The REDMAGIC 7 is now all set to be released on February 17th and will be powered by the Snapdragon 8 Gen 1 processor. As customary, the specs of the device are being teased continually ahead of the launch, with the latest one now revealing bits about the device’s cooling system.

The gaming phone has been revealed to come with a built-in super large VC liquid cooling plate with an area of ​​up to 4124mm², which is 300% greater than the previous generation.

Super-large cooling plates are becoming the new norm now thanks to the latest flagship chips being super powerful but also quite demanding and hot. They’re especially important in gaming phones to help sustain longer gaming sessions.

Currently, the smartphone with the largest announced VC area is the upcoming Redmi K50 Gaming Edition with a cooling plate size reaching 4860mm². It is followed by the realme GT2 Pro which ranks second with its 4129mm² plate.

The cooling plate on the REDMAGIC 7 will be assisted by a built-in turbo cooling fan. The device’s rear cover is transparent so you should be able to see all of that fancy cooling tech in action. The back cover also houses a triple camera setup.

Upfront, there’s a 6.8-inch OLED screen that uses a 165Hz refresh rate. The battery is sized 5,000mAh and supports 135W fast charging.

The REDMAGIC 7 will be sold in green, black, and red and blue gradients. It measures 170.57×78.33×9.5mm and weighs 215g.

RELATED:

• RedMagic 7 will actually support a 135W fast charging technology
• Possible REDMAGIC 7 Pro 3C certified, reveals 165W fastest wired charger
• REDMAGIC 7 could be the first gaming phone with a true full-screen, bezel-less design
• RedMagic 7 series will have a model with under-display camera technology
• REDMAGIC 7 transparent design teased, key features revealed

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