We’ve recently come to know that Samsung is not the only OEM that’s digging holes in their displays, Huawei is very close off its heels. Samsung first showed off its Infinity-O panels at a conference in San Francisco last month, and since then other OEMs have also come out of the closet with the same design. The latest is Lenovo. The company recently certified a triple camera device at TENAA now called the Lenovo Z5s. According to a blogger from Weibo, the same handset will have an in-screen camera design.

The blogger shared a post of the alleged Lenovo Z5s handset revealing its front today. There’s no way to say if the handset is the Lenovo Z5s itself but a recent teaser of the same device leaves no doubts regarding the same. The only thing different between Lenovo and Huawei’s implementation is the positioning of the camera lens. Lenovo goes for a more symmetrical look while Huawei moves the sensor to a top left position to make it less distracting and noticeable.

As far as other specifications are concerned, the Lenovo Z5s dimensions are phone: 156.7 × 74.5 × 7.8mm as revealed by MIIT. The handset is expected to have a 6.3-inch display and a 3120mAh battery running ZUI based on Android. The triple camera is also pretty obvious but detailed specifications of the individual sensors are not known yet. The handset with model number Lenovo L78071 is also believed to be the very first handsets that will boast a Snapdragon 8150 SoC on board. However, this is more of speculation rather than official info. The handset is thought to be launching next month, possibly on 4 December which is when the next Qualcomm flagship mobile CPU will also debut at an event in Hawaii.

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Qualcomm is reportedly working on its new flagship chipset which is expected to be unveiled by the end of this year. The upcoming flagship chipset is the successor of the Snapdragon 845, is rumored to be called Snapdragon 8150 and not Snapdragon 855.

Now, ahead of the official announcement of the Snapdragon 8150, the chipset’s benchmark score has surfaced online through AnTuTu. The chipset has scored 362,292 points on AnTuTu, making it the first chipset running on Android platform to have crossed the benchmark of 360,000 points.

In comparison, the Huawei Mate 20 series devices running on Kirin 980 chipset managed to score an average of 311,840 points while the highest score so far for the Qualcomm Snapdragon 845-powered device is currently held by Xiaomi’s Black Shark Helo smartphone which scored 301,757 points.

Based on the results, it appears that the Snapdragon 8150 is providing 16 percent better performance compared to the Huawei‘s Kirin 980 and 20 percent better performance than its predecessor, the Snapdragon 845. The score of the Snapdragon 8150 could also increase after a bit of optimization by the manufacturers.

Recently, a Geekbech listing revealed that the chipset logged a score of 3,281 in the single-core test, and 11,023 in the multi-core test. These scores are higher than Snapdragon 845 that logged a score of 2,500 in single-core test and 8,900 in multi-core test.

The Qualcomm Snapdragon 8150 is expected to come with three-cluster CPU core design, similar to Kirin 980 and Exynos 9820. It will feature one large performance core running at a clock speed of 2.84GHz, three medium cores clocked at 2.4GHz, and four small efficiency cores clocked at 1.78GHz. It will pack Andreno 640 GPU that is claimed to offer 20 percent better performance compared to Adreno 630.

Read More: Qualcomm SM6150 and SM7150 mid-range processors are reportedly in development, details surface

The chipset is expected to be manufactured using the newest 7nm process by TSMC and the die size is going to be 12.4 x 12.4mm. While the chipset is expected to be announced next month, the devices running on Snapdragon 8150 are expected to be available from the first half of 2019. Meizu is expected to be among the first to launch device powered by SD8150 SoC.

(Source)

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