At the recent Snapdragon Summit, Qualcomm introduced its latest audio technology – the Qualcomm S7 and S7 Pro Gen 1 Sound platforms. These new chips aim to revolutionize the audio landscape for earbuds, headphones, and speakers, promising enhanced performance, power efficiency, and advanced connectivity.

These platforms bring a robust on-device AI, making them smarter than their predecessors. With six times more computing power and nearly 100 times more AI capacity, they promise better audio without draining your device’s battery.

The S7 Pro Sound platform introduces Qualcomm’s XPAN tech and micro-power Wi-Fi. Essentially, this new tech makes use of low-power Wi-Fi to extend the reach of Bluetooth earbuds, speakers, and headphones. It can detect how well a Bluetooth connection is working and smoothly switch over to Wi-Fi when you go beyond Bluetooth’s range. Qualcomm XPAN also offers high-quality audio at 48 kHz and 96 kHz without losing any quality. They also make sure there’s less delay when you’re watching or listening.

The S7 and S7 Pro Gen 1 Sound platforms make improvements in quick-response noise cancellation, support for multiple audio channels, and energy-efficient operation. For users, this means the best noise cancellation performance yet, especially in noisy places like offices or cafes. The noise cancellation adjusts automatically to stay effective even if the earbud shifts or the surrounding noise changes suddenly.

Qualcomm S7 & S7 Pro Gen 1 Sound Platform features

• All new platform architecture unlocks a new tier of performance,
maintaining ultra-low power performance
• Almost 100x more AI power than the Qualcomm S5 Gen 2 Sound
Platform
• 3x more memory than the Qualcomm S5 Gen 2 Sound Platform
• A step-change in DSP – 1.5 GHz total audio compute (50%+
improvement on previous S5 Gen 2 Sound Platform)
• Dedicated AI core to provide higher performance and lower power
for ML applications compared to using the DSP
• Dedicated cores for audio curation including hearing loss
compensation, ANC, transparency, and noise management
• Hi-Fi-grade stereo audio codec
• 4th Generation Qualcomm Adaptive Active Noise Cancellation
112 biQuad filters combined with fully programmable 3uSec low
latency DSP to enable personalized and responsive audio curation
• Bluetooth 5.4 radio and Bluetooth LE Audio experiences, including
Auracast Broadcast Audio
• USB High Speed PHY at 480 Mbps which unlocks enhanced Audio
Development workflows
• Non-invasive, low-level debug through use of Qualcomm USB-EUD
• Enhanced memory and peripheral data sharing across subsystems
for lower latency and higher throughputs
• DMIC, I2S, TDM, and Soundwire digital audio interfaces
• Fully integrated system including PMU, charger, mic bias, and
external supply support
• High-performance audio combined with low power consumption,
designed for Snapdragon Sound

Qualcomm S7 Pro Gen 1 Additional Features

• Support for Wi-Fi connectivity at micro-power
• Support for whole home and building coverage with
Qualcomm XPAN Technology
• Seamless transitions to Wi-Fi from Bluetooth
• Data rates of up to 29 Mpbs, supporting Snapdragon Sound and
delivering up to 24-bit 192 kHz lossless music streaming over Wi-Fi

In related news, Qualcomm has also unveiled its new Snapdragon 8 Gen 3 chip for upcoming flagship smartphones. You can read more about it by clicking the link.

RELATED:

• Qualcomm Snapdragon 8 Gen 3 chip officially unveiled: Here’s what’s new
• Qualcomm’s Snapdragon 8cx Gen 4 CPU catches up to Apple M2 in multi-core performance
• Nubia Z60 Ultra, Red Magic 9 series to feature Snapdragon 8 Gen 3
• OnePlus 12 is officially confirmed to feature Snapdragon 8 Gen 3
• Xiaomi to launch its first Blood Pressure Smartwatch with Class II medical device certification on Oct 26

(Source)

The post Qualcomm S7 & S7 Pro Gen 1 Sound Platforms unveiled for future audio products appeared first on Gizmochina.