MediaTek Dimensity 8100 Archives - Gizmochina

Realme GT Neo 3 Naruto Edition officially launched in China

Anurag — Thu, 26 May 2022 06:36:19 +0000

Realme GT Neo 3 Naruto edition has just been launched in China and it looks pretty awesome. As the name suggests, the smartphone has been designed in collaboration with the popular Anime & Manga series “Naruto”. The specifications of the smartphone are the same as the Vanilla Realme GT Neo 3 launched last month but the design is fresh and interesting.

The GT Neo 3 Naruto edition sports design elements that match the appearance of the popular Anime Character “Naruto Shippuden”. The smartphone comes in orange color with a black partition matching the iconic jumpsuit of Naruto. The handset has a large camera island with a metallic grey hue that stretches the entire width. Next to the camera sensor, there’s a leaf symbol that represents Konohagakure (Naruto’s Village) along with the realme x Naruto branding right below it.

But wait, we haven’t talked about the coolest part yet! The Realme GT Neo 3 Naruto edition comes with a Naruto Scroll bag. The bag resembles the Sage Scroll that Naruto carries around. The Naruto Scroll bag can even be opened, however, we are unsure whether it can be used as a small duffle bag for carrying things or it’s just for show.

In addition, the smartphone’s accessories including the power adaptor, Charging cable and sim ejector tool also come with a Naruto inspired design. The smartphone will likely have Naruto inspired theme, which means the app icons and wallpaper will give you all Naruto vibes.

Realme GT Neo 3 Naruto edition Features

The specifications of the smartphone are the same as the Realme GT Neo 3. It sports a 6.7-inch full-HD+ display with a 120Hz refresh rate, a 1,000Hz touch sampling rate, and HDR10+ and DC dimming support. The handset is powered by a MediaTek Dimensity 8100 5G SoC, paired with up to 12GB of LPDDR5 RAM.

The smartphone comes with a dedicated display processor to enhance picture smoothness and is claimed to lower power consumption. It also features stainless-steel vapor cooling technology for heat dissipation.

For photos and videos, the smartphone features a triple camera setup on the rear, with a 50-megapixel Sony IMX 766 sensor (with OIS, 4K, night mode, and more) paired with an 8-megapixel ultra-wide-angle lens and 2-megapixel macro sensor. On the front, there is a 16-megapixel snapper for selfies and video calls.

The device is fueled by a 4500mAh battery and supports 150W UltraDart fast charging technology (150W model) making it one of the world’s fastest charging phones. You can check the detailed specs of the smartphone here

Realme GT Neo 3 Naruto edition Price and availability

Realme GT Neo 3 Naruto edition has been launched in a single 12GB+ 256GB variant and comes at a special price of 2799 Yuan which roughly converts to $415. The smartphone’s pre-sale starts today at 16:00 CST and its first sale will commence on May 31.

OPPO K10 series with Dimensity 8000 chips tipped to release this month

Zohaib Ahmed — Sat, 02 Apr 2022 10:34:21 +0000

OPPO had announced back with the launch of the MediaTek Dimensity 8000 series that the OPPO K10 series will be the first to be equipped with the Dimensity 8000 chip. Today, prominent leakster Digital Chat Station revealed that the upcoming phone lineup will be released this month, sometime after April 5th.

The OPPO K10 series first made an internet appearance early last month and its 3C certification showed that it will support up to 80W fast charging, which is currently both OPPO and OnePlus’s flagship configuration. Accordingly, the K10 series is expected to be an upper-mid-ranger.

It is speculated that there will be two models in the OPPO K10 series, namely the K10 and the K10 Pro. The K10 will be equipped with the Dimensity 8000, while the K10 Pro will be powered by the more powerful Dimensity 8100.

The Dimensity 8000 series uses TSMC’s 5nm manufacturing process and has an octa-core setup including four A78s and four A55s, with the GPU being a six-core Mali-G610.

A MediaTek official had earlier claimed that the Dimensity 8000 series chips are positioned to be nearly flagship-level but are easier on the battery compared to actual flagship chips. Benchmark-wise, the performance of the Dimensity 8000 series is at the same level as the Snapdragon 888, although it does appear to be more power-efficient.

Realme GT Neo3 teaser confirms Dimensity 8100 processor and independent display chip

Jeet — Fri, 18 Mar 2022 03:37:32 +0000

Realme has been teasing some of the key features of the upcoming Realme GT Neo3 flagship smartphone ahead of the phone’s official launch in its home market China next week on 22nd March.

In the latest teaser poster shared by Xu Qi, Vice President of Realme, President of Realme China, and President of Marketing for the company, it has been confirmed that the upcoming Realme GT Neo3 is powered by the MediaTek Dimensity 8100 SoC.

The Dimensity 8100 processor will be coupled with LPDDR5 RAM and UFS 3.1 internal storage. Along with that, it has also been confirmed that the smartphone will pack an independent display chip for better performance and lower power consumption.

Based on the information available so far, the Realme GT Neo3 smartphone will feature a 6.7-inch AMOLED display with Full HD+ screen resolution and a punch-hole cutout for housing the front-facing camera.

The phone will have a triple-camera setup on the back panel that will consist of a 50-megapixel Sony IMX766 primary sensor, an 8-megapixel ultra-wide-angle lens, and a 2-megapixel macro sensor. On the front side, the device will have a 16-megapixel snapper for taking selfies and video calling.

It will be running the Android 12 operating system out-of-the-box with the company’s own Realme UI on top. The phone will be powered by a 4,500mAh battery and is touted to be the world’s first to come with 150W light-speed fast charging technology. Realme says that the device goes from 0% to 50% in just 5 minutes.

OnePlus PGKM10 is the upcoming Dimensity 8100 powered handset

Pranav Sawant — Sat, 12 Mar 2022 12:42:58 +0000

A mysterious OnePlus smartphone with model number PGKM10 appeared on China’s 3C certification site revealing its fast charging capabilities. However, we couldn’t figure out which device the model number belonged to. Now, the tipster DigitalChatStation has revealed that this device is none other than the previously rumored OnePlus Dimensity 8100 phone.

The tipster says that the Oppo PGKM10 or the OnePlus Dimensity 8100 device, which despite having a 160W max charging speed, will support 150W charging technology. The smartphone is further reported to have a 4,500mAh battery that is said to go from 0% to 100% in 15 minutes.

Furthermore, the smartphone is said to go official next month. If we go by this, then we might see this device’s teasers in the coming days. Soon later, the company could officially announce the release date of the smartphone.

Other than this, we all know that the OnePlus PGKM10 will be powered by the Dimensity 8100 SoC. Leaks reveal that the smartphone will sport a 6.7-inch OLED display and feature a 50MP primary lens. The lens equipped on the phone will be the popular Sony IMX766 sensor.

In related news, we are expected to see the first Dimensity 8100-powered phone from Realme this month. The smartphone will be the successor to the GT Neo2 and will be called the Realme GT Neo3. Just like the OnePlus phone, the Neo3 will also support a 150W UltraDart fast charging support. 120Hz screen, in-display fingerprint scanner, and 12GB/256GB storage are some of its rumored specs.

Snapdragon 8 Gen 1 now gets beaten by Dimensity 8100 on Geekbench, as if Dimensity 9000 wasn’t enough

Zohaib Ahmed — Sat, 05 Mar 2022 10:25:01 +0000

The Samsung-manufactured Snapdragon 8 Gen 1 is having a tough time keeping up its most prominent rival, MediaTek, which has lately been acing it with its latest TSMC-produced Dimensity chips. Early benchmark scores of the Dimensity 9000 were found to be higher than that of the Snapdragon 8 Gen 1, and as if that wasn’t enough, the Qualcomm flagship has now apparently been beaten by the Dimensity 8100 as well.

Tipster Digital Chat Station today shared Geekbench results of the Dimensity 8100, Snapdragon 8 Gen 1, and the Snapdragon 888, where the MediaTek chip easily beat the other two on the multi-core test. Devices used were all from realme, with the RMX3562 being the upcoming realme GT NEO3.

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But the D9000 ranked last in the single-core test due to the presence of a super-powerful Cortex-X1 core on both the Qualcomm chips.

Regardless, it’s still remarkable to see a chip that isn’t even MediaTek’s best for this year beat two flagship processors from Qualcomm. MediaTek’s flagship solution for 2022 is actually the Dimensity 9000 chip, and the Dimensity 8000 series is only aimed at upper-mid-range smartphones. On top of that, the Dimensity 8000 chips use an older 5nm process compared to the cutting-edge 4nm process employed by the Snapdragon 8 Gen 1.

But Qualcomm does have another card up its sleeve. Another flagship processor from the chipmaker has been making rounds lately and judging by its SM8475 model number, it will most likely be an upgraded Snapdragon 8 Gen 1, likely a Plus version. This one will be manufactured using TSMC’s superior 4nm process as opposed to Samsung’s 4nm process used for the first-gen 8 Gen 1. It will thus be interesting to see how well the upgraded version stacks up against rivals.

OnePlus Nord 3 with 150W fast charging, Dimensity 8100 SoC rumored to launch soon

Sudhanshu — Tue, 01 Mar 2022 13:10:16 +0000

Yesterday at MWC 2022, OPPO unveiled their new 150W fast charging tech which the brand stated will first debut on a OnePlus smartphone scheduled to launch in Q2 2022 i.e. between April and June. Now, reports have surfaced hint that this upcoming smartphone is the OnePlus Nord 3.

An AndroidCentral report has revealed that the upcoming OnePlus Nord 3 will come supporting OPPO’s 150W fast charging and will be based on the Realme GT Neo 3. Another report from PriceBaba in collaboration with known tipster Mukul Sharma has revealed that the upcoming OnePlus Nord 3 will launch in the Indian market around the end of May or early June. These reports fall in line with a recent forum post made by OnePlus CEO Pete Lau who stated that “We will debut first on a OnePlus smartphone in the second quarter of 2022.” So we are looking at a possible Q2 end launch for the Nord 3.

OnePlus Nord 2 5G

As far as the charging capabilities are concerned, OPPO revealed at MWC 2022 event that the 150W SuperVOOC charging can completely charge a phone with a 4,500mAh battery in just 15 minutes. In addition, it takes only 5 minutes to charge a 4,500mAh battery from 1 percent to 50 percent. The company also revealed that the tech comes packaged with the OPPO Battery Health Engine which manages the battery optimally resulting in just 20% battery degradation after 1600 charge cycles of 0-100%.

OnePlus Nord 3 specifications (rumored)

Now for the specifications of the Nord 3, an earlier report revealed a mystery OnePlus device which is now believed to be the OnePlus Nord 3. According to the specs leak, it will come with a 6.7-inch Full-HD+ OLED display with a 120Hz refresh rate. The device will likely have a centered positioned punch-hole for the selfie camera.

It could be powered by the MediaTek Dimensity 8100 processor with four Cortex-A78 cores. The chipset will support LDDR5 RAM and UFS 3.1 storage. The rear side of the phone will be equipped with a 50-megapixel Sony IMX766 main camera and will draw power from a 4,500mAh battery. It will have a 150W fast charging support and is likely to boot Android 12 OS.

MediaTek Dimensity 8000, 8100, 1300 chips announced with support for up to 200MP cameras

Zohaib Ahmed — Tue, 01 Mar 2022 11:43:28 +0000

MediaTek today expanded its processor lineup with three new chips — Dimensity 8100, Dimensity 8000, and Dimensity 1300 — and a range of devices powered by the trio will be launched throughout the first and second quarters of 2022.

While the specifications of the Dimensity 8000 and Dimensity 8100 had already been leaked, the Dimensity 1300 comes as a surprise. The chip, which was earlier tipped to be featured on the OnePlus Nord 2T, is built with TSMC’s 6nm process and has an eight-core CPU, including a 3GHz Cortex-A78 super-large core, three Cortex A-78 large cores, and four Cortex A-55 efficiency cores.

In addition, Dimensity 1300 is also equipped with 9-core Mali-G77 GPU, APU 3.0, and HyperEngine 5.0 game engine.

Next up, we got the Dimensity 8000 series comprised of the Dimensity 8000 and Dimensity 8100. The Dimensity 8100 integrates four premium Cortex-A78 cores clocked at 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz. Both chips use Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies for graphics. Up to 200MP cameras and 4K60 HDR10+ videography is also supported.

“MediaTek’s big bet on 5G dramatically expanded its global smartphone SoC volumes in the mid-tier, and the Dimensity 9000 is opening up the flagship market,” said Avi Greengart, President of market advisory firm Techsponential. “With the Dimensity 8000, MediaTek is giving smartphone vendors more options to balance performance and pricing while still offering flagship level gaming and AI capabilities.”

First batch of MediaTek Dimensity 8100 devices tipped, includes mystery Nord model

Zohaib Ahmed — Tue, 01 Mar 2022 07:29:07 +0000

MediaTek Dimensity 8100 is all set to be launched today. The chip that looks to be MediaTek’s answer to Qualcomm’s Snapdragon 888 has already been speculated to be first featured on a Redmi device. But a new tip now has revealed the entire first batch of customers — and they all happen to be from China.

Tipster Yogesh Brar through a tweet today conveyed that Redmi, realme, OnePlus, vivo, and OPPO will comprise the first batch of OEMs to power their phones with the Dimensity 8100.

MediaTek Dimensity 8100 to go public today. Compares to Snapdragon 888, will be used on upper midrangers.

1st batch customers include:
Redmi
Realme
OnePlus
Vivo
OPPO

Expected to be first seen on Redmi k50 Pro, followed by realme GT Neo 3, Vivo X80, OnePlus Nord…

— Yogesh Brar (@heyitsyogesh) March 1, 2022

From these, the first device models will be the Redmi K50 Pro, followed by the realme GT NEO 3, and the vivo X80. There’s even an unspecified OnePlus Nord series model onboard, although Yogesh did say that the model is internally being referred to as “Nord Pro.” But a marketing name is yet to be assigned.

Coming to the chip itself, it’s in the same league as the Snapdragon 888, with scores crossing the 800,000 mark on AnTuTu. It adopts TSMC’s 5nm manufacturing process and comprises 4x 2.85GHz Cortex-A78 cores paired with 4x 2.0GHz Cortex-A55 cores. The CPU is assisted by the Mali-G610 MC6 GPU for graphics and comes with 4MB of L3 cache. Support for LPDDR5 RAM and UFS 3.1 storage is also present.

MediaTek Dimensity 8100 launch date officially announced, chip is in Snapdragon 888’s league

Zohaib Ahmed — Mon, 28 Feb 2022 08:48:03 +0000

MediaTek announced through its official Weibo account that a new Dimensity product will be unveiled tomorrow. While the model was unmentioned, it is most likely the Dimensity 8100 chip that has been the source of much discussion and leaks for the past few weeks.

Further, notable industry insider Digital Chat Station a couple of days back had tipped the processor’s specifications, speculating that it will be making its debut through a Redmi device next month.

From this, it is easy to ascertain that the chip MediaTek is talking about is no other than the Dimensity 8100. The Dimensity 8100 is part of the Taiwanese chipmaker’s Dimensity 8xxx series and will likely also be joined by the Dimensity 8000.

The same tipster had also revealed performance benchmarks of the 8100. With scores passing the 800,000 mark in AnTuTu, the chip sits in last year’s Qualcomm flagship Snapdragon 888’s league comfortably.

Previous reports had shown that the MediaTek Dimensity 8100 adopts TSMC’s 5nm manufacturing process and comprises 4x 2.85GHz Cortex-A78 cores and 4x 2.0GHz Cortex-A55 cores. The CPU is assisted by the Mali-G610 MC6 GPU for graphics and comes with 4MB of L3 cache. Support for LPDDR5 RAM and UFS 3.1 storage is also present.

The first phone expected to use the Dimensity 8100 will be a Redmi – most likely a performance-focused mid-ranger. It will be joined by another offering from realme around the same time, following which the processor will gain wider adoption.

Dimensity 8100 specs leaked, tipped to debut on a Redmi phone in March

Jed John Ikoba — Sat, 26 Feb 2022 02:00:13 +0000

A tipster has provided key specifications of MediaTek’s upcoming Dimensity 8100 chipset and speculates that the chip could debut next month on a Redmi device. The Weibo tipster goes by the identity Digital Chat Station and says the Dimensity 8100 will have four Cortex-A78 cores that could peak at 2.85GHz together with four Cortex-A55 cores running at 2.0GHz.

There are some doubts as to the actual GPU specification between G610 MC5 and G510 MC6. The Dimensity 8100 is built through TSMC’s 5nm manufacturing process with support for both LDDR5 memory and UFS 3.1 storage. Digital Chat Station also provided some performance data of the Dimensity 8100 that indicates that it could square up nicely with Qualcomm’s Snapdragon 888 SoC which debuted last year.

The performance results and the overall specs sheet point to the likelihood that the Dimensity 8100 is a chip for mid-range smartphones but could be on the higher reaches of the segment. Although there are no ways of establishing the authenticity of the leak at this time, the released details attune and follow a similar trajectory with that of the Dimensity 8000 benchmarks which surfaced days back. In addition, it is unclear whether indeed the chip will debut on a Redmi smartphone and the name of the specified smartphone.

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MediaTek Dimensity 8100 chip tipped, will be Dimensity 8000’s faster version

Zohaib Ahmed — Wed, 16 Feb 2022 10:01:09 +0000

MediaTek is all set to launch an iterative update to last year’s Dimensity 8000. Dubbed Dimensity 8100, the chip will support higher frequencies and will debut on March 1st.

The info comes from notable industry insider Digital Chat Station who says that the 8100 is being launched possibly due to its predecessor’s CPU frequencies being on the more “conservative” side. The Dimensity 8000 is comprised of 4x Cortex-A78 (2.75 GHz) and 4x Cortex-A55 (2.0 GHz) CPU cores.

Judging by the naming scheme, the chip is an upper mid-range unit, making such frequencies indeed slow. The Dimensity 9000, for comparison, peaks out at 3.05GHz. And on top of that, the Dimensity 8000 also uses older ARMv8 designs.

While it’s unlikely that the Dimensity 8100 will be bringing any changes design-wise over the 8000, the frequency boosts should result in better performance.

Manufacturers obviously know of this and DCS says that some have even replaced their Dimensity 8000 orders with Dimensity 8100. A new device with the chip is expected to launch as early as March next year, which is around the same time Dimensity 8000 devices were earlier expected to go live. This makes it possible that MediaTek actually means to replace 8000 with 8100 rather than selling them together, but that’s just a theory.

The AnTuTu benchmark score of the MediaTek Dimensity 8000 reached 750,000 points, surpassing that of Qualcomm’s Snapdragon 870, whose score averages at around 700,000 points. The Dimensity 8100 will thus obviously bring in some even more impressive scores.