Qualcomm S3 and S5 sound platforms have been announced by the company at Mobile World Congress. The launch of these new sound platforms marks the expansion of the Snapdragon Sound solution announced last year.

These new audio platforms from Qualcomm combine traditional Bluetooth and the new low-energy (LE) audio technology standard. The aim is to significantly improve audio quality when listening to music using wireless earbuds, headphones, and mobile devices.

The Bluetooth LE audio capabilities also enable broadcasting to an unlimited number of devices and sharing of audio streams in a secure environment. The newly announced audio chips use Qualcomm Snapdragon 8 mobile platforms, FastConnect 6900, and the new 7800 subsystems to “deliver the ultimate wireless sound experience.”

The company is also touting a 16-bit 44.1kHz lossless Bluetooth audio experience and 32kHz super wideband voice call quality. There’s also support for 68ms ultra-low latency gaming mode, which Qualcomm says is 25% lower than the previous generation. It has also integrated Adaptive Active Noise Cancellation in a dedicated hardware block.

Qualcomm says it will begin sampling the S5 Sound Platform (QCC517x) and S3 Sound Platforms (QCC307x) commercial versions to customers in the second half of 2022. Jabra, Xiaomi, and iQOO are the first companies to use these audio platforms in their products.

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