The ongoing battle between MediaTek and Qualcomm for mobile chipsets has been getting more fierce with each passing year. MediaTek’s Dimensity has often been looked at as a more affordable alternative to Snapdragon SoCs. But in 2025, does this sentiment still hold true? Read on to find out.

Performance

MediaTek’s latest flagship Dimensity 9400 closes the gap in terms of performance with Qualcomm’s premium offering, the Snapdragon 8 Elite. In synthetic benchmarks like GeekBench and AnTuTu, the Dimensity 9400 nearly matches the Snapdragon 8 Elite, promising high end performance. It is no longer just a cheaper alternative, which is why flagship phones like the Oppo Find X8 Pro and Vivo X200 Pro pack this processor.

Snapdragon still maintains an edge in areas like GPU performance with the Adreno series. However, MediaTek isn’t a market leader for no reason. Even in the budget to mid range segments, the brand has managed to dominate with most smartphones packing Dimensity 6000 or 7000 series processors. Even in the premium segment, it packs cutting edge tech and support for AI (Artificial Intelligence).

Gaming

As Dimensity chips have begun matching Snapdragon in performance, MediaTek is growing in popularity among mobile gamers as well. You can find various gaming comparisons between the Snapdragon 8 Elite and Dimensity 9400 online which clearly showcase comparable performance.

Even in the mid range segment, the Dimensity 8400 Ultra is one of the best chipsets for Android devices. To put things into perspective, this chip has managed to outperform the Snapdragon 8s Gen 3, which is a cutdown version of last year’s flagship Snapdragon chip.

MediaTek dominates the chip market

MediaTek dominated the chipset market back in 2024, shipping over 53.0 million units in the first quarter alone. The company held the throne in the market, with Apple and Qualcomm being close behind. Under a certain budget, Dimensity is by far a lot more popular among manufacturers, bringing great value to customers as well.

While Qualcomm is still popular in the ultra high end smartphone category, MediaTek leads in certain regions like India due to its more price-competitive chipsets. So it’s clear that One of MediaTek’s biggest advantages remains its pricing. Dimensity is a popular choice for not only mid range and budget friendly devices but even affordable flagship phones as well.

Conclusion

In 2025, MediaTek’s Dimensity chips have undoubtedly reached a level where they can compete directly with Snapdragon in most areas. For everyday users, it is practically impossible to tell the difference between single digit performance differences. Qualcomm still offers the most powerful mobile chip for Androids, but MediaTek is catching up.

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MediaTek has introduced its latest Dimensity 7350 chipset, designed to offer strong performance for mid-range devices. While it doesn’t deliver high-end power, phones equipped with the Dimensity 7350 are expected to come at a budget-friendly price.

MediaTek Dimensity 7350 features an 8-core setup and is built using TSMC’s 2nd generation 4nm manufacturing process. This chipset includes 2nd Gen Armv9 processors that can reach speeds of up to 3.0 GHz, along with a Mali G610 MC4 GPU for graphics.

The Dimensity 7350’s configuration consists of 2 Cortex-A715 cores and 6 Cortex-A510 cores. For AI tasks, it includes the MediaTek NPU 657. The chipset also features the Imagiq 765 ISP, which supports 14-bit HDR images. It can handle camera sensors up to 200 MP and record 4K videos at 30 FPS. Additionally, it supports both LPDDR5 and LPDDR4x RAM.

As a mid-range processor, the Dimensity 7350 has some limitations. It supports only Full HD+ displays at 144 Hz and uses UFS 3.1 storage. With that being said, you won’t find this chipset in high-end smartphones. For more information, you can visit MediaTek’s official website from the given link.

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MediaTek is rumoured to launch its highly anticipated MediaTek Dimensity 9300 flagship processor this month, just right before the launch of Qualcomm’s Snapdragon 8 Gen 3 on 26 October 2023. And the latest info from a reputable leaker reveals that the CPU clock speeds, structure and GPU of the upcoming MediaTek Dimensity 9300 are much better than we initially expected.

Shared by popular leakster, Digital Chat Station on Chinese social media platform Weibo, the MediaTek Dimensity 9300 is set to be an octa-core CPU processor featuring 8 CPU performance cores, and no CPU efficiency cores, the first of its kind in the Android smartphone space. The CPU core structure seems to be a 1+3+4 structure with 1 ARM Cortex X4 Prime core, 3 ARM Cortex X4 cores, and 4 ARM Cortex A720 cores. 

The peak clock speed of the CPU clock speed is expected to break 3.25 GHz as per the Weibo post stated, and the GPU under the hood is the latest ARM Immortalis G720 MC12 GPU for mobile processors. Digital Chat Station also shared that he has seen the MediaTek Dimensity 9300 surpass the Snapdragon 8 Gen 3 in the Antutu v10 benchmark scores, both in the CPU and GPU departments. As for the power efficiency of the Dimensity 9300, Digital Chat Station mentions that he is keeping his mouth shut on the matter until the official launch of the flagship SoC by MediaTek this month.

The MediaTek Dimensity 9300 was earlier confirmed to be manufactured on TSMC’s famous N4P process, which is a 4 nm process node offering a performance increase and notable power efficiency improvements over the other N5 and N4 processes. In addition, the Dimensity 9300’s Cortex-X4 cores are predicted to offer a 15% performance improvement and a 40% reduction in power consumption. Additionally, the Cortex-A720 cores are expected to achieve a 20% increase in energy efficiency.

What do you think about MediaTek’s upcoming Dimensity 9300? Let us know your thoughts in the comments below.

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(Source)

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The Android smartphone processor market has been largely dominated by two brands throughout its entire history, namely Qualcomm and MediaTek. Qualcomm has its Snapdragon chipsets to power Android smartphones, whereas MediaTek provides Android smartphones with its 5G-powered Dimensity chipsets. The Dimensity lineup has proven to be reasonably reliable over the past 3 years because all MediaTek Dimensity processors were manufactured by TSMC’s power-efficient and industry-leading technology.

However, in 2023, MediaTek decided to silently rebrand its Dimensity SoC lineup, which has led to much confusion as to which MediaTek chipset is better, and which processors are a big mistake.

Well in this article today, we will be dissecting and diving into MediaTek’s new naming scheme to inform our readers about which MediaTek processors are worth your attention and give the most bang for buck money can buy. To simplify matters, we’ve separated all Dimensity processors into 3 tiers (Tier A, Tier B, and Tier C), with Tier C being the worst ranked processors, and Tier A being the best ranked processors.

Tier C: Low-Performance Processors
Starting off with Tier C, there are 11 MediaTek Dimensity processors and they are ranked from worst to best in Table 1 below.

As you can see, all the newly rebranded Dimensity 6000 and 7000 series are ranked within Tier C. This is because Tier C chipsets have a very important characteristic that defines them, an octa-core CPU structure with only 2 Performance Cores and 6 Efficiency Cores. With fewer performance cores, the processors cannot run games at higher graphical settings, or tasks on the device may run at slower speeds. 

Generally, Tier C processors have benchmark scores from around 380k to 550k in Antutu, with one exception being the Dimensity 7200 which has achieved an Antutu score of nearly 740k. The reason could be that the processor is manufactured on TSMC’s newer 4nm process whilst also featuring the newer ARM Cortex A715 performance cores to provide more performance at the same power level as the A78 and A76.

Another interesting thing to note is the Dimensity 6080 (formerly known as the Dimensity 810). The Dimensity 6080 processor can be found in the recently-announced Redmi Note 13 this week, however, the same processor could also be found in the Redmi Note 11 (known globally as the Poco M4 Pro 5G) launched almost two years ago in 2021 back in China market. This means that your brand new 2023 budget Android smartphone could be using a budget processor that is almost 2 years old today, and yet the device is selling at a price which is brand new.

To wrap up, most Tier C processors have generally the same slower performance and do not have a high price-to-performance ratio (with a possible exception to the Dimensity 7200). If possible, look for Android smartphones with Tier B or Tier A processors instead.

Tier B: Upper Mid-Range Processors

Tier B is where the processors are fast and smooth enough for everyday tasks whilst still being able to game comfortably on medium graphical settings in your favourite games. There are 4 MediaTek Dimensity processors in this tier and they are listed from worst to best in Table 2 below.

One defining characteristic of Tier B processors is that they use an octa-core SoC structure, with 4 performance cores and 4 efficiency cores. With a balanced (4+4) setup, the SoC is able to handle high-performance tasks more smoothly, whereas for low-demand tasks, the efficiency cores can step up for lower power draw.

Tier B processors have garnered much praise for balancing their performance with their affordability, as these processors are found in budget flagship smartphones like the OnePlus Nord 2T and Xiaomi 11T. 

Tier A: Flagship Processors

Tier A includes MediaTek’s best processors in the Dimensity lineup, as they not only provide great performance, but great power efficiency as well for the smartphones they’re in!

Tier A includes 5 Dimensity processors, and they are listed below in Table 3.

Despite sporting the same processor structure (4+4) as Tier B processors, Tier A processors have one major advantage, which is that Tier A processors are manufactured on TSMC’s more advanced 5nm and 4nm process nodes. This improvement alone managed to boost performance by up to almost 20% whilst keeping power draw low to ensure that the device doesn’t overheat. The GPUs used by Tier A processors are also much more performant, allowing users to game at high or ultra-high graphical settings, which is unachievable on Tier B and C processors.

Tier A processors can be found in devices such as the affordable Redmi K50i, Poco X4 GT and OnePlus 10R, to the flagships such as the Vivo X90, Redmi K60 Ultra, and the upcoming Xiaomi 13T Pro. 

In conclusion, purchasing a smartphone with a Tier A MediaTek Dimensity processor is the best decision one can make to make their smartphone performance last long-term without much slowdown.

If you would like more content like this on Gizmochina.com about simplifying how to pick the best processor for your smartphone, feel free to let us know in the comments below!

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The post MediaTek Silently Rebranded its Dimensity Processor Lineup in 2023, Here’s How to Pick The Best MediaTek Processors appeared first on Gizmochina.

MediaTek has confirmed that it will be announcing various new technologies and innovations at the MWC 2023 event that will kick off later this month in Barcelona. The major conference will have the company showcase next gen tech and new chips. So here’s what to look forward to.

New MediaTek Dimensity Series

Among the various new announcements, the Dimensity series of 5G enabled mobile chips will likely be one of the highlights. These chips will power next gen smartphones and tablets and will offer upgrades in various aspects over their predecessors. This will likely include improvements in connectivity, multimedia, image processing, AI, and more.

During MWC 2023, the Dimensity 9200 SoC will be the new high end chipset from the company that will be equipped on flagship grade handsets. Apart from this, MediaTek will also unveil the new Dimensity 7000 series at the event. This would power more affordable mid range devices and the lineup would include the Dimensity 7200. Outside of new Dimensity chips, the brand will be revealing the new Helio G36 SoC for mass market gaming phones as well.

Connectivity & Home Products

Among the various new chip announcements, the company will also be unveiling new Filogic chips for improved connectivity on products like mesh routers, smart TVs, streaming devices, smartphones, tablets, laptops and more. The MWC event will also have the company demonstrate a new portfolio of products that feature Wi-Fi 7 standards, as well as the older but still capable 6E and 6 standards as well.

Additionally, the new Genio platform will include new high end, mid range, and budget chipsets that power various smart home products and IoT devices. This includes the likes of smart home appliances and smart TVs. Meanwhile, the Kompanio chipsets will offer high performance and good battery life for Chromebooks across different price points.

Other Technologies

MediaTek will also be showcasing 5G mmWave beam technology that was developed in collaboration with Ericsson. The new announcements will also include 5G UltraSave for mmWave with Keysight 5G Network Emulation Solutions. This new technology optimizes hardware and software design to extend battery life on devices that use 5G networking. There will also be a number of new technologies in the Barcelona event which will start from February 27 to March 2. So stick around for more, as we will be covering the upcoming conference.

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(Via)

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After switching over from Samsung’s 4nm foundry to TSMC’s 4nm semiconductor production foundry, the latest Qualcomm Snapdragon 8+ Gen 1 SoC manufactured on TSMC’s 4nm advanced node process showed significantly better CPU performance, better GPU performance alongside much-improved power efficiency, and thermals compared its peers, the Snapdragon 8 Gen 1, Snapdragon 888+ and Snapdragon 888 SoCs that were manufactured on Samsung’s 4nm and 5nm node process.

Thus, after getting flak and bad press coverage of the overheating and quality control issues for its previous flagship SoCs, Qualcomm did announce that it will be ditching Samsung and moving forward with TSMC only for its flagship SoCs, specifically the Snapdragon 8 series of SoCs. 

And in a recent report by Chinese technology leakster, Digital Chat Station on Weibo, they shared the news that Qualcomm and MediaTek’s upcoming next-generation smartphone SoCs will be manufactured via TSMC’s foundry.

The Weibo post states that there will be 4 upcoming smartphone SoCs that will be manufactured by TSMC, which are respectively the Qualcomm Snapdragon 8 Gen 2, MediaTek Dimensity 9100, the Qualcomm Snapdragon 7 Gen 2, and the MediaTek Dimensity 8200.

According to industry insiders, the development of the Qualcomm Snapdragon 8 Gen 2 is faster than the MediaTek Dimensity 9100 within TSMC, whilst the development of the Qualcomm Snapdragon 7 Gen 2 is faster than the MediaTek Dimensity 8200 within TSMC.

Both the Snapdragon 8 Gen 2 and Dimensity 9100 SoC are said to present in many Android flagships that are to be announced in 2023, while the Snapdragon 7 Gen 2 and MediaTek Dimensity 8200 SoCs will be catered to the mid-range Android market.

The report also states that the Snapdragon 7 Gen 2 is to be an iterative upgrade over the Snapdragon 7 Gen 1, with little to no changes to the core layout nor ISPs, and the major difference would be the switch from Samsung’s 4nm process on the 7 Gen 1, to TSMC’s 4nm process on the 7 Gen 2. And due to the fact that the next-generation Snapdragon 7 is an iterative upgrade, it could be instead called the Snapdragon 7+ Gen 1 instead of the Snapdragon 7 Gen 2.

As for the popularity of the Snapdragon 7 Gen 1, it is only featured on one smartphone in the market, which is the Oppo Reno 8 Pro mid-range smartphone that is exclusive to China. Presumably because of the bad reputation of Qualcomm’s SoCs that are manufactured by Samsung, the Snapdragon 7 Gen 1 isn’t garnering a lot of customers among Android smartphone manufacturers, whilst the Snapdragon 778G and 778G+ which are under TSMC’s 6nm foundry seem to be the more prevalent choice for Android smartphone makers instead.

If you fancy picking up a power-efficient Snapdragon 778G+ smartphone yourself, there are 3 options you should consider: the Honor 70 which was launched in IFA Berlin 2022 last week, the Nothing Phone (1) announced by OnePlus founder Carl Pei, and the Motorola Edge 30 which has stock Android software with minimal bloatware for users.

The Nothing Phone (1) is on sale today starting from only US$499 on Giztop.

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(Source)

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Chipmaker MediaTek has announced a 33% increase in its revenue from January to May this year. This comes after the release of the financial report of the Taiwanese company. Its May 2022 revenue stood at TWD 52.1 billion ($1.75 billion), slightly lower (1%) than its April 2022 revenue. MediaTek’s January-May 2022 revenue stood at TWD 247.4 billion ($8.3 billion), which is a 33% improvement from 2021. MediaTek’s May 2022 revenue also indicates that the company has had three consecutive months of TWD 50 billion ($1.68 billion) sales.

MediaTek has seen a strong sales trajectory for its Dimensity 8000 and Dimensity 9000 chipsets in 2022. Several brands have hopped in on the MediaTek train due to the great capabilities of its flagship chips. Some of the popular brands using Dimensity chips in their premium products include Oppo, Xiaomi, OnePlus, Realme, and Honor. These OEMs have recently released smartphones powered by Dimensity chips.

With its very strong 5-month performance, MediaTek will likely exceed its H1 2022 target. However, it is projected that the strong sales will not continue throughout H2 2022. Revenue is expected to slow down in June due to inflation-induced price adjustments and reduced orders.

The MediaTek Dimensity 9000+ has just been announced. It is seen as a competitor to Qualcomm Snapdragon 8+ Gen 1. It offers better CPU and GPU performance than the Dimensity 9000. The Dimensity 8000 and 9000 series remain powerful chips in their own rights and will continue to drive sales in the short term for MediaTek.

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(source)

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MediaTek’s processor family has 3 brand new additions today – the Dimensity 1050, Dimensity 930, and Helio G99 SoC. We’ve covered the Dimensity 1050 SoC launch here earlier but do not dismiss the Dimensity 930 and Helio G99 processors as well because MediaTek is promising exceptional power efficiency from both chipsets because the company has chosen to manufacture both SoCs on TSMC’s N6 (6nm class) chip fabrication process. 

MediaTek Dimensity 930 5G

The MediaTek Dimensity 930 SoC is the successor to last year’s Dimensity 920 SoC which was found on devices such as the Redmi Note 11 Pro+ and Realme 9 Pro+. The basics of the Dimensity 930 seem to be essentially the same as last year’s offering as the Dimensity 920 features an octa-core setup with 2x ARM Cortex-A78 performance cores that can be clocked up to 2.2GHz, and 6x Arm Cortex-A55 clocked up to 2GHz. 

But what is surprisingly different here is that the Dimensity 920 last year had the same exact setup but with the Cortex-A78 cores clocked in higher at 2.5GHz. So in short, the Dimensity 930 features downclocked performance over its predecessor which could lead to better battery performance in the newer devices sporting this chipset.

But the most eye-opening highlight here is that Dimensity 930 finally supports high-end UFS 3.1 storage and fast LPDDR5 memory, a feature once only reserved for the flagship market has now come to the mid-rangers!

Connectivity-wise, the MediaTek Dimensity 930 supports True Dual 5G SIM (5G SA + 5G SA) giving users consistent 5G speeds, and the opportunity for VoNR to provide the best quality voice and video call experience from both dual SIM connections. Unfortunately, the Dimensity 930 SoC is still stuck on the older WiFi 5 standard and Bluetooth 5.2 standards, which is a shame considering Qualcomm’s Snapdragon 680 already supports Wi-Fi 6.

MediaTek Helio G99 LTE

The MediaTek Helio G99 is the company’s latest SoC built for affordable 4G gaming smartphones. MediaTek has finally switched over from TSMC’s 12nm node foundry over to the newer 6nm node process for the Helio G99 SoC. In turn, the new Helio G99 SoC is able to deliver 30 per cent better power efficiency and battery life for gaming compared to the older 12nm Helio G96 processor.

The fundamental core setup for the Helio G99 has also changed as well. The Helio G99 SoC is now a new octa-core processor that features 2x ARM Cortex-A76 performance cores that can run up to 2.2GHz and 6x ARM Cortex-A55 efficiency cores that run up to 2.0GHz. If this sounds familiar, it is because the octa-setup is the same found on the higher end Dimensity 930!

Connectivity-wise, the Helio G99 unfortunately does not support 5G, instead it features an essential dual 4G SIM support that provides a seamless experience with fast data services from both connections, while VoLTE and ViLTE services provide excellent call and live video experiences with faster call setup and noticeably better quality than standard calling.

The Helio G99 comes with an ARM Mali-G57 MC2 GPU with support for LPDDR4X Memory and UFS 2.2 storage. The SoC also features WiFi 5, Bluetooth 5.2 and support for FHD+ 120Hz displays. 

MediaTek has collaborated with its Android smartphone partners to bring the Dimensity 930 SoC to market as soon as Q2 2022, and the Helio G99 SoC to market as soon as Q3 2022.

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• Get Redmi K50 for as low as $399 on Giztop

(Source 1, Source 2)

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With the recent launches of the Realme GT Neo 3 and Redmi K50 series, it seems that MediaTek is gunning for the top spot among the flagship Android SoC market with its Dimensity 8100, Dimensity 9000 processors.

However, it seems that MediaTek still has one more flagship Dimensity SoC up its sleeve for 2022 Android devices. MediaTek has officially announced its latest addition to the Dimensity flagship family — the MediaTek Dimensity 1300. 

The MediaTek Dimensity 1300 is the official successor to last year’s flagship MediaTek Dimensity 1200 chip as the Dimensity 1300 builds upon the successes that the Dimensity 1200 has achieved last year while providing some minor tweaks and improvements. The MediaTek Dimensity 1300 slots in at a higher price bracket than its Dimensity 800 and 900 series counterparts, and a lower price bracket than its higher-end siblings, the Dimensity 8100 and Dimensity 9000. 

The Dimensity 1300 features an octa-core setup, with 4 Cortex-A78 cores (1 Ultra A78 Core, running up to 3GHz, and 3 A78 Super Cores, up to 2.6GHz) and 4 Cortex-A55 efficiency cores, scaling up to 2GHz. The Dimensity 1300 runs on TSMC’s 6nm process and has support for 64-bit applications. Powering the graphics onboard is the ARM Mali-G77 MC9 CPU which is just as powerful as last year’s Dimensity 1200 GPU.

Moving onto the upgrades, the Dimensity 1300 has an improved ISP over last year as it now supports up to 200MP sensors, and hardware-accelerated AV1 decoding for faster 4K streaming. But that’s not all, the ISP also provide improvements to low-light shots as its artificial intelligence utilises real-time 3-exposure fusion for the best shot. 

Other technical specifications of the MediaTek Dimensity 1300 are also what you expect from a flagship Android SoC: Support for 16GB of 4266Mbps LPDDR4x RAM, UFS 3.1 Support, Support for 2520 x 1080 168Hz displays, and support for 5G on Dual SIMs.

The MediaTek Dimensity 1300 chipset is expected to debut in markets soon in the upcoming OnePlus Nord 2T and Redmi Note 12 series slated to launch in Q2 2022. For more news on the latest Chinese devices, stay tuned to Gizmochina for your daily source of Chinese tech news.

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(Source, Via)

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Samsung flagship-level phones could soon launch equipped with MediaTek processors — something that’s currently limited to the company’s budget Galaxy A series. This means that the share of self-developed Exynos chips in the flagship realm could see a dip.

The first phones to reflect on the move are expected to be the Galaxy S22 Fan Edition, which will likely be released in the second half of this year, followed by the Galaxy S23 series. Not all of the units will be featuring MediaTek chips, though, as only about half of the Galaxy S22 FE and Galaxy S23 phones are expected to use them (via Business Korea).

Samsung has to date relied on a Qualcomm + Exynos combo for its premium smartphone lineup so it isn’t clear what the division will look like if the MediaTek deal goes through. Three variants feel like a stretch but aren’t impossible. Jumping on to the MediaTek bandwagon should also bring in additional benefits such as increased profitability since Qualcomm chips have always been pricier.

MediaTek’s share in the global mobile application processor market stood at 33 percent in Q4 2021, second only to Qualcomm with its 30 percent share, according to a report from Counterpoint.

Meanwhile, Samsung’s Exynos chips only had a 4% share in the same quarter, which isn’t even close to the other two market giants. The company is having a hard time shaking off the impression about Exynos chips running hot and inefficiently, and had to even resort to increasing the share of Qualcomm chips over Exynos ones with the Galaxy S22 series.

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Earlier this week, we had reported on the upcoming Dimensity 2000 series of processors being based on the latest 4nm process node from TSMC. Now, a new report has revealed that the smartphones that sport the latest high end chips from MediaTek will be launching sometime in early 2022.

The news arrives from a Weibo blogger (Via GizChina) that had also previously stated that the 4nm Dimensity 2000 chipset will be manufactured by TSMC. Although, he further he added that the Taiwanese chip making giant has also distributed some samples of the chip to partners for internal testing as well. So, in other words, we can expect the first smartphones that feature the new Dimenisty 2000 series of processors to hit the market in early 2022.

For those unaware, the new Dimensity 2000 will feature the new ARM V9 architecture along with the new Cortex X2 core. As per previous reports, the performance of the new SoC will be comparable to the upcoming flagship Qualcomm Snapdragon 898/895 mobile processor that are also set to launch around the same time. Both new chips are set to feature improvements in performance along with lower power consumption.

While it is unknown what the new smartphones with Dimensity 2000 chips would cost, it is expected to be around 3000 Yuan or roughly 460 US Dollars. This is higher than last year since the new chipset is also said to be more expensive and would cost around 80 US Dollars as per some estimates. Keep in mind this is still just speculation as of right now, so stay tuned for more updates regarding this matter.

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• Mediatek Dimensity 2000 rumored to be based on TSMC’s 4nm node

The post MediaTek Dimensity 2000 smartphones to launch in early 2022: Report appeared first on Gizmochina.

Xiaomi is apparently working on a new 5G enabled smartphone. The device in question carried the model number K16A and was spotted in a certification listing by a known tipster.

The news arrives from @数码闲聊站 who found this yet to be announced device. He even shared a screenshot of this listing which revealed some details regarding this upcoming smartphone. This handset will support up to 33W fast charging and will house a MediaTek Dimensity series 5G chipset. Furthermore, it will sport a display with a high refresh rate and a punch hole selfie camera on the front while the rear features a 50 megapixel primary camera.

As of right now, it is unclear as to which series this new model will belong to and might even be a new device for the company’s budget brand Redmi. Although, that is just speculation at the moment so take this report with a pinch of salt for now. Unfortunately, finer details regarding this device is also unknown for the time being, so stay tuned for more as we will be providing updates when additional information is available regarding this new handset.

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During a recent briefing, Taiwan-based chipset maker MediaTek’s chairman Cai Lixing announced that the company is planning to invest around $3 billion in Research & Development in various fields.

The amount of spend on Research & Development (R&D) allotted for the year 2021 sets a new record for the company. Last year, i.e. in 2020, the company spent about $2.7 billion in research and development related activities.

This new announcement from the company comes on the hills of record revenue figures. MediaTek’s revenue for the previous year exceeded the $10 billion mark as the company reported $10.9 billion. It also noted that the company achieved double-digit growth for each of its product lines.

Further, Cai Lixing also predicts that the 5G smartphone shipments will exceed 500 million units this year, which comes out to be around 2.5 times more than the numbers in 2020. He also adds that among those, around 60 percent will be from the Mainland China region.

Last year, the company’s 5G market share was 40 percent and it is trying everything it can to continue its growth. At a time when the smartphone market witnessed a decline, MediaTek managed to increase its market share.

It became the leading chipset company in China with a 31.7 percent market share. It was followed by Huawei HiSilicon, accounting for a 27.2 percent market while Qualcomm managed to cover a 25.4 percent market share.

While MediaTek’s market share nearly doubled, Huawei HiSilicon and Qualcomm both saw a decline in their market share. The reason behind MediaTek’s growth is said to be the increased demand for budget smartphones.

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MediaTek has finally announced not one but two Dimensity 5G chipsets. These are the successors to the last year’s Dimensity 1000+ chipset. They feature the updated ARM Cortex-A78 core and are built on the newer TSMC’s 6nm process.

MediaTek announced two new chipsets- Dimensity 1100 and Dimensity 1200 5G. These smartphone chipsets are built on the TSMC’s 6nm compared to 7nm on Dimensity 1000+. Also, you get the boosted clock speed of up to 3GHz on the Dimensity 1200. MediaTek says that the chipsets feature updated AI, Camera, Connectivity, and GPU capabilities.

Dimensity 1100- CPU, GPU, Memory Specs

• Process– TSMC 6nm
• CPU cores– ARM Cortex-A
  • 4x Cortex-A78 Power cores clocked up to 2.6GHz.
  • 4x Cortex-A55 Efficiency cores clocked up to 2.0GHz.
• GPU: ARM Mali G77 MC9 nine-core GPU
• Memory–
  • RAM–  4xLPDDR4x at 2133MHz
  • Storage– 2-lane UFS 3.1

Dimensity 1200- CPU, GPU, Memory Specs

• Process– TSMC 6nm
• CPU– ARM Cortex-A
  • 1x Ultra-Core Cortex-A78 clocked up to 3.0GHz
  • 3x Cortex-A78 Super Cores clocked up to 2.6GHz
  • 4x Cortex-A55 power-efficiency cores clocked up to  2.0GHz
• GPU– ARM Mali G77 MC9 nine-core GPU
• Memory
  • RAM–  4xLPDDR4x at 2133MHz
  • Storage– 2-lane UFS 3.1

Both the chipsets have common features like MediaTek APU 3.0 for AI computing(APU on 1200 chipset has 10% more performance), MediaTek HyperEngine 3.0 gaming tech support, 5G call and data concurrency, multi-touch boost, ray tracing in games and AR apps, and super hotspot power savings.

EDITOR’S PICK: MediaTek announces large bonuses for employees after seeing a bump in sales

Important Features of Dimensity 1100, 1200 5G chipsets 

• Connectivity– Both the Dimensity 1100 and 1200 have an integrated 5G modem inside. They also have the company’s special UltraSave tech to tackle huge power constraints of 5G. Additionally, the chipsets support SA/NSA 5G(sub-6GHz, 5G+5G Dual-SIM), 2CC carrier aggregation across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS).
  • It must be noted that Dimensity 1200 chipset has got  TÜV Rheinland certification for its 5G performance covering 72 real-world scenarios.
  • Other connectivity features include the latest Wi-Fi 6, GNSS L1+L5(navigation), Bluetooth 5.2,
• Camera Features– Out of the two, MediaTek says that Dimensity 1200 supports up to 200MP single camera. You also get the five-core HDR-ISP(Image Signal Processor) with 4K HDR video capture support. The Dimensity 1100, on the other hand only has up to 108MP single camera support.
  • Both the chipsets have common features like 32MP+16MP dual camera support.
  • This, coupled with improved AI performance means, you get AI-Panorama Night Shot, Multi-Person Bokeh, noise reduction, HDR camera features.
• Display, Audio & Video playback support- The Dimensity 1100 and 1200 supports up to QHD display at 90Hz refresh rate. However, for FHD+, the D1200 has up to 168Hz whereas the D1100 is limited to a 144Hz refresh rate.
  • For video playback, they support HDR10+, hardware-accelerated AV1 encoding.
  • For Audio, you get ultra-low latency true wireless stereo audio, LC3 encoding for High-quality Audio, Lower latency streaming for TWS earbuds(power-efficiency).

OEM Adoption

MediaTek says that OEMs like Xiaomi, Vivo, OPPO and realme, showed support for including the new chipsets in their devices by end of Q1 2021.

Among these, Redmi and realme have already confirmed that the devices powering Dimensity 1200 chipset will hit markets very soon and Redmi’s device is expected to be the company’s first Gaming phone while realme could include it on realme X9 Pro.

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A few days back, MediaTek scheduled an event for January 20 to unveil its latest flagship mobile chipset. This silicon is expected to be the 6nm Dimensity series SoC, which the company teased back in November 2020. Now, ahead of its official announcement, Redmi’s GM has confirmed a smartphone powered by this chip.

Recently, Lu Weibing, the General Manager of Redmi, confirmed the arrival of the Redmi K40 series powered by Qualcomm Snapdragon 888. Listing some key specs, he also revealed that the brand’s latest flagship smartphone series will debut in February.

Earlier today, he surprised his followers on Weibo by confirming another high-end Redmi smartphone powered by the upcoming 6nm MediaTek Dimensity SoC. His post notes that Redmi K30 Ultra featuring MediaTek Dimensity 1000+ has now reached its end of life. Therefore, a new device featuring the latest Dimensity chip will replace it in 2021.

Since he does not mention the specific time period for the launch of this handset, we believe it may only debut in the second half of the year just like the Redmi K30 Ultra. Hence, it is safe to assume that the upcoming Redmi K40 and Redmi K40 Pro will be powered by a Qualcomm Snapdragon 700 series chip and Snapdragon 888 SoC.

Anyway, there’s still a chance for a third device featuring this new MediaTek chip in the Redmi K40 series that is set to launch next month.

That said, according to a leak, the forthcoming flagship Dimensity chip will bear the model number MT6893. It will be an octa-core processor built on a 6nm fabrication process. Its CPU will consist of 1 x ARM Cortex-A78 clocked at 3.0GHz, 3 x ARM Cortex-A78 clocked at 2.6GHz, and 4 x ARM Cortex-A55 clocked at 2.0GHz. As for GPU, it will come with ARM Mali-G77 MC9.

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MediaTek, one of the most popular mobile chipmaker, has confirmed that it is hosting a launch event on 20th January where a new chipset under its Dimensity lineup will be announced. The company has set the theme of “Sensation” for the event where it will unveil new products with superior technology and upgraded experiences.

This seems to be in line with the previous leak from ‘Digital Chat Station’ that MediTek is likely to launch a new chipset, MT689x in mid-January, which will be the company’s first chipset to be manufactured using a 6nm process.

As per the reports, there are two new Dimensity chipsets coming, manufactured using 5nm or 6nm process. One of them is MT6893 which uses ARM Cortex-A78 core and the main core has the highest frequency of 3.0GHz.

EDITOR’S PICK: Redmi K40 series confirmed to launch in February, key specifications and pricing details revealed

It could come with Mali G77 GPU for graphics processing. Reports also indicate that the upcoming MediaTek chipset will have the same design configuration as the Samsung Exynos 1080, which powers the newly launched Vivo X60 lineup.

For those who are unaware, the MediaTek Dimensity series of smartphone processors come with support for 5G communication technology. So far, the company has launched a few models in this lineup, ranging from budget to premium mid-range offerings.

Thanks to the booming sales, MediaTek became the third-largest customer of chip manufacturer TSMC. Recently, the company was also named as the leading vendor for smartphone chipsets in Q3 2020, dethroning Qualcomm.

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