Both Qualcomm and MediaTek are gearing up for the launch of their next gen high end mobile processors. While we had recently reported that the new Snapdragon 800 series chip will be based on the 4nm Samsung process, a new report has suggested that the upcoming Dimensity 2000 series processor will also use a 4nm node, but from TSMC.

The news arrives from Weibo tipster @肥威 who stated that the upcoming next generation flagship Dimensity 5G SoC will be quite power efficient since it will be based on TSMC’s latest 4nm process node. He further added that the specifications of this chip will be notable thanks to its ARM V9 architecture, which will enable it to offer better performance over the previous generation.

On the other hand, we had also reported on a new rumor Known tipster Digital Chat Station that stated that the Snapdragon 895 or 898 is expected to be based on the 4nm process from Samsung. The South Korean tech giant will manufacture the base variant while TSMC will reportedly make its Plus variants later on. Although, keep in mind that these are still unconfirmed reports so take it with a pinch of salt for now.

However, MediaTek has been gaining grounds in the smartphone processor market in recent times. It is now a notable contender in multiple segments and through the upcoming chip might seek to better rival Snapdragon processors in the high end market, which has been dominated by Qualcomm. So stay tuned for more, as we will be providing updates when additional information is available.

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MediaTek has today announced two new high-end chips in its MTK series bringing with them some level of upgrades. The two System-on-chips are upgrades of the Helio X2o chip coming in as Helio X23 and X27.

According to MediaTek’s official website, the Helio X23 and X27 comes with  upgrades in thier overall performance, video shooting quality and low power consumption. Both the Helio X23 and X27 chip adopts the deca-core three cluster architecture made up of two 2 ARM Cortex-A72 cores, 4 ARM Cortex-A53 cores and another 4 ARM Cortex -A53 cores. It uses Pilot 3.0 heterogeneous computing technology which brings precision to task scheduling and core allocation and improvement in both processor performance and power consumption.

Thre Helio X27 chip will move to an increasd 2.6GHz frequency when compared with the high-end Helio X25.The GPU is also upgraded to 875MHz. The overall performance is also said to have increased by 20% above the X25. There are also improvements in the web browsing experience and application start-up speed.

 Further, the MediaTek Helio X23 and X27 chips are equipped with an upgraded version of the Imagiq image signal processor (ISP), which not only enhance full-pixel dual-core fast focus (Dual PD) function, but also integrates color (Color) and monochrome (Mono) Depth of field camera functions in order to achieve both quality and functionality during the shooting experience. The Imagiq upgraded version brings along picture clarity, saturation, exposure control, character performance and large aperture effects, etc. and significantly provides a colorful “lens” life for smart phone users.

Read More: Mediatek Announces Helio P15 SoC: To Succeed Helio P10

That’s not all, the MediaTek Helio X23 and X27 are both equipped with Envelope Tracking Module, which can dynamically adjust the output voltage according to the strength of the output signal of the power amplifier, thus greatly improving the efficiency of the power amplifier and reducing the power consumption and Heat. The new chips provide maximum power savings of about 15%. The chips also bring along a reduction in the screen power consumption by about 25%.

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