity 1100 and 1200 supports up to QHD display at 90Hz refresh rate. However, for FHD+, the D1200 has up to 168Hz whereas the D1100 is limited to a 144Hz refresh rate.
  • For video playback, they support HDR10+, hardware-accelerated AV1 encoding.
  • For Audio, you get ultra-low latency true wireless stereo audio, LC3 encoding for High-quality Audio, Lower latency streaming for TWS earbuds(power-efficiency).

OEM Adoption

MediaTek says that OEMs like Xiaomi, Vivo, OPPO and realme, showed support for including the new chipsets in their devices by end of Q1 2021.

Among these, Redmi and realme have already confirmed that the devices powering Dimensity 1200 chipset will hit markets very soon and Redmi’s device is expected to be the company’s first Gaming phone while realme could include it on realme X9 Pro.

UP NEXT: Realme X9 image reveals slim design, may lack 3.5mm audio jack

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