Xiaomi is expected to announce the Xiaomi Civi 3 selfie-focused smartphone on May 30 in China. The company recently confirmed that it will come equipped with the Dimensity 8200-Ultra chipset. In a new Weibo post, tipster Digital Chat Station has revealed the key specifications of Civi 3.

According to the tipster, the Dimensity 8200-Ultra powered Xiaomi Civi 3 will have two front-facing cameras. It appears that it will have a 32-megapixel primary selfie camera and a 32-megapixel ultra-wide lens. Hence, it appears that the device could be equipped with the same 6.55-inch OLED panel with a pill-shaped cutout and curved edges that was seen on the Xiaomi Civi 2 last year. In all likelihood, the screen will support an FHD+ resolution and a 120Hz refresh rate.

Additionally, it is rumored to feature an OIS-enabled 50-megapixel Sony IMX800 primary camera, promising high-quality photography with enhanced stability and clarity. At present, there is no information available on the auxiliary cameras of the device.

To keep the device running for extended periods, the Civi 3 is speculated to house a 4,500mAh battery, supported by 67W fast charging technology for quick recharging. The handset was recently spotted at the TENAA certification. The listing revealed that the device will arrive with 12 GB of RAM and 512 GB of storage.

The Xiaomi Civi 3 camera details that have leaked reveal that it will be a selfie-focused smartphone. It is expected to rival the forthcoming Reno 10 and Reno 10 Pro, which will feature an autofocus-enabled 32-megapixel. The Civi 3 will also compete with the upcoming Vivo S17 and S17 Pro which are expected to feature an autofocus-enabled 50-megapixel front-facing camera.

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(source)

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MediaTek has been releasing new smartphone chipsets in the past few weeks, and the trend continues for the company as it is now all set to launch yet another smartphone processor in the market — MediaTek Dimensity 8200.

The company has officially confirmed thorugh a teaser poster that the MediaTek Dimensity 8200 SoC will be announced on 1st December. The teaser hints that the chipset will be more focused on energy efficiency.

While the company has not yet confirmed this, iQOO has teased that the iQOO Neo 7 SE will be the first smartphone to come powered by the MediaTek Dimensity 8200 SoC, which is set to go official on 2nd December in the Chinese market.

As for the processor itself, some leaks have claimed that the chipset will come with four Cortex-A78 cores and four Cortex-A55 cores. There will be one A78 core clocked at 3.1GHz, three A78 cores at 3.0GHz, and four efficient cores A55 at 2.0GHz. It will continue to have the Mali-G610 MC6 GPU found on the Dimensity 8100.

The iQOO Neo 7 SE, which is set to be the first device to run Dimensity 8200, is expected to feature a 6.78-inch Full HD+ AMOLED display with a 120Hz screen resolution, a 5,000mAh battery, and 120W fast charging. Apart from iQOO, Redmi is also expected to soon launch a smartphone powered by this new upcoming chipset.

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The post MediaTek Dimensity 8200 SoC confirmed to go official on December 1 appeared first on Gizmochina.

After switching over from Samsung’s 4nm foundry to TSMC’s 4nm semiconductor production foundry, the latest Qualcomm Snapdragon 8+ Gen 1 SoC manufactured on TSMC’s 4nm advanced node process showed significantly better CPU performance, better GPU performance alongside much-improved power efficiency, and thermals compared its peers, the Snapdragon 8 Gen 1, Snapdragon 888+ and Snapdragon 888 SoCs that were manufactured on Samsung’s 4nm and 5nm node process.

Thus, after getting flak and bad press coverage of the overheating and quality control issues for its previous flagship SoCs, Qualcomm did announce that it will be ditching Samsung and moving forward with TSMC only for its flagship SoCs, specifically the Snapdragon 8 series of SoCs. 

And in a recent report by Chinese technology leakster, Digital Chat Station on Weibo, they shared the news that Qualcomm and MediaTek’s upcoming next-generation smartphone SoCs will be manufactured via TSMC’s foundry.

The Weibo post states that there will be 4 upcoming smartphone SoCs that will be manufactured by TSMC, which are respectively the Qualcomm Snapdragon 8 Gen 2, MediaTek Dimensity 9100, the Qualcomm Snapdragon 7 Gen 2, and the MediaTek Dimensity 8200.

According to industry insiders, the development of the Qualcomm Snapdragon 8 Gen 2 is faster than the MediaTek Dimensity 9100 within TSMC, whilst the development of the Qualcomm Snapdragon 7 Gen 2 is faster than the MediaTek Dimensity 8200 within TSMC.

Both the Snapdragon 8 Gen 2 and Dimensity 9100 SoC are said to present in many Android flagships that are to be announced in 2023, while the Snapdragon 7 Gen 2 and MediaTek Dimensity 8200 SoCs will be catered to the mid-range Android market.

The report also states that the Snapdragon 7 Gen 2 is to be an iterative upgrade over the Snapdragon 7 Gen 1, with little to no changes to the core layout nor ISPs, and the major difference would be the switch from Samsung’s 4nm process on the 7 Gen 1, to TSMC’s 4nm process on the 7 Gen 2. And due to the fact that the next-generation Snapdragon 7 is an iterative upgrade, it could be instead called the Snapdragon 7+ Gen 1 instead of the Snapdragon 7 Gen 2.

As for the popularity of the Snapdragon 7 Gen 1, it is only featured on one smartphone in the market, which is the Oppo Reno 8 Pro mid-range smartphone that is exclusive to China. Presumably because of the bad reputation of Qualcomm’s SoCs that are manufactured by Samsung, the Snapdragon 7 Gen 1 isn’t garnering a lot of customers among Android smartphone manufacturers, whilst the Snapdragon 778G and 778G+ which are under TSMC’s 6nm foundry seem to be the more prevalent choice for Android smartphone makers instead.

If you fancy picking up a power-efficient Snapdragon 778G+ smartphone yourself, there are 3 options you should consider: the Honor 70 which was launched in IFA Berlin 2022 last week, the Nothing Phone (1) announced by OnePlus founder Carl Pei, and the Motorola Edge 30 which has stock Android software with minimal bloatware for users.

The Nothing Phone (1) is on sale today starting from only US$499 on Giztop.

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(Source)

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