Meizu’s CEO Huang Zhang (Jack Wong) has always been very opinionated when it comes to smartphone designs, especially dissing the present trending styles of notch screen, waterdrop and even the in-hole design. The company’s founder has instead insisted the symmetrical design which involves just trimming the bezels with space wide enough to accommodate the selfie camera. That seems to be the design the upcoming Meizu 16s will feature.

A fan recently posted a fan-made render of the Meizu 16s on the Meizu community forum and the render caught the attention of the CEO who indeed confirmed the Meizu 16s design is not very much different from the render. Huang Zhang then threw more light on the efforts the company will make to further trim the bezels on the chin and top aspect of the display. Among other things, he hinted that most phones come with left and right border sizes of 3.5mm. This is smaller than the iPhone X’s which is over 4mm while the chin is 4.7mm. Mot phones have a chin size of more than 6mm as this is the aspect where the antenna is located and also to enable the screen to be fixed firmly to the frame of the phone. However, the Meizu 16s chin may also be over 5.Xmm since the antenna will run through that part for better reception. However, the CEO hinted that the company may decide to extend the antenna to the left and right border which may make them wider. However, Huang Zhang isn’t really up for that design but to make the bezels on the chin the narrowest and then make the upper bezels close to the width of the chin.

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According to earlier details, the Meizu 16s series will be among the first set of models that will use a Snapdragon 855 chipset and the price will certainly be higher than the current models.

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Earlier this year, in August, Meizu launched its flagship devices dubbed Meizu 16 and Meizu 16 Plus. Now, the company seems to be all set to launch another flagship smartphone — Meizu 16S. Just like the name, the phone is also expected to feature the same design as the Meizu 16th.

However, a sketched render of the upcoming smartphone has been leaked online, which showcases the features of the phone. The leaked image shows that the phone will come with an in-display fingerprint sensor. This is not surprising given that the Meizu 16-series already features such sensor.

With more and more smartphone manufacturers trying to offer higher screen-to-body ratio, Meizu has also jumped onto the bandwagon. The render of the Meizu 16S shows the phone having a full-screen display with almost no bezels surrounding it. Surprisingly, there’s no notch of any kind on top of the display.

Coming to the back side, the phone features a triple camera setup with sensors lined-up vertically in the top-center position. Below the camera sensor is the usual Meizu’s iconic ring-shaped LED flash. A previous leak of the phone showcased that it will come with a USB Type-C port at the bottom flanked by a speaker grille and a 3.5mm audio jack.

As for the specifications, the smartphone could be powered by Qualcomm’s upcoming flagship chipset — Snapdragon 8150 which is said to have been manufactured using the 7nm design process. The chipset will be coupled with 8GB of RAM. There’s also a possibility that the Chinese company could add support for wireless charging.

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Pricing information leak related to the Meizu 16S suggests that the phone could be priced around CNY 3,500 in China, which roughly converts to $504. For comparison, the Meizu 16 is priced at 2,698 Yuan (approximately $388) while the 16 Plus costs 3,198 Yuan, roughly $460.

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