Thanks to the numerous leaks, rumors and further coverage of the Redmi Pro and the Xiaomi Notebook, there would hardly be any fans on the internet who are unaware about the July 27 conference from Xiaomi next week. Recently, there has been so much information about these two products that Gizmochina’s majority of the Chinese news coverage have been focused on these two devices.

Just a few minutes back, we reported that Xiaomi Redmi Pro is confirmed to feature Helio X25 deca-core chip and dual cameras. Now, real life images of the Redmi Pro’s metal back have just surfaced online, giving us a better look at the upcoming handset. Like what we saw in the earlier leak, the new images confirm that the phone will come with a brushed metal body. This is definitely a change from the smooth metal finish on previous Redmi models that have been announced by the company.

Since we have seen that there is no fingerprint sensor at the back, it would most likely end up on the front, embedded into the home button. The previous leak had confirmed the presence of dual cameras on the top of the back panel and this one confirms the same design.

RELATED: Redmi Pro Camera Samples Surface: Amazing Bokeh From Dual Cameras

This design looks quite premium thanks to its brushed metal finish and with powerful specs like Helio X25, OLED display, and dual cameras, the Redmi Pro will definitely give other mid-range flagships a run for their money. Considering these specs, the phone will be costlier than existing Redmi handsets. If the rumored 1499 Yuan ($225) price tag turns out to be true, the phone would be one of the best value for money handsets in the market today!

How much are you willing to pay for the Redmi Pro with these specs?

The post Leaked Images Of the Redmi Pro Reveal Brushed Metal Body appeared first on Gizmochina.

An hour back, we revealed that the new Ivvi i3 smartphone with Snapdragon 430 was launched. The phone came with mid-range specs and is quite costly, starting at $355. However, despite its mid-range hardware, the phone comes with a premium metal body that looks quite good. In fact, the phone boasts of 99.2% metal in its body, which means metal lovers are in for a treat.

Apart from the premium metal body, the Ivvi i3 features an arc back, which ensures that you get a good grip on the device. Further, the company has worked with Qualcomm to improve efficiency of the device as well as use a special multi-antenna technology to enable support for all the three major carriers (full netcom) in China.

As for the body itself, the phone is just 6.5mm thin. In fact, at its thinnest point, the phone is just 4.2mm thick, which is pretty impressive. This also makes it thinner than the 6.6mm OPPO R9. Being such a thin device, the camera protrudes a little.

Everything at the back is symmetrical, with the camera sensor, dual tone LED flash and fingerprint sensor placed exactly in the middle. Coming to the front, the phone features on-screen buttons with thin black borders around the screen and camera and other sensors on top.

The phone is powered by the mid-range Snapdragon 430 chipset, making it the first in the market. If you are interested in the specs of the phone, you can read all about it from our launch article here.

Meanwhile, check out the Ivvi i3 in pictures from down below courtesy of Anzhuo.

The post World’s First Snapdragon 430 Smartphone, the Ivvi i3 In Pictures appeared first on Gizmochina.