Tech enthusiasts and laptop users have a whole new reason to be excited as new leaks provide a peek into Intel‘s upcoming developments. Among the highlights are the Lunar Lake processors, poised to enhance battery life in laptops, and a sneak peek at the Raptor Lake Refresh’s new powerhouse, the Core i9-14900KS.

The Lunar Lake processor revealed 8 cores split for efficiency and performance

The Lunar Lake processors, as unveiled by leaks, appear to focus on energy efficiency and performance. A glimpse at a sample processor running on Windows reveals an intriguing setup: eight cores split between performance and efficiency, aiming for a balanced power consumption without sacrificing capability. Interestingly, this early look suggests a departure from conventional designs, with an unconventional cache configuration that might hint at new optimization strategies.

On the other hand, the buzz around the Core i9-14900KS suggests Intel isn’t holding back on performance. Spotted with a potential 6.2GHz peak speed, this CPU could set new benchmarks for high-end computing, although the listed price – potentially higher than its predecessors – has sparked discussions about value and accessibility.

Both these developments signal Intel’s strategy: pushing the envelope on both ends of the spectrum, from power efficiency to peak performance. The Lunar Lake series, with its promise of extending battery life, could be a game-changer for the next generation of thin-and-light laptops, offering a blend of mobility and power. Meanwhile, the Core i9-14900KS represents the pinnacle of desktop CPU performance, catering to gamers and professionals seeking the utmost in computing power. While specifics, including pricing and final specifications, remain speculative, the direction is clear. Intel is gearing up for something big.

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(Via)

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Qualcomm is set to launch its Snapdragon 7 Gen3 chip built on the TSMC 4nm process. However, leaked specifications suggest that it might not outperform its predecessor, the Snapdragon 7+ Gen2.

What to expect from the new mid-range Snapdragon 7 Gen 3

The Snapdragon 7 Gen3 is designed with a 1+3+4 architecture, similar to its predecessor. The CPU part includes 1×2.63GHz big core, 3×2.4GHz, and 4×1.8GHz cores. This configuration is powered by an Arm Cortex-A715 with an integrated Adreno 720 GPU.

In comparison, the Snapdragon 7+ Gen2 features a CPU with 1×2.91GHz big core, 3×2.49GHz, and 4×1.8GHz cores, along with an integrated Adreno 725 GPU. It’s evident that the Snapdragon 7 Gen3’s specifications are slightly downgraded in terms of performance compared to the Snapdragon 7+ Gen2.

The Snapdragon 7+ Gen2 has only been adopted in a few models like the Redmi Note 12 Turbo and the Realme GT Neo5 SE, primarily due to its higher cost. This means that not many consumers have experienced its capabilities.

For the Snapdragon 7 Gen3, Qualcomm seems to have made a strategic decision to focus on efficiency and cost-effectiveness. The chip appears to be positioned as a mid-range processor, rather than a sub-flagship model, making it a more accessible choice for smartphone manufacturers.

Despite its seemingly lower specifications, the Snapdragon 7 Gen3 has the advantage of being built on the advanced TSMC 4nm process. This will likely result in improved energy efficiency and overall performance, even if it doesn’t match the Snapdragon 7+ Gen2 in raw power.

Manufacturers like Xiaomi, vivo, and others in Europe are expected to adopt the Snapdragon 7 Gen3 in their upcoming devices. With its cost-effective approach, this processor could find a broader market reach, making it a pivotal component in the next generation of smartphones.

In conclusion, while the Snapdragon 7 Gen3 may not surpass its predecessor in terms of performance, it’s set to deliver a well-balanced blend of efficiency and cost-effectiveness. It will be interesting to see how it fares against the competition and whether it becomes the chip of choice for mid-range smartphones in the coming year.

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(Source)

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A few weeks ago, Intel officially announced its next-generation Alder Lake processors, kicking off the 12th generation of chips from the company. Now, the company is gearing up to launch the mobile version of the same.

Ahead of the launch, Intel has already started shipping them to laptop manufacturers. It was confirmed by the company through Twitter. This indicates that the official launch or announcement shouldn’t be far away.

Based on the information available so far, the Intel Alder Lake-P series include the lower-end models which are said to feature two Golden Cove performance (P) cores, as well as eight Gracemont efficiency (E) cores.

Some higher-end variants of the mobile CPU will reportedly be powered by six P-cores and eight E-cores. It is also being said that the top-end Intel Alder Lake-P chip will come with 14 cores and 20 threads.

Recently, the upcoming Intel Alder Lake-P Core i7-12700H appeared on benchmark which indicated that it to be faster than 45 percent in multi-core performance than the previous generation. It could also outperform AMD‘s flagship processor by 35 percent.

Another benchmark for the Intel Core i7-12700H showed it comfortably on top against Apple Silicon chips as the test revealed Alder Lake-P could be almost 50 percent faster than the newly launched Apple M1 Max chip. The Cinebench R23 benchmark shows Intel chip outperformed the M1 Max by a whopping 49 percent, scoring an impressive 18,501 points.

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Oppo is working to develop its own high end mobile chipsets for its premium grade flagship smartphones. The move from the company arrives to reduce its reliance on chipmaking firms like Qualcomm and MediaTek.

As of right now, the Chinese tech giant is the world’s fourth largest smartphone brand and is planning on begin shipping its custom made mobile chipsets sometime in the year 2023 or 2024. Earlier this year, the company had confirmed that it was working on its own self developed processors and now sources close to the matter has revealed to Nikkei Asia revealed the possible launch timeline of these upcoming chipsets.

Notably, this marks another Chinese brand joining the race of smartphone makers that are racing to make its own custom SoC (System on chips). At the moment, brands like Apple, Samsung, and Xiaomi are developing their own chips for their processors. Even Google is working on custom made chips with its flagship Pixel 6 series launching with the new Tensor chipsets. The process of developing its own chips would enable Oppo to have better control over its own supply chain and might also help the impacts of the ongoing global shortages of semiconductors.

The sources also revealed that the company is working on 3nm production technology that is being offered by TSMC, the world’s largest contract chipmaker. In other words, TSMC is also receiving another major smartphone brand as its new client, with Apple, Intel, AMD, and Nvidia being some of its other major customers.

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Qualcomm and Samsung are two of the biggest mobile chipmakers and the companies keep advancing their technologies with each new iteration. They have announced their latest 5nm chipsets and devices powered by them are now making their way to the market.

While Qualcomm had announced its latest Snapdragon 888 chipset last month, smartphones powered by the same are now getting launched. Xiaomi Mi 11, the first phone powered by the SD888 went on sale a few days ago and another device, iQOO 7, is all set to go official this week.

On the other hand, the Samsung Exynos 1080 is manufactured using the 5nm process, and the recently launched Vivo X60 series smartphones powered by the same. The company is also working on Exynos 2100.

Samsung is set to launch its next-generation flagship smartphone — Galaxy S21 lineup on 14th January and those phones are expected to come powered by the Exynos 2100 chipset, which is believed to be revealed at the same event.

EDITOR’S PICK: Two foldable Apple iPhone prototypes have passed Foxconn’s durability test

Qualcomm and Samsung are trying their best to capitalize on the hills of Huawei’s absence because of the newly imposed sanctions on the Chinese giant by the United States. Samsung, which so far used to reserve its chipset only for its own smartphones, is now giving it to other mobile makers.

However, in terms of total chipset shipments in the third quarter of 2020, MediaTek emerged as the leading brand with a 31 percent market. Qualcomm and Huawei HiSilicon followed the suite with 29 percent and 12 percent market share. Samsung and Apple came in fourth and fifth with a 12 percent market share each.

UP NEXT: Samsung Display’s OLED sales to reportedly cross $5 billion in Q1 2021

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With half of the year gone by, benchmarking platform AnTuTu has shared a list of top-performing smartphone chipsets for the first half of the year, i.e. H1 2020, in which, Qualcomm has taken the lead position.

To compile this list, the company counts the CPU score and GPU score only and makes an average for the chipset with all the models powered by the same processor.

As said, leading the list is Qualcomm Snapdragon 865 which has scored 401,108 points with a CPU score of 182,123 points and a GPU score of 218,985 points. Notably, this is the only chipset in the list to have scored more than 400,000 points.

EDITOR’S PICK: HarmonyOS could be powering all the future Huawei consumer electronics devices

The second position is grabbed by MediaTek Dimensity 1000+ SoC with an overall score of 341,714. With this, MediaTek makes an entry in this list after many years. It is then followed by Qualcomm Snapdragon 865 Plus chipset with 327,796 points.

The Huawei Kirin 990 and Qualcomm Snapdragon 855 chipset in the fourth and fifth position completes the list of top five chipsets with a score of 307,979 points and 307,662 points respectively.

Other chipsets in the list, making the top-ten chart include Huawei Kirin 990, MediaTek Dimensity 1000L, Huawei HiSilicon Kirin 980, Kirin 985 5G, and MediaTek Dimensity 820.

Although Huawei has a few chipsets in the list, that may not be the case for future listings given that Huawei is now ceasing to make flagship Kirin processors from 15th September, after getting banned by the United States.

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There are very few smartphone makers who can develop their own chipsets. In fact, there are just three such companies — Samsung, Apple, and Huawei. While Xiaomi tried to do the same with Surge S1, the experiment wasn’t a success.

OPPO was earlier reported to be working on its own chipset named OPPO M1. However, instead of being a processor, it turned out to be a co-processor for power optimisation on the company’s own smartphones. But now it seems that OPPO is all set to jump into mobile chipset market.

Reports indicate that Special Assistant to the CEO of OPPO has shared a company-wide internal note to all the employees which reveals “Mariana Plan” for the self-developed chips from the Chinese company.

Last year, in November, OPPO had mentioned “Mariana Plan” in its internal documents. It was noted that the project had received input and support from the OPPO TMG Technical Committee which was setup a month before that.

EDITOR’S PICK: UK-based nanotech company sues Samsung for patent infringement over QLED technology

Chan Yen is leading the OPPO TMG Technical Committee and is also serving as the head of OPPO’s chip platform department. Interestingly, he previously worked as the Technical Director at Qualcomm, the leading mobile chipset manufacturer.

In the recent developments, technician from Realme and OnePlus, sister companies of OPPO have also joined the core plan, hinting that OPPO is going all out with its plan to build its own chipsets.

For the development of its own chipsets, OPPO CEO Chen Yongming had revealed at the Future Technology Conference that the company would be investing about 50 billion yuan in Research & Development in the next three years.

UP NEXT: Realme’s official poster confirms the February 24 Realme X2 Pro 5G online launch

(Via)

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After MediaTek announced Helio G90 and G70 series of chipsets, the company has today announced yet another chipset — MediaTek Helio G80. As the name indicate, this new processor sits between G90 series and G70.

Compared to the previously launched Helio G70, this new Helio G80 comes with a slightly higher CPU and GPU frequency and nothing else seems to have changed. Thus, in short, the new Helio G80 is just a slightly bumped up version of the Helio G70.

The MediaTek Helio G80 is manufactured using a 12nm process, similar to the other entry-level and mid-range chipsets. It comes with two Cortex-A75 cores clocked at 2.0GHz and six Cortex-A55 cores clocked at 1.8GHz.

As for the graphics, the chipset packs Mali-G52 MC2 GPU clocked at 950MHz. It also supports up to 8GB of LPDDR4X RAM clocked at 1800MHz and a bit slower eMMC 5.1 technology instead of UFS.

In terms of optics, this processor is capable of handling a single 48MP camera at 17fps or two 16MP cameras at 30 frames per second. As for the display, it supports Full HD+ resolution at 60fps.

EDITOR’S PICK: Chinese Smartphone Shipments to decline by 30% in Q1 2020 due to Coronavirus: Strategy Analytics

Connectivity options include dual-SIM, dual-4G LTE, dual-VoLTE, VoWiFi, single-band Wi-Fi ac (Wi-Fi 5), Bluetooth v5.0, FM Radio, and GPS with GLONASS, Beidou, and Galileo. For charging, it supports Pump Express technology but the company has not yet revealed the charging wattage.

Compared to the G90 series, the Helio G80 lacks dedicated AI accelerators but the company says that the chip’s ISP is capable of features such as object recognition in Google Lens, Smart Photo Album, scene detection, scene segmentation with background removal, portrait-mode enhancements, and facial recognition.

It also comes with support for features like include Voice on Wakeup (VoW) support, EIS, Rolling Shutter Compensation, and an inertial navigation engine. Further, the MediaTek Helio G80 also comes with support for the company’s own HyperEngine Game Technology.

UP NEXT: Xiaomi Mi 10, Black Shark 3 launch events could be held online due to Coronavirus outbreak

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Master Lu, the Chinese benchmarking platform, has just released the 2019 annual report for the best performing smartphone chipsets. The report arrived earlier today (6th January 2020) and features many of the known industry leaders.

According to Master Lu, Qualcomm with the Snapdragon 855+ SoC is the best performing mobile processor of 2019. Huawei’s Kirin 990 5G chipset arrives second. Notably, MediaTek also made an appearance in the listing with its latest Dimensity 1000L 5G processor.

The Snapdragon 855+ takes the lead with a total score of 348,837 points, comprising a GPU score of 84,994 points and a CPU score of 163,843 points. The Kirin 990 5G chip comes in a close second with a total score of 326,101 points, with 160856 points in the GPU score and 165245 points in the CPU score. Furthermore, the third rank of the list also went to Huawei with the base variant of Kirin 990 with a total score of 324153 points. (GPU score of 160805 points and the CPU score of 163348 points).

Editor’s Pick: Antutu Best Performing Chinese Smartphones of December 2019

Further down the list, familiar names like the base variant Snapdragon 855 SoC, Samsung’s Exynos 9820, and even the previous year Qualcomm flagship, Snapdragon 845 chipset, can be found. Additionally, even MediaTek’s Dimensity 1000L 5G processor makes an appearance alongside the mid range Snapdragon 765G and the Kirin 980 SoC. The fact that a mid range chipset made it to the list shows the level of performance output Qualcomm is being able to deliver on its chips found on more affordable handsets.

Unfortunately, newer processors like the Qualcomm Snapdragon 865 SoC, MediaTek’s upcoming flagship Dimensity 1000 processor and even Samsung’s Exynos 980 chipset are not included in this list. These are the three major mobile processing platforms that will be seen this year (in 2020) and their performance will be benchmarked after official respective launches.

UP NEXT: Huawei Y6s with MediaTek Helio P35 and GMS goes official discreetly

(Via)

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Today, at MediaTek’s Product Communication Conference, the company has announced a new chipset — MediaTek Dimensity 800. This new processor from the company seems to be positioned for the mid-range and upper mid-range smartphones.

It has also been revealed that smartphones powered by this MediaTek Dimensity 800 processor will be making their way to the market in the second quarter of next year, i.e. Q2 2020 and the chipset will be officially launched in Q1 2020.

While the company has unveiled the chipset and teased a timeline for its availability in the market, MediaTek has not yet revealed anything related to the chipset’s technical specifications and features.

The announcement of this new chipset comes week after MediaTek announced its Dimensity 1000 5G chipset, marking the company’s comeback in the high-end segment that will take on the likes of Snapdragon 865 and Kirin 990.

The processor features four high-end Cortex-A77 based BIG cores clocked at 2.6GHz and four Cortex-A55 power-efficient cores clocked at 2.2GHz. It comes with a dual cluster arrangement instead of the tri-cluster arrangements that we’ve been seeing on high-end processors like Kirin 990, Snapdragon 855 and even Exynos 990.

EDITOR’S PICK: MediaTek may supply Samsung with 5G chips for low-end smartphones

The new MediaTek chip comes with the new Mali-G77 MP9 GPU, which is the same one found on the Exynos 990 with a couple of cores less. It comes with an integrated Helio M70 5G modem that saves space and is efficient at the same time and is the world’s fastest throughput SoC with 4.7Gbps downlink and 2.5Gbps uplink speeds and supports both standalone and non-standalone networks (Sa/NSA).

The upcoming Oppo Reno3 smartphone is confirmed to come powered by MediaTek Dimensity 1000L 5G processor, which is also known as MediaTek MT6885. The benchmark result showed the processor has a Mali-G77 GPU. We presume it also has Cortex-A77 CPU cores like the Dimensity 1000 but at a lower clock speed.

The first smartphones with Dimensity 1000 5G chipset will launch in Q1 2020 in markets like China and other Asian countries while USA and EU will get the new chip powered devices in the second half of 2020.

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(Via)

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OPPO is one of the biggest phone companies in the world with a product portfolio that covers all categories. The manufacturer is also a pioneer when it comes to designs and technologies. Now OPPO is taking things a step further by developing its own mobile processor called the OPPO M1.

First reported by LetsGoDigital, OPPO Mobile filed a trademark application on November 20 at the European Union Intellectual Property Office (EUIPO). The trademark description says it is for or related to a mobile processor.

Based on this, OPPO will be joining the likes of Samsung, Huawei, Apple, and Xiaomi whom all have their own mobile processors. It has been reported that OPPO has poached several engineers from Unisoc (Spreadtrum) and MediaTek.

There are no details about the specifications of the OPPO M1 yet but there are speculations we may find out more early next year. LetGoDigital says OPPO may reveal details about the processor at MWC 2020 or at next year’s edition of Semicon China scheduled to hold in March. It is also reported that it may be much later in the year, specifically during Mobile World Congress Shanghai.

OPPO has invested a lot in research and development, so this doesn’t come as a big surprise. However, OPPO’s entry into the chip business will definitely bring big changes to its products. An in-house chip can ensure better communication between its products just as Apple’s products work better with each other.

Earlier this year, we reported that OPPO has plans to make its own smartwatch and smart audio products including headphones. With the news of the development of its own mobile SoC, things are sure to get more interesting in the near future.

UP NEXT: OPPO Reno 3 5G will be the first phone to come with ColorOS 7; launches December

(Sources: 1, 2; Via)

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Huawei flagship smartphones under the company’s P20 series and the most recent P30 series have been appreciated for its camera innovations. The company has managed to offer an incredible camera experience but falls short in the video department.

The major reason behind that is that the company’s Kirin 970 and Kirin 980 chipsets, which powers the P20-series and P30-series smartphones respectively, lacks support for 4K video recording at 60fps. But that is about the change with its upcoming flagship mobile chipset.

Huawei has confirmed that the company’s upcoming mobile processor — HiSilicon Kirin 990, will come with support for 4K 60fps video recording. Since the upcoming Mate 30-series will be powered by the Kirin 990 SoC, you won’t need to choose between a high resolution and a high frame rate with Mate 30 lineup.

Although Huawei’s flagship smartphones lack support for 4K 60fps recording, most of its competitors have been offering this feature for a couple of years now. Apple was the first to add this feature with iPhone 8, 8 Plus, and iPhone X. Later, Qualcomm also added the support with Snapdragon 845 chipset that powers the Samsung Galaxy S9 lineup.

As said, the Huawei HiSilicon Kirin 990 chipset is expected to power the upcoming Huawei Mate 30 and Mate 30 Pro smartphones and are rumored to get launched on 19th September. Further, the company has also confirmed that its foldable smartphone Huawei Mate X and the next year’s P40-series will also be powered by this very same chipset. We expect the premium Honor-branded phones to be powered by Kirin 990 SoC as well.

The Kirin 990 SoC is said to have been manufactured using the 7nm processing node and will come with Balong 5000 5G modem that will offer support for 5G connectivity. Compared to Kirin 980, its successor is expected to consume 10 percent less power and its overall performance may increase by 10 percent. Currently, there’s no information available on the other specs of the Kirin 990 SoC.

(Via)

Up Next: OPPO Reno 2, Reno 2Z and Reno 2F specifications and pricing information leaked ahead of launch later this month

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Taiwan Semiconductor Manufacturing Company (TSMC), the largest contract chipset manufacturer, has revealed in its earnings conference call that the company is expecting that most of its 7nm “N7” process customers/clients will shift to 6nm “N6” process.

It further adds that the upcoming 6nm “N6” node uses the same design rules as the N7 node, which makes it a lot easier for customers to transition to the newer and denser node. If this prediction of the company comes true, then N6 could be on the path towards becoming another widely-utilized, long-serving process node for the company.

Announced last month, the new 6nm process provides a significant enhancement of its industry-leading 7nm technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with migration from N7-based designs.

The technology will leverage the capabilities of extreme ultraviolet (EUV) lithography gained from the N7+ technology. TSMC had recently unveiled its N7+ process which involves the incorporation of EUV on TSMC’s 7nm. The process will be used on Hisilicon Kirin 985 and is said to have entered risk production.

As per the company, the new 6nm process delivers 18% higher logic density over the 7nm process. The engineering resources needed to push this new process out to customers are also very limited, thus it will be a cost-effective upgrade. The benefits range from improvement in AI, consumer applications, networking, 5G infrastructure, GPU, and high-performance computing.

Read More: TSMC has reportedly started working on a new 5nm infrastructure for the Apple A14 chipset

TSMC’s partners have adopted both N7 and N7+ processes and the company is expecting the two technologies to contribute over 25 percent of its wafer revenue in 2019. Meanwhile, TSMC projects that most of its customers who use N7 today will migrate to N6 and then to N5 skipping the N7+.

(Via)

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As expected, during the Snapdragon Tech Summit 2018, US-based chipset manufacturer has announced its latest flagship mobile chipset — Qualcomm Snapdragon 855. The Snapdragon 855, which is the successor of the current-generation Snapdragon 845, comes with support for 5G connectivity and a few other features, aimed at improving the user experience.

The smartphone industry is moving towards the 5G-era and Qualcomm being the dominant mobile chipset manufacturer, is leaving no stones unturned when it comes to 5G connectivity. The newly announced Qualcomm Snapdragon 855 is the world’s first commercial 5G mobile platform.

The chipset is offering 5G connectivity using the company’s own Snapdragon X50 5G modem. The 5G modem is combined with Qualcomm QTM052 mmWave antenna modules with integrated RF trans-receiver, RF front-end antenna, and antenna elements.

The octa-core processor features four power-saving cores clocked at 1.78GHz, three performance cores clocked at 2.42GHz and another special “gold” core for performance boost which is clocked at 2.84GHz. It is coupled with Adreno 640 graphics processor, which is expected to bring performance improvement.

Just like the Apple A12 Bionic chipset and Huawei’s Kirin 980 processor, the Qualcomm Snapdragon 855 is also manufactured using the 7nm process by TSMC. The Snapdragon 855 also comes with the company’s fourth-generation, multi-core AI Engine that is claimed to offer up to 3 times the AI performance compared to the Snapdragon 845.

The newly unveiled chipset also features the world’s first Computer Vision Image Signal Processor (CV-ISP) to deliver new photo and video capture features. For the gaming, the company unveiled Snapdragon Elite Gaming, a set of features in the mobile platform to enhance mobile gaming experiences.

The company has also announced the Qualcomm 3D Sonic Sensor—an under-display fingerprint sensor solution that uses ultrasonic waves, unlike optical under-display fingerprint sensors which use light. According to the company, 3D Sonic Sensor is more secure and accurate than the alternative.

Most of the high-end smartphone coming in 2019 will be powered by Qualcomm Snapdragon 855 octa-core chipset. We’ll be seeing devices from manufacturers such as Samsung, Xiaomi, LG, HTC, Motorola, Google, Sony, OnePlus, Oppo, and Vivo from early next year.

Read More: Qualcomm reveals Xiaomi, HMD, OnePlus, OPPO, Vivo are among its ‘committed’ 5G partners for 2019

Qualcomm will reveal more details about the Snapdragon 855 mobile platform as the Snapdragon Tech Summit 2018 continues in Hawaii, USA. Stay tuned for more updates throughout the Summit.

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Rumors were making rounds online suggesting that the Taiwan-based chipset maker MediaTek will soon launch the Helio P80 chipset after the launch of Helio P60 and Helio P70. However, the company recently revealed that it will soon launch the Helio P90 chipset, essentially confirming that it’s dropping the Helio P80 nomenclature.

Now, the latest report suggests that the MediaTek Helio P90 will be officially launched on 13th December at a launch event in Shenzhen, China. In conversation with 91Mobiles, MediaTek’s General Manager – Wireless Communication, TL Lee revealed that the upcoming flagship chipset will be unveiled at a launch event in China on December 13.

While the chipset will be announced in the first half of December, we don’t expect to see the commercial utilization of the Helio P90 anytime soon. TL Lee suggests that the devices powered by the Helio P90 SoC could make their way to the market in Q2 of 2019.

According to MediaTek, its upcoming Helio P90 flagship chipset “changes everything” and the “powerful” and “efficient” processor is also claimed to feature “groundbreaking AI”. Currently, nothing more is known related to the upcoming chipset.

Explaining the rationale behind skipping the Helio P80, Lee reveals that the reason the brand is choosing to skip the launch of P80 is to highlight that the P90 SoC is significantly better and not just an iterative upgrade of the recently-launched Helio P70.

Recently, details about the Helio P80 chipset had emerged online, suggested that it will be manufactured using TSMC’s 12nm process but the architecture will be upgraded and the AI performance will be greatly improved. It was speculated that the AI performance on Helio P80 could be even stronger than Huawei ‘s Kirin 980 processor despite being a mid-range chip.

Read More: Realme U1, the world’s first phone to be powered by MediaTek Helio P70 SoC launched in India, pricing starts at Rs. 11,999 ($170)

The claim related to the AI performance was further buttressed by the AI benchmark results which placed Helio P80 and Snapdragon 8150 above the Kirin 980. In addition, the Helio P80 processor was said to be the one used on OPPO’s R19 which is planned to launch next year.

(Source)

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Today, Samsung has officially unveiled its next-generation mobile chipset — Samsung Exynos 9820 in China carrying a tagline that reads “Extraordinary wisdom, born from the inside.”

The new chipset from Samsung is manufactured using 8nm LPP FinFET process, which the company says consumes 10 percent less power compared to the 10nm process. For comparison, Huawei‘s Kirin 980 and Apple‘s A12 Bionic chipsets are manufactured using the 7nm process.

Samsung Exynos 9820 has a tri-cluster architecture with the fourth generation custom designed CPU cores. It consists of two custom cores for processing power, two Cortex A75 large cores for optimal performance, and four Cortex A55 small cores for greater efficiency.

As per the company, compared to the Exynos 9810, the multi-core performance increased by 15 percent and single-core performance increased by 20 percent. The overall performance of this new chipset is 40 percent better than its predecessor, claims Samsung.

The chipset comes with the Mali-G76 MP12 graphics processor, which has more execution units and double channels. It is claimed to offer 40 percent better performance than the GPU in Exynos 9810 and is also said to be 35 percent more energy efficient. For comparison, the Kirin 980 chipset features Mali-G76 MP10 GPU.

For the first time, the Exynos 9-series chipset from Samsung comes with Neural Processing Unit (NPU) which is said to offer seven times artificial intelligence-based computing power compared to its predecessor.

Coming to the photography, the Exynos 9820 chipset has advanced ISP that supports up to five sensing elements, including infrared sensors for enabling facial recognition. For the front-facing camera, it supports camera sensor of up to 22MP and the same 22MP for the rear camera. It also supports dual-camera setup with a maximum of a 16MP camera sensor. For video recording, the chipset supports 8K 30fps and 4K 120fps and also supports 10bit HEVC/H.264/VP9 codec.

For the display, the chipset supports 4K resolution. As for connectivity, the new chipset from Samsung supports 4G LTE baseband with highest downlink Cat.20 8CA that supports peak speed of 2Gbps and uplink speed of up to 316Mbps. It also supports UFS 2.1/3.0 flash memory and there’s also a hardware-level PUF key management.

Read More: Fresh Samsung Galaxy S10 details: triple camera specs, Infinity-O notched display, One UI and more

The Samsung Exynos 9820 flagship chipset from the South Korean giant will be mass produced by the end of this year and is expected to be used in the company’s upcoming smartphone — Galaxy S10 — which could be unveiled in February next year during Mobile World Congress.

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Samsung, the South Korean based electronics giant, is currently in talks with several smartphone manufacturers, including China-based ZTE, to supply mobile processor chips. This was confirmed by a senior executive of Samsung.

With this move of supplying its mobile processors to other smartphone manufacturers, Samsung is now getting closer to direct competition with Qualcomm, which is currently dominating the mobile chipset segment.

In a statement, Samsung has mentioned that there is no certainty that deal with ZTE Corp will be reached and that it treats all of its vendors equally. According to Counterpoint, Samsung’s System LSI business saw a 27 percent rise in shipments last year.

Samsung generates a significant amount of profit from memory chips and the South Korean company has been beefing up development of logic chips, including mobile processors, images sensors as well as automotive chips in order to diversify its business.

The company has been using in-house developed Exynos mobile chipsets for its own flagship smartphones under its Galaxy lineup. However, as for the external customers of its mobile chipsets, it has only one client — Meizu, which is a China-based smartphone manufacturer.

Inyup Kang, who is the head of Samsung System LSI — a logic chip development unit, told in an interview that the company is talking with all original equipment manufacturers (OEMs) and is expecting to announce its new clients in the first half of 2019.

This move could give a sigh of relief to China-based ZTE Corp, which has been banned by the United States of America for seven years. As a part of the ban, none of the US-based companies can provide software or hardware components to ZTE Corp.

Recently, Taiwanese government also announced that Taiwan-based companies will have to take permission before supplying components to ZTE Corp. MediaTek, a mobile chipset manufacturer, complied with the new rules and has been granted permission to supply its chipsets to ZTE.

Read More: Galaxy S10 Could be Samsung’s First Phone with Under-Display Fingerprint Sensor

Apart from Samsung, Qualcomm is also facing tough competition from China-based Huawei, which also develops in-house mobile processors under HiSilicon branding for its own and its subsidiary Honor‘s smartphones.

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Last month, Xiaomi joined the small circle of phone manufacturers with in-house chips with the Surge S1 octa-core processor. The launch of the chip saw the number of Chinese phone manufacturers with its own SoC rise to two. However, rumor has it that Meizu might be the third musketeer.

It is said that Meizu is working with American company, Texas Instruments to develop its own chip. Texas Instruments itself is no longer involved in the business of mobile chip manufacturing. In September 2012, the company announced it was shutting down production of its OMAP processors designed for smartphones and tablets. Nevertheless, it still has vast experience in the field of chip design, and how to solve stability and heat management issues.

Meizu has not confirmed the news yet though but it may face some challenges ahead. It is said that part of the reasons why Texas Instruments withdrew from the mobile chip race was due to its inability to develop baseband technology that rivaled that of its competitors. Meizu will need to find a way to scale that hurdle though.

READ MORE: Meizu Might Be Working on Optical Fingerprint Technology Like Apple

Some are of the opinion that Meizu doesn’t need to develop its own chip seeing as it has settled with Qualcomm. But with the issues Mediatek is currently facing with the Helio X30′ production, it might have a good reason to do so.

(Source)

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Mobile processor from Qualcomm officially became the world’s most popular processor. The processor controls the market of smartphones and tablets with the reached 48 percent which has a value equivalent to 5 billion USD in the first half year period in 2012.

Compared with revenue last year, Qualcomm earn approximately 60 percent increase in revenue. It is quite encouraging, because some high end Android phones today use Qualcomm processor.

Of the many choices, MSM8960 Snapdragon processor series are often found at high-end cell phone, such as the Motorola RAZR M, RAZR MAXX HD, HTC One XL, HTC EVO 4G LTE, HTC 8X Windows Phone 8, Nokia Lumia 920 and Nokia Lumia 820.

This is a challenge for Intel which is new player on the market of mobile processors. Intel was recently introduced new Android phones that use proprietary processor through Motorola RAZR i.

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