Meizu can be considered as one of the most innovative Chinese phone makers but fate hasn’t really been fair to the company. It has found it pretty difficult to break away from the shadows of the top OEMs like Huawei, OPPO, Vivo, Xiaomi who control almost the entire market share. Notwithstanding, the firm continues to coast on with plans to release new flagship models – Meizu 16s, 16s Plus and 16T soon. The rumour mills have been agog with leaked details of the upcoming Meizu 16S. Meizu has been the source of most of the details, apart from those that were leaked. Ahead of the official launch, Meizu System engineer has disclosed that the firmware for the flagship model is now ready. 

The system engineer also hinted that he has personally been studying the Mi 9, Vivo iQOO and Huawei Mate 20. As a result, a few changes have been made in some areas that needed to be improved. One improvement we’ll be seeing on the 16s is the DC dimming feature. We may also see an improvement in the camera UI since the device will come with a different camera configuration.

Read Also: Meizu 16s Plus live photos leak: no notch, no punch hole

Meizu CEO Huang Zhang had earlier revealed some of the specs of the 16s to include a Snapdragon 855 chipset. The device is also confirmed to feature a 48MP Sony IMX586 sensor with OIS support. The device will also be coming with a 3600mAh battery and NFC.

(source)

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